Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
208 words
A method for producing a nonvolatile semiconductor memory device comprising the steps of: forming a field insulating film on an isolation region on a semiconductor substrate and forming a tunneling oxide film on an active region; depositing a silicon film on the semiconductor substrate; forming stripe-shaped silicon portions including a plurality of first portions to be used as a plurality of floating gates and a plurality of second portions interposed between two adjacent portions of the plurality of first portions by patterning the silicon film; forming an insulating film so as to cover at least the stripe-shaped silicon portions; forming a conductive film so as to cover the insulating film; forming a control gate so as to cover the plurality of first portions of the stripe-shaped silicon portions by patterning the conductive film; converting the plurality of second portions of the stripe-shaped silicon portions into a silicon oxide film, and forming the plurality of floating gates from the plurality of first portions by thermally oxidizing the plurality of second portions; and implanting impurity ions through the silicon oxide film into the active region on the semiconductor substrate by using the control gate as a mask, thereby forming a source region and a drain region in the active region.
Claim 2
Independent Claim
208 words
A method for producing a nonvolatile semiconductor memory device comprising the steps of: forming a field insulating film on an isolation region on a semiconductor substrate and forming a tunneling oxide film on an active region; depositing a silicon film on the semiconductor substrate; forming stripe-shaped silicon portions including a plurality of first portions to be used as a plurality of floating gates and a plurality of second portions interposed between two adjacent portions of the plurality of first portions by patterning the silicon film; forming an insulating film so as to cover at least the stripe-shaped silicon portions; forming a conductive film so as to cover the insulating film; forming a control gate so as to cover the plurality of first portions of the stripe-shaped silicon portions by patterning the conductive film; converting the plurality of second portions of the stripe-shaped silicon portions into a silicon oxide film, and forming the plurality of floating gates from the plurality of first portions by thermally oxidizing the plurality of second portions; and implanting impurity ions through the silicon oxide film into the active region on the semiconductor substrate by using the control gate as a mask, thereby forming a source region and a drain region in the active region.
Claim 3
Dependent Claim
38 words
A method for producing a nonvolatile semiconductor memory device according to claim 1, wherein the silicon film is in an amorphous state immediately after the silicon film is deposited, and then crystallized by performing a subsequent annealing process.
Claim 4
Dependent Claim
39 words
A method for producing a nonvolatile semiconductor memory device according to claim 1, wherein a thickness of the silicon film ie set to be in a range of 10 to 20 nm immediately after the silicon film is deposited.
Claim 5
Dependent Claim
21 words
A method for producing a nonvolatile semiconductor memory device according to claim 1, wherein the conductive film has a polycide structure.
Claim 6
Dependent Claim
28 words
A method for producing a nonvolatile semiconductor memory device according to claim 1, wherein the stripe-shaped silicon portions are formed so as to completely cover the active region.
Claim 7
Independent Claim
35 words
A method for producing a nonvolatile semiconductor memory device according to claim i, wherein the insulating film is an ONO film constituted by a first oxide film, a nitride film and a second oxide film.
Claim 8
Dependent Claim
59 words
A method for producing a nonvolatile semiconductor memory device according to claim 6, wherein the step of forming the control gate comprises a step of continuously etching the conductive film and the insulating film, thereby removing at least a portion of the insulating film located over upper surfaces of the plurality of second portions of the stripe-shaped silicon portions.
Claim 9
Independent Claim
243 words
A method for producing a nonvolatile semiconductor memory device comprising the steps of: forming a field insulating film on an isolation region on a semiconductor substrate and forming a tunneling oxide film on active regions, each of the active regions extending in a first direction; depositing a silicon film on the semiconductor substrate; forming stripe-shaped silicon portions including a plurality of first portions to be used as a plurality of floating gates and a plurality of second portions interposed between two adjacent portions of the plurality of first portions by patterning the silicon film, the stripe-shaped silicon portions covering the active regions; forming an insulating film so as to cover at least the stripe-shaped silicon portions; forming a conductive film so as to cover the insulating film; forming a plurality of control gates so as to cover the plurality of first portions of the stripe-shaped silicon portions by patterning the conductive film, the control gates extending in a second direction which is perpendicular with the first direction; converting the plurality of second portions of the stripe-shaped silicon portions into silicon oxides, and forming the plurality of floating gates from the plurality of first portions by thermally oxidizing the plurality of second portions; and implanting impurity ions through the silicon oxides into the active regions on the semiconductor substrate by using each of the control gates as a mask, thereby forming a source region and a drain region in each of the active regions.
Claim 10
Independent Claim
243 words
A method for producing a nonvolatile semiconductor memory device comprising the steps of: forming a field insulating film on an isolation region on a semiconductor substrate and forming a tunneling oxide film on active regions, each of the active regions extending in a first direction; depositing a silicon film on the semiconductor substrate; forming stripe-shaped silicon portions including a plurality of first portions to be used as a plurality of floating gates and a plurality of second portions interposed between two adjacent portions of the plurality of first portions by patterning the silicon film, the stripe-shaped silicon portions covering the active regions; forming an insulating film so as to cover at least the stripe-shaped silicon portions; forming a conductive film so as to cover the insulating film; forming a plurality of control gates so as to cover the plurality of first portions of the stripe-shaped silicon portions by patterning the conductive film, the control gates extending in a second direction which is perpendicular with the first direction; converting the plurality of second portions of the stripe-shaped silicon portions into silicon oxides, and forming the plurality of floating gates from the plurality of first portions by thermally oxidizing the plurality of second portions; and implanting impurity ions through the silicon oxides into the active regions on the semiconductor substrate by using each of the control gates as a mask, thereby forming a source region and a drain region in each of the active regions.
Claim 11
Dependent Claim
50 words
A method for producing a nonvolatile semiconductor memory device according to claim 1, wherein the step of depositing a silicon film includes depositing an amorphous silicon film with a thickness of about 10 to 20 nm and heat treating the deposited amorphous silicon film to produce a crystallized silicon film.