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US5605592A
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Method of manufacturing a bus communication system for stacked high density integrated circuit packages
Assignee: Entorian Technologies Inc
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Filing: 1995-05-22
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Granted: 1997-02-25
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Expires: 2015-05-22
Abstract
Abstract The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.
Inventors
- 👤 Carmen D. Burns
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 19:41
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H05; H05K; H05K7/00; H05K7/02; H05K7/023; H10W90/00; H05K1/00; H05K1/18; H05K1/181; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W70/60; H10W90/20; H10W90/288; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
117 words
A method of manufacturing a rail-less high density integrated circuit module, comprising the steps of: (a) providing a plurality of integrated circuit packages, each having bifurcated leads wherein each said bifurcated lead comprises a pair of lead end fingers, wherein each bifurcated lead is split partially lengthwise to form a pair of adjacent lead end fingers, wherein one of said fingers extends upward and said other finger extends downward; (b) stacking said packages to provide alignment of said bifurcated leads; (c) electrically coupling bifurcations of selected leads from adjacent integrated circuit packages, wherein said bifurcations exert a spring force load on each other; and (d) applying a high temperature adhesive to bind said integrated circuit packages together.
Claim 2
Independent Claim
117 words
A method of manufacturing a rail-less high density integrated circuit module, comprising the steps of: (a) providing a plurality of integrated circuit packages, each having bifurcated leads wherein each said bifurcated lead comprises a pair of lead end fingers, wherein each bifurcated lead is split partially lengthwise to form a pair of adjacent lead end fingers, wherein one of said fingers extends upward and said other finger extends downward; (b) stacking said packages to provide alignment of said bifurcated leads; (c) electrically coupling bifurcations of selected leads from adjacent integrated circuit packages, wherein said bifurcations exert a spring force load on each other; and (d) applying a high temperature adhesive to bind said integrated circuit packages together.
Claim 3
Independent Claim
102 words
A method of manufacturing a rail-less high density integrated circuit module, comprising the steps of: (a) vertically stacking a plurality of integrated circuit packages having bifurcated leads extending from said integrated circuit packages so that leads from at least some adjacent integrated circuit packages are electrically connected by said leads exerting a spring force load on each other, wherein each bifurcated lead is split partially lengthwise to form a pair of adjacent lead end fingers, wherein one of said fingers extends upwards and said other finger extends downward; and (b) applying a thermosetting adhesive to said module to bind said module together.
Claim 4
Independent Claim
102 words
A method of manufacturing a rail-less high density integrated circuit module, comprising the steps of: (a) vertically stacking a plurality of integrated circuit packages having bifurcated leads extending from said integrated circuit packages so that leads from at least some adjacent integrated circuit packages are electrically connected by said leads exerting a spring force load on each other, wherein each bifurcated lead is split partially lengthwise to form a pair of adjacent lead end fingers, wherein one of said fingers extends upwards and said other finger extends downward; and (b) applying a thermosetting adhesive to said module to bind said module together.
Claim 5
Dependent Claim
13 words
The method of claim 2, further comprising the step of curing said adhesive.
Claim 6
Dependent Claim
15 words
The method of claim 3, further comprising the step of removing portions of said adhesive.
Claim 7
Independent Claim
74 words
A method of manufacturing a rail-less high density integrated circuit module, comprising the steps of: (a) providing a plurality of integrated circuit packages, each having trifurcated leads; (b) stacking said packages to provide alignment of said trifurcated leads; (c) electrically coupling trifurcations of leads from adjacent integrated circuit packages, wherein said trifurcations exert a spring force load on each other; and (d) applying a high temperature adhesive to bind said integrated circuit packages together.
Claim 8
Independent Claim
74 words
A method of manufacturing a rail-less high density integrated circuit module, comprising the steps of: (a) providing a plurality of integrated circuit packages, each having trifurcated leads; (b) stacking said packages to provide alignment of said trifurcated leads; (c) electrically coupling trifurcations of leads from adjacent integrated circuit packages, wherein said trifurcations exert a spring force load on each other; and (d) applying a high temperature adhesive to bind said integrated circuit packages together.
References Cited (Backward Citations)
US4961806A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-02-25 | 2000-08-26 | 2001-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-02-25 | 2004-08-26 | 2005-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-02-25 | 2008-08-26 | 2009-02-25 | $7700.00 | Window Closed / Lapsed |