Attenuated phase shift mask comprising phase shifting layer with parabolically shaped sidewalls

Claim 2

A process for fabricating an attenuated phase shift mask comprising a first layer having a transmission in the range of about 3 to 10% formed on a transparent substrate and a second layer comprising a transparent material having a thickness to provide a desired phase shift and formed on said first layer, said process comprising: (a) providing said transparent substrate; (b) forming said first layer on a surface of said transparent substrate; (c) forming said second layer on said first layer; (d) forming a masking layer on said second layer; (e) patterning and etching said masking layer to expose portions of said second layer; (f) etching through said exposed portions of said second layer with an isotropic wet etching process, thereby forming first openings which are defined by substantially parabolically-profiled walls and exposing portions of said first layer; (g) removing said masking layer; and (h) etching through said exposed portions of said first layer to form second openings.

Claim 3

The process of claim 1 wherein said first layer comprises a material selected from the group consisting of metals and metal oxides.

Claim 4

The process of claim 1 wherein said first layer comprises a material selected from the group consisting of chromium, molybdenum, polysilicon, silicon nitride, titanium oxide, and selenium oxide.

Claim 5

The process of claim 3 wherein said first layer consists essentially of chromium and is deposited to a thickness within the range of about 25 to 75 nm for an incident wavelength of 365 nm.

Claim 6

The process of claim 1 wherein said desired phase shift mask is 180°.

Claim 7

The process of claim 5 wherein said second layer comprises a material selected from the group consisting of oxides and polymers.

Claim 8

The process of claim 6 wherein said second layer consists essentially of silicon dioxide and has a thickness within the range of about 400 to 450 nm for an incident wavelength of 365 nm.

Claim 9

A process for fabricating an attenuated phase shift mask providing a phase shift of 180°, said attenuated phase shift mask comprising (a) a first layer formed on a transparent substrate, said first layer consisting essentially of chromium, having a transmission within the range of about 3 to 10%, and having a thickness within the range of about to 75 nm for incident light of 365 nm, and (b) a second layer formed on said chromium layer, said second layer consisting essentially of silicon dioxide and having a thickness within the range of about 400 to 450 nm for incident light of 365 nm, said process comprising: (a) providing said transparent substrate; (b) forming said chromium layer on a surface of said transparent substrate; (c) forming said silicon dioxide layer on said chromium layer; (d) forming a photoresist masking layer on said silicon dioxide layer; (e) patterning and etching said photoresist masking layer to expose portions of said silicon dioxide layer; (f) etching through said exposed portions of said silicon dioxide layer using an isotropic wet etching process, thereby forming first openings which are defined by substantially parabolically-profiled walls and exposing portions of said chromium layer; (g) removing said photoresist masking layer; and (h) etching through said exposed portions of said chromium layer to form second openings.

Claim 10

A process for fabricating an attenuated phase shift mask providing a phase shift of 180°, said attenuated phase shift mask comprising (a) a first layer formed on a transparent substrate, said first layer consisting essentially of chromium, having a transmission within the range of about 3 to 10%, and having a thickness within the range of about to 75 nm for incident light of 365 nm, and (b) a second layer formed on said chromium layer, said second layer consisting essentially of silicon dioxide and having a thickness within the range of about 400 to 450 nm for incident light of 365 nm, said process comprising: (a) providing said transparent substrate; (b) forming said chromium layer on a surface of said transparent substrate; (c) forming said silicon dioxide layer on said chromium layer; (d) forming a photoresist masking layer on said silicon dioxide layer; (e) patterning and etching said photoresist masking layer to expose portions of said silicon dioxide layer; (f) etching through said exposed portions of said silicon dioxide layer using an isotropic wet etching process, thereby forming first openings which are defined by substantially parabolically-profiled walls and exposing portions of said chromium layer; (g) removing said photoresist masking layer; and (h) etching through said exposed portions of said chromium layer to form second openings.