Sealing structure for bumps on a semiconductor integrated circuit chip

Claim 2

A semiconductor integrated circuit chip to be bonded through bumps onto a circuit board, said chip having: a plurality of pads formed on said semiconductor integrated circuit chip, each of said pads being formed with a bump thereon; and a coating material being provided to coat at least surfaces of said a plurality of bumps, said material being made of an insulation material having a hardness sufficiently small for showing, when bonding said chip onto said circuit board, a deformation thereby at least a top portion of each of said bumps contacts pads provided on said circuit board.

Claim 3

The chip as claimed in claim 1, wherein said coating material comprises a gelatinous material having a coefficient of viscosity in the range from 1000 cP to 2000 cP.

Claim 4

The chip as claimed in claim 2, wherein said gelatinous material comprises a film within which said a plurality of bumps are embedded, said film being formed on an entire surface of said chip.

Claim 5

The chip as claimed in claim 3, wherein said gelatinous material comprises a silicone.

Claim 6

The chip as claimed in claim 1, wherein said coating material comprises a micro-capsule material.

Claim 7

The chip as claimed in claim 5, wherein said micro-capsule material comprises a film within which said a plurality of bumps are embedded, said film being formed on an entire surface of said chip.

Claim 8

The chip as claimed in claim 1, wherein said coating material comprises a creamy material having a coefficient of viscosity in the range from 1000 cP to 2000 cP.

Claim 9

The chip as claimed in claim 7, wherein said creamy material comprises a film within which said a plurality of bumps are embedded, said film being formed on an entire surface of said chip.

Claim 10

The chip as claimed in claim 8, wherein said creamy material comprises an epoxy resin dissolved in a solvent of alcohol systems.

Claim 11

The chip as claimed in claim 1, wherein said coating material comprises a thermoplastic resin which shows a coefficient of viscosity in the range from 1000 cP to 2000 cP except when said thermoplastic resin is cured.

Claim 12

The chip as claimed in claim 10, wherein said thermoplastic resin is in the form of a film within which said a plurality of bumps are embedded, said film being formed on an entire surface of said chip.

Claim 13

The chip as claimed in claim 10, wherein said thermoplastic resin is a resin of phenol systems.

Claim 14

A semiconductor integrated circuit chip to be bonded through bumps onto a circuit board, said chip having: a plurality of pads formed on said semiconductor integrated circuit chip, each of said pads being formed with a bump thereon; and an anisotropic conductive film being provided on said bumps so that said bumps provide contact through said anisotropic conductive film to pads of said circuit board, said anisotropic conductive film allowing a current in a direction vertical to a surface of said anisotropic conductive film but preventing any current along said surface of said anisotropic conductive film thereby said each bump is electrically conductive through said anisotropic conductive film to the corresponding pad on said circuit board but there is no conductivity among said pads as well as among said pads on said circuit board.

Claim 15

A semiconductor integrated circuit chip to be bonded through bumps onto a circuit board, said chip having: a plurality of pads formed on said semiconductor integrated circuit chip, each of said pads being formed with a bump thereon; and an anisotropic conductive film being provided on said bumps so that said bumps provide contact through said anisotropic conductive film to pads of said circuit board, said anisotropic conductive film allowing a current in a direction vertical to a surface of said anisotropic conductive film but preventing any current along said surface of said anisotropic conductive film thereby said each bump is electrically conductive through said anisotropic conductive film to the corresponding pad on said circuit board but there is no conductivity among said pads as well as among said pads on said circuit board.

Claim 16

The semiconductor integrated circuit chip as claimed in claim 13, wherein said anisotropic conductive film comprises an insulation sheet including a two-dimensional array of conductive particles therein, said insulation sheet having a sufficiently small hardness for allowing said insulating sheet to show a deformation when bonding said chip onto said circuit board thereby said conductive particles are made contact with both said pads formed on said chip and on said circuit board.

Claim 17

The semiconductor integrated circuit chip as claimed in claim 13, wherein said anisotropic conductive film comprises an insulation sheet including a two-dimensional array of column-shaped conductive materials exposed on opposite surfaces of the insulation sheet so that when bonding said chip onto said circuit board, then said column-shaped conductive materials provide contact with both said pads formed on said chip and on said circuit board.

Claim 18

A semiconductor integrated circuit chip to be bonded through bumps onto a circuit board, said chip having: a plurality of pads formed on said semiconductor integrated circuit chip; a layer made of an organic insulation material and formed on an entire surface of said chip, said organic insulation layer having a plurality of openings, each of said openings being positioned just over each of said pads to allow at least a part of said each pad to be exposed through each of said openings; a plurality of metal films, each of said metal films being selectively formed on an exposed part of said surface of said each pad and on a side, wall of said each opening as well as on a top surface of said organic insulation film in the vicinity of said each opening; a plurality of bumps formed just on said metal films so as to be electrically connected through said metal films to said pads; and a coating material being provided to coat at least surfaces of said a plurality of bumps, said material being made of an insulation material having a hardness sufficiently small for showing, when bonding said chip onto said circuit board, a deformation thereby at least a top portion of each of said bumps contacts pads provided on said circuit board.

Claim 19

A semiconductor integrated circuit chip to be bonded through bumps onto a circuit board, said chip having: a plurality of pads formed on said semiconductor integrated circuit chip; a layer made of an organic insulation material and formed on an entire surface of said chip, said organic insulation layer having a plurality of openings, each of said openings being positioned just over each of said pads to allow at least a part of said each pad to be exposed through each of said openings; a plurality of metal films, each of said metal films being selectively formed on an exposed part of said surface of said each pad and on a side, wall of said each opening as well as on a top surface of said organic insulation film in the vicinity of said each opening; a plurality of bumps formed just on said metal films so as to be electrically connected through said metal films to said pads; and a coating material being provided to coat at least surfaces of said a plurality of bumps, said material being made of an insulation material having a hardness sufficiently small for showing, when bonding said chip onto said circuit board, a deformation thereby at least a top portion of each of said bumps contacts pads provided on said circuit board.

Claim 20

The chip as claimed in claim 16, wherein said coating material comprises a gelatinous material having a coefficient of viscosity in the range from 1000 cP to 2000 cP.

Claim 21

The chip as claimed in claim 17, wherein said gelatinous material comprises a film within which said a plurality of bumps are embedded, said film being formed on an entire surface of said chip.

Claim 22

The chip as claimed in claim 18, wherein said gelatinous material comprises a silicone.

Claim 23

The chip as claimed in claim 16, wherein said coating material comprises a micro-capsule material.

Claim 24

The chip as claimed in claim 20, wherein said micro-capsule material comprises a film within which said a plurality of bumps are embedded, said film being formed on an entire surface of said chip.

Claim 25

The chip as claimed in claim 16, wherein said coating material comprises a creamy material having a coefficient of viscosity in the range from 1000 cP to 2000 cP.

Claim 26

The chip as claimed in claim 22, wherein said creamy material comprises a film within which said a plurality of bumps are embedded, said film being formed on an entire surface of said chip.

Claim 27

The chip as claimed in claim 22, wherein said creamy material comprises an epoxy resin dissolved in an alcohol system solvent.

Claim 28

The chip as claimed in claim 16, wherein said coating material comprises a thermoplastic resin which shows a coefficient of viscosity in the range from 1000 cP to 2000 cP except when said thermoplastic resin is cured.

Claim 29

The chip as claimed in claim 25, wherein said thermoplastic resin is in the form of a film within which said a plurality of bumps are embedded, said film being formed on an entire surface of said chip.

Claim 30

The chip as claimed in claim 25, wherein said thermoplastic resin is a resin of phenol systems.

Claim 31

A semiconductor integrated circuit chip to be bonded through bumps onto a circuit board, said chip having: a plurality of pads formed on said semiconductor integrated circuit chip; a layer made of an organic insulation material and formed on an entire surface of said chip, said organic insulation layer having a plurality of openings, each of said openings being positioned just over each of said pads to allow at least a part of said each pad to be exposed through each of said openings; a plurality of metal films, each of said metal films being selectively formed on an exposed part of said surface of said each pad and on a side wall of said each opening as well as on a top surface of said organic insulation film in the vicinity of said each opening; a plurality of bumps selectively formed just on said metal films so as to be electrically connected through said metal films to said pads, each of said bumps having a flat top; an insulation film formed on said organic insulation film except on said flat top of said bump, said insulation film having a thickness so adjusted that a top of the insulation film has almost the same level as said flat top of said bump; and an anisotropic conductive film being provided on said a plurality of bumps so that said bumps provide contact through said anisotropic conductive film to pads of said circuit board, said anisotropic conductive film allowing a current in a direction vertical to a surface of said anisotropic conductive film but preventing any current along said surface of said anisotropic conductive film thereby said each bump is electrically conductive through said anisotropic conductive film to the, corresponding pad on said circuit board but there is no conductivity among said bumps as well as among said pads on said circuit board.

Claim 32

A semiconductor integrated circuit chip to be bonded through bumps onto a circuit board, said chip having: a plurality of pads formed on said semiconductor integrated circuit chip; a layer made of an organic insulation material and formed on an entire surface of said chip, said organic insulation layer having a plurality of openings, each of said openings being positioned just over each of said pads to allow at least a part of said each pad to be exposed through each of said openings; a plurality of metal films, each of said metal films being selectively formed on an exposed part of said surface of said each pad and on a side wall of said each opening as well as on a top surface of said organic insulation film in the vicinity of said each opening; a plurality of bumps selectively formed just on said metal films so as to be electrically connected through said metal films to said pads, each of said bumps having a flat top; an insulation film formed on said organic insulation film except on said flat top of said bump, said insulation film having a thickness so adjusted that a top of the insulation film has almost the same level as said flat top of said bump; and an anisotropic conductive film being provided on said a plurality of bumps so that said bumps provide contact through said anisotropic conductive film to pads of said circuit board, said anisotropic conductive film allowing a current in a direction vertical to a surface of said anisotropic conductive film but preventing any current along said surface of said anisotropic conductive film thereby said each bump is electrically conductive through said anisotropic conductive film to the, corresponding pad on said circuit board but there is no conductivity among said bumps as well as among said pads on said circuit board.

Claim 33

The semiconductor integrated circuit chip as claimed in claim 28, wherein said anisotropic conductive film comprises an insulation sheet including a two-dimensional array of conductive particles therein, said insulation sheet having a sufficiently small hardness for allowing said insulating sheet to show a deformation when bonding said chip onto said circuit board thereby said conductive particles are made contact with both said pads formed on said chip and on said circuit board.

Claim 34

The semiconductor integrated circuit chip as claimed in claim 28, wherein said anisotropic conductive film comprises an insulation sheet including a two-dimensional array of column-shaped conductive materials exposed on opposite surfaces of the insulation sheet so that when bonding said chip onto said circuit board, then said column-shaped conductive materials are made contact with both said pads formed on said chip and on said circuit board.