Laminate for insulation protection of circuit boards

Claim 2

A laminate for insulation protection of circuit boards, the laminate comprising a release sheet having provided on one side thereof, a photosensitive resin layer and a polyimide precursor resin layer, wherein, the photosensitive resin is an ultraviolet ray-reactive or electron beam-reactive photosensitive resin having a thickness of 2 to 100 μm, and the polyimide precursor resin is obtained by the reaction of: (A) a diamine compound or a diisocyanate obtained by reaction of a diamine compound with phosgene, with (B) a tetracarboxylic acid or trimellitic acid, or an acid anhydride, acid chloride or ester of a tetracarboxylic acid or trimellitic acid, and has a thickness of 2 to 300 μm, with the proviso that the laminate does not include a circuit board.

Claim 3

The laminate according to claim 1 wherein the polyimide precursor resin has a reduced viscosity of 0.3 to 2.0 dl/g.

Claim 4

The laminate according to claim 1 wherein the polyimide precursor resin has the repetition unit of the following formula (1) in such a polymeritation degree that its reduced viscosity becomes 0.3 to 2.0. ##STR4##

Claim 5

The laminate according to claim 1 wherein the polyimide precursor resin has the repetion unit of the following formula (2) in such a polymerization degree that its reduced viscosity becomes 0.3 to 2.0. ##STR5##

Claim 6

The laminate according to claim 1 wherein the polyimide precursor resin is such that a polyimide resin obtained by curing thereof has a coefficient of thermal expansion of 3×10 -5 /°C. or less.

Claim 7

The laminate according to claim 1 wherein the polyimide precursor resin is a polyimide precursor resin obtained by reaction of: a diamine selected from the group consisting of p-phenylenediamine; m-phenylenediamine; 2'-methoxy-4,4'-diaminobenzanilide; 4,4'-diaminodiphenyl ether; diaminotoluene; 4,4'-diaminodiphenylmethane; 3,3'-dimethyl-4,4'-diaminodiphenylmethane; 3,3'-dimethyl-4,4'-diaminodiphenylmethane; 2,2-bis[4-4(4-aminophenoxy)phenyl]propane; 1,2-bis(anilino)ethane; diaminodiphenylsulfone; diaminobenzanilide; diaminobenzoates; diaminodiphenyl sulfide; 2,2-bis(p-aminophenyl)propane; 2,2-bis(p-aminophenyl) hexafluoropropane; 1,5-diaminonaphthalene; diaminotoluene; diaminobenzotrifluoride; 1,4-bis(p-aminophenoxy)benzene; 4,4'-(p-aminophenoxy) biphenyl; diaminoanthraquinone; 4,4'-bis(3-aminophenoxyphenyl) diphenyl sulfone; 1,3-bis(anilino)hexafluoropropane; 1,4-bis(anilino)octafluoropropane; 1,5-bis(anilino)decafluoropropane; 1,7-bis(anilino)tetradecafluoropropane; diaminosiloxanes represented by the following formula: ##STR6## wherein R 2 , represents a divalent organic group, R 1 represents a monovalent organic group, and p represents an integer larger than 1,2,2-bis-[4-(p-aminophenoxy)phenyl]hexafluoropropane; 2,2-bis-[4-(3-aminophenoxy)phenyl]hexafluoropropane; 2,2-bis-[4-(2-aminophenoxy)phenyl]hexafluoropropane; 2,2- bis-[4-(4-aminophenoxy)-3,5-dimethylphenyl]hexafluoropropane; 2,2-bis-[4-(4-aminophenoxy)-3,5-ditrifluoromethylphenyl]hexafluoropropane; p-bis-(4-amino-2-trifluoromethylphenoxy)benzene; 4,4'-bis(4-amino-3-trifluoromethylphenoxy)biphenyl; 4,4'-bis(4-amino-2-trifluoromethylphenoxy)diphenyl sulfone; 4,4'-bis(4-amino-5-trifluoromethylphenoxy)diphenyl sulfone; 2,2-bis[4-(4-amino-3-trifluoromethylphenoxy)phenyl]hexafluoropropane; benzidine; 3,3'-methoxybenzidine; o-tolidine; m-tolidine; 2,2',5,5',6,6'-hexafluorotolidine; 4,4"-diaminoterphenyl; 4,4"'-diaminoquarterphenyl and a diisocyanate obtained by reaction of such a diamine with phosgene, with a tetracarboxylic acid or trimellitic acid, or an acid anhydrides, acid chloride or ester of a tetracarboxylic acid or trimellitic acid, wherein the tetracarboxylic acid is selected from the group consisting of pyromellitic acid; 3,3',4,4'-biphenyltetracarboxylic acid; 3,3',4,4'-benzophenonetetracarboxylic acid; 3,3',4,4'-diphenyl sulfone tetracarboxylic acid; 3,3',4,4'-diphenyl ether tetracarboxylic acid, 2,3,3',4'-benzophenonetetracarboxylic acid; 2,3,6,7-naphthalenetetracarboxylic acid; 1,2,5,6-naphthalenetetracarboxylic acid; 3,3'4,4'-diphenylmethanetetracarboxylic acid; 2,2-bis(3,4-dicarboxyphenyl)propane; 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane; 3,4,9,10-tetracarboxyperylene; 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane; 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]hexafluoropropane; butanetetracarboxylic acid and cyclopentane-tetracarboxylic acid.

Claim 8

The laminate according to claim 1, wherein the release sheet has thereon the photosensitive resin layer and said polyimide precursor resin layer in this order.

Claim 9

The laminate according to claim 1 wherein the release sheet has thereon said polyimide precursor resin layer and the photosensitive resin layer in this order.

Claim 10

A laminate for insulation protection of circuit boards, the laminate consisting essentially of a release sheet having provided on one side thereof, a photosensitive resin layer, a polyimide precursor resin layer, and optionally, as a top layer, another release sheet wherein, the photosensitive resin is an ultraviolet ray-reactive or electron beam-reactive photosensitive resin having a thickness of 2 to 100 μm, and the polyimide precursor resin is obtained by the reaction off (A) a diamine compound or a diisocyanate obtained by reaction of a diamine compound with phosgene, with (B) a tetracarboxylic acid or trimellitic acid, or an acid anhydride, acid chloride or ester of a tetracarboxylic acid or trimellitic acid, and has a thickness of 2 to 300 μm.

Claim 11

A laminate for insulation protection of circuit boards, the laminate consisting essentially of a release sheet having provided on one side thereof, a photosensitive resin layer, a polyimide precursor resin layer, and optionally, as a top layer, another release sheet wherein, the photosensitive resin is an ultraviolet ray-reactive or electron beam-reactive photosensitive resin having a thickness of 2 to 100 μm, and the polyimide precursor resin is obtained by the reaction off (A) a diamine compound or a diisocyanate obtained by reaction of a diamine compound with phosgene, with (B) a tetracarboxylic acid or trimellitic acid, or an acid anhydride, acid chloride or ester of a tetracarboxylic acid or trimellitic acid, and has a thickness of 2 to 300 μm.