Abstract An apparatus for releasably clamping a substrate to a support platform, or other support means, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.
A method of clamping a substrate to a platform in a processing chamber, comprising the steps of, positioning a substrate on a platform, translating a clamping mechanism to engage the substrate so that the substrate is securely held against said platform, processing the substrate while it is being held against the platform, translating the clamping mechanism away from the platform, using a wafer engaging surface to apply a separation force to said substrate if the substrate sticks to the clamping mechanism.
Claim 2
Independent Claim
81 words
A method of clamping a substrate to a platform in a processing chamber, comprising the steps of, positioning a substrate on a platform, translating a clamping mechanism to engage the substrate so that the substrate is securely held against said platform, processing the substrate while it is being held against the platform, translating the clamping mechanism away from the platform, using a wafer engaging surface to apply a separation force to said substrate if the substrate sticks to the clamping mechanism.
Claim 3
Dependent Claim
34 words
The method of claim 1 wherein said step of using a wafer engaging surface to apply a separation force to said substrate is performed only when the substrate is stuck to the clamping mechanism.
Claim 4
Dependent Claim
15 words
The method of claim 2 wherein said separation force is generated by a spring means.
Claim 5
Dependent Claim
16 words
The method of claim 2 wherein said wafer engaging surface is translated by an activation means.