Semiconductor structures using high-dielectric-constant materials and an adhesion layer

Claim 2

A semiconductor device formed outwardly from an outer surface of a semiconductor substrate, comprising: an active region disposed proximate the outer surface of the substrate; a conductive plug electrically connected to the active region; an interlevel isolation layer disposed adjacent the outer surface of the semiconductor substrate and surrounding the conductive plug; an inner electrode electrically coupled to the conductive plug and disposed proximate portions of an outer surface of the interlevel isolation layer; and an adhesion layer overlying the conductive plug and disposed between the interlevel isolation layer and the inner electrode, the adhesion layer comprising at least partially oxidized titanium and having a thickness in the range of 2 to 100 angstroms, the adhesion layer operating to cause adhesion between the material comprising the interlevel isolation layer and the material comprising the inner electrode.

Claim 3

The device of claim 1, wherein the interlevel isolation layer comprises a material selected from the group consisting of silicon dioxide, silicon nitride, boron phosphate silicate glass, and spin-on glass.

Claim 4

The device of claim 1, wherein the inner electrode comprises a material selected from the group consisting of platinum, ruthenium oxide, palladium, iridium, rhenium, rhodium, gold, silver, ruthenium oxide, tin oxide, indium oxide, rhenium oxide, osmium oxide, rhodium oxide, iridium oxide, doped tin oxide, indium oxide, zinc oxide, YBa 2 Cu 3 O 7-x , (La,Sr)CoO 3 , and SrRuO 3 .

Claim 5

The device of claim 1, and further comprising: a barrier layer disposed between the conductive plug and the adhesion layer, the barrier layer operating to separate the material comprising the inner electrode from the material comprising the conductive plug.

Claim 6

The device of claim 4, wherein the broiler layer comprises a material selected from the group of materials consisting of titanium nitride, Ta-Si-N, Ta-B-N, Ti-B-N, Zr nitride, Hf nitride, Y nitride, Sc nitride, La nitride, N deficient Al nitride, doped Al nitride, Mg nitride, Ca nitride, Sr nitride, Ba nitride, titanium nitride, gallium nitride, Ni nitride, Co nitride, Ta nitride, W nitride, Pt-Si-N, Pd-Si-O, Pd-B-(O,N), Pd-Al-N, Ru-Si-(O,N), Ir-Si-O, Re-Si-N, Rh-Al-O, Au-Si-N, and Ag-Si-N.

Claim 7

The device of claim 1, wherein the conductive plug comprises a material selected from the group of materials consisting of poly-crystalline silicon which has been doped to be rendered conductive, titanium nitride, titanium silicide, zirconium nitride, tantalum silicide, tungsten silicide, molybdenum silicide, nickel silicide, tantalum carbide, titanium boride, single-crystal silicon doped to be rendered conductive, germanium doped to be rendered conductive, tungsten, tantalum, titanium, aluminum molybdenum, boron carbide, gallium arsenide, and indium phosphide.

Claim 8

The device of claim 1, and further comprising: a high-dielectric-constant layer disposed outwardly from the inner electrode; an outer electrode disposed outwardly from the high-dielectric-constant layer; and the inner electrode and the outer electrode separated by the high-dielectric-constant layer.

Claim 9

The device of claim 7, wherein the high-dielectric-constant layer comprises a material selected from the group consisting of barium strontium titanate (Ba,Sr,Ca,Pb)(Ti,Zr)O 3 , (Pb,La)(Zr,Ti)O 3 , bismuth titanate, potassium tantalate, lead scandium tantalate, lead niobate, potassium niobate, lead zinc niobate, lead magnesium niobate, tantalum pentoxide, and yttrium oxide.

Claim 10

The device of claim 7, wherein the outer electrode comprises a material selected from the group consisting of platinum, palladium, ruthenium, rhodium, gold, iridium, silver, titanium nitride, ruthenium nitride, tin nitride, zirconium nitride, tungsten nitride, ruthenium dioxide, tin oxide, zinc oxide, doped zinc oxide, iridium oxide, titanium silicide, tantalum silicide, tungsten silicide, molybdenum silicide, nickel silicide, tantalum carbide, titanium boride, tantalum titanium molybdenum, tungsten, aluminum, doped silicon, and doped germanium.

Claim 11

A semiconductor device formed outwardly from an outer surface of a semiconductor substrate, comprising: an active region disposed proximate the outer surface of the substrate; a conductive plug electrically connected to the active region; an interlevel isolation layer disposed adjacent the outer surface of the semiconductor substrate and surrounding the conductive plug; an inner electrode electrically coupled to the conductive plug and disposed proximate portions of an outer surface of the interlevel isolation layer; an adhesion layer overlying the conductive plug and disposed between the interlevel isolation layer and the inner electrode, the adhesion layer comprising at least partially oxidized titanium and having a thickness in the range of 2 to 100 angstroms, the adhesion layer causing adhesion between the material comprising the interlevel isolation layer and the material comprising the inner electrode; a barrier layer disposed between the adhesion layer and the inner electrode, the barrier layer operating to separate the material contained in the inner electrode from the material contained in the conductive plug; and a sidewall isolation ting surrounding the barrier layer and separating the edges of the barrier layer from the inner electrode.

Claim 12

A semiconductor device formed outwardly from an outer surface of a semiconductor substrate, comprising: an active region disposed proximate the outer surface of the substrate; a conductive plug electrically connected to the active region; an interlevel isolation layer disposed adjacent the outer surface of the semiconductor substrate and surrounding the conductive plug; an inner electrode electrically coupled to the conductive plug and disposed proximate portions of an outer surface of the interlevel isolation layer; an adhesion layer overlying the conductive plug and disposed between the interlevel isolation layer and the inner electrode, the adhesion layer comprising at least partially oxidized titanium and having a thickness in the range of 2 to 100 angstroms, the adhesion layer causing adhesion between the material comprising the interlevel isolation layer and the material comprising the inner electrode; a barrier layer disposed between the adhesion layer and the inner electrode, the barrier layer operating to separate the material contained in the inner electrode from the material contained in the conductive plug; and a sidewall isolation ting surrounding the barrier layer and separating the edges of the barrier layer from the inner electrode.

Claim 13

The device of claim 10, wherein the sidewall isolation ring comprises: a material selected from the group consisting of silicon dioxide and silicon nitride.

Claim 14

The device of claim 10, wherein the interlevel isolation layer comprises a material selected from the group consisting of silicon dioxide, silicon nitride, boron phosphate silicate glass, and spin-on glass.

Claim 15

The device of claim 10, and further comprising: a high-dielectric-constant layer disposed outwardly from the inner electrode; an outer electrode disposed outwardly from the high-dielectric-constant layer; and the inner electrode and the outer electrode separated by the high-dielectric-constant layer.

Claim 16

The device of claim 13, wherein the high-dielectric-constant layer comprises a material selected from the group consisting of barium strontium titanate, (Ba,Sr,Ca,Pb)(Ti,Zr)O 3 , (Pb,La)(Zr,Ti)O 3 , bismuth titanate, potassium tantalate, lead scandium tantalate, lead niobate, potassium niobate, lead zinc niobate, lead magnesium niobate, tantalum pentoxide, and yttrium oxide.

Claim 17

The device of claim 13, wherein the outer electrode comprises a material selected from the group consisting of platinum, palladium, ruthenium, rhodium, gold, iridium, silver, titanium nitride, ruthenium nitride, tin nitride, zirconium nitride, tungsten nitride, ruthenium dioxide, tin oxide, zinc oxide, doped zinc oxide, iridium oxide, titanium silicide, tantalum silicide, tungsten silicide, molybdenum silicide, nickel silicide, tantalum carbide, titanium boride, tantalum titanium molybdenum, tungsten, aluminum, doped silicon, and doped germanium.

Claim 18

The electronic device of claim 10, wherein the sidewall isolation ring comprises: a material selected from the group consisting of silicon dioxide and silicon nitride.

Claim 19

The device of claim 1, wherein the adhesion layer forms a blanket coating over the conductive plug and the interlevel isolation layer.

Claim 20

The device of claim 1, wherein the adhesion layer comprises titanium dioxide.

Claim 21

The device of claim 18, wherein the adhesion layer forms a blanket coating over the conductive plug and the interlevel isolation layer.

Claim 22

A semiconductor device formed outwardly from an outer surface of a semiconductor substrate, comprising: an active region disposed proximate the outer surface of the substrate; a conductive plug electrically connected to the active region; an interlevel isolation layer disposed adjacent the outer surface of the semiconductor substrate and surrounding the conductive plug; an inner electrode electrically coupled to the conductive plug and disposed proximate portions of an outer surface of the interlevel isolation layer; and an adhesion layer overlying the conductive plug and disposed between the interlevel isolation layer and the inner electrode, the adhesion layer having a thickness in the range of 5 to 10 angstroms, the adhesion layer operating to cause adhesion between the material comprising the interlevel isolation layer and the material comprising the inner electrode.

Claim 23

A semiconductor device formed outwardly from an outer surface of a semiconductor substrate, comprising: an active region disposed proximate the outer surface of the substrate; a conductive plug electrically connected to the active region; an interlevel isolation layer disposed adjacent the outer surface of the semiconductor substrate and surrounding the conductive plug; an inner electrode electrically coupled to the conductive plug and disposed proximate portions of an outer surface of the interlevel isolation layer; and an adhesion layer overlying the conductive plug and disposed between the interlevel isolation layer and the inner electrode, the adhesion layer having a thickness in the range of 5 to 10 angstroms, the adhesion layer operating to cause adhesion between the material comprising the interlevel isolation layer and the material comprising the inner electrode.