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US5599747A
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US
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Method of making circuitized substrate
Assignee: International Business Machines Corp
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Filing: 1995-06-27
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Granted: 1997-02-04
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Expires: 2015-06-27
Abstract
Abstract A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed. This temporary support thus assures effective support for the photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps.
Inventors
- 👤 Ashwinkumar C. Bhatt
- 👤 Thomas P. Duffy
- 👤 David E. Houser
- 👤 Gerald W. Jones
- 👤 Jeffrey McKeveny
- 👤 Kenneth L. Potter
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 13:45
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/021; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W70/69; H10W70/695; H05K1/18; H05K1/182; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09127; H05K2201/09818; H05K2201/09981; H05K2203/00; H05K2203/04; H05K2203/049; H05K3/00; H05K3/0058; H05K3/0061; H10W70/682; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W74/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49155
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
131 words
A method of making a circuitized substrate, said method comprising the steps of: providing an electrically insulative base member having first and second opposing surfaces; removing preselected portions of said base member to form at least one slot extending entirely through said base member and defining a temporary support portion within said insulative base member; applying photoimaging material onto said first opposing surface of said base member, including over said temporary support portion and said slot extending through said base member; exposing and developing selected portions of said photoimaging material to define a pattern within said photoimaging material; circuitizing said first surface of said base member; and removing additional portions of said base member to thereby remove said temporary support portion and define an opening extending entirely through said base member.
Claim 2
Independent Claim
131 words
A method of making a circuitized substrate, said method comprising the steps of: providing an electrically insulative base member having first and second opposing surfaces; removing preselected portions of said base member to form at least one slot extending entirely through said base member and defining a temporary support portion within said insulative base member; applying photoimaging material onto said first opposing surface of said base member, including over said temporary support portion and said slot extending through said base member; exposing and developing selected portions of said photoimaging material to define a pattern within said photoimaging material; circuitizing said first surface of said base member; and removing additional portions of said base member to thereby remove said temporary support portion and define an opening extending entirely through said base member.
Claim 3
Dependent Claim
19 words
The method of claim 1 wherein said preselected portions of said base member are removed using a routing process.
Claim 4
Dependent Claim
22 words
The method of claim 2 wherein said removing of said additional portions of said base member is accomplished using a routing process.
Claim 5
Dependent Claim
27 words
The method of claim 1 further including the step of metallizing said first opposing surface of said base member prior to said applying of said photoimaging material.
Claim 6
Dependent Claim
22 words
The method of claim 1 wherein said circuitizing of said first surface of said base member is accomplished using a plating process.
Claim 7
Dependent Claim
14 words
The method of claim 5 wherein said plating process is an additive plating process.
Claim 8
Dependent Claim
23 words
The method of claim 1 wherein said exposing and developing said selected portions of said photoimaging material is accomplished using a masking process.
Claim 9
Dependent Claim
27 words
The method of claim 1 wherein said photoimaging material is applied onto said first opposing surface of said base member and over said slot in sheetlike form.
Claim 10
Dependent Claim
30 words
The method of claim 1 further including the step of applying precious metal material onto selected regions of said circuitized first surface of said base member after said circuitizing step.
Claim 11
Dependent Claim
23 words
The method of claim 1 further including securing a heat sinking and/or stiffener member to said base member along said second opposing surface.
Claim 12
Dependent Claim
20 words
The method of claim 10 wherein said securing of said heat sinking and/or stiffener member is accomplished using an adhesive.
Claim 13
Dependent Claim
23 words
The method of claim 10 further including the step of positioning an integrated circuit member within said opening extending through said base member.
Claim 14
Dependent Claim
19 words
The method of claim 12 further including positioning said integrated circuit member on said heat sinking and/or stiffener member.
Claim 15
Dependent Claim
34 words
The method of claim 12 further including the step of electrically coupling said integrated circuit member to the circuitry formed as a result of said circuitizing of said first surface of said base member.
Claim 16
Dependent Claim
16 words
The method of claim 14 wherein said electrical coupling is accomplished using a wire bonding process.
References Cited (Backward Citations)
US4773955A
Cited
US5048179A
Cited
US5175060A
Cited
US5102829A
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US5285352A
Cited
US5397917A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-02-04 | 2000-08-05 | 2001-02-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-02-04 | 2004-08-05 | 2005-02-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-02-04 | 2008-08-05 | 2009-02-04 | $7700.00 | Window Closed / Lapsed |