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US5599727A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for producing a floating gate memory device including implanting ions through an oxidized portion of the silicon film from which the floating gate is formed

Assignee: Sharp Corp
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Filing: 1995-06-01
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Granted: 1997-02-04
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Expires: 2015-06-01
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Abstract

Abstract According to the present invention, a method for producing a nonvolatile semiconductor memory device is provided. The method includes the steps of: forming stripe-shaped silicon portions including a plurality of first portions to be used as a plurality of floating gates and a plurality of second portions interposed between two adjacent portions of the plurality of first portions by patterning a silicon film; forming a conductive film so as to cover an insulating film; forming a control gate so as to cover the plurality of first portions of the stripe-shaped silicon portions by patterning the conductive film; converting the plurality of second portions of the stripe-shaped silicon portions into a silicon oxide film, and forming the plurality of floating gates from the plurality of first portions by thermally oxidizing the plurality of second portions; and implanting impurity ions through the silicon oxide film into the active region on the semiconductor substrate by using the control gate as a mask, thereby forming a source region and a drain region in the active region.

Inventors

  • 👤 Kenji Hakozaki
  • 👤 Shin-ichi Sato

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 00:43
CPC Classifications
H; H10; H10B; H10B41/00

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 208 words
A method for producing a nonvolatile semiconductor memory device comprising the steps of: forming a field insulating film on an isolation region on a semiconductor substrate and forming a tunneling oxide film on an active region; depositing a silicon film on the semiconductor substrate; forming stripe-shaped silicon portions including a plurality of first portions to be used as a plurality of floating gates and a plurality of second portions interposed between two adjacent portions of the plurality of first portions by patterning the silicon film; forming an insulating film so as to cover at least the stripe-shaped silicon portions; forming a conductive film so as to cover the insulating film; forming a control gate so as to cover the plurality of first portions of the stripe-shaped silicon portions by patterning the conductive film; converting the plurality of second portions of the stripe-shaped silicon portions into a silicon oxide film, and forming the plurality of floating gates from the plurality of first portions by thermally oxidizing the plurality of second portions; and implanting impurity ions through the silicon oxide film into the active region on the semiconductor substrate by using the control gate as a mask, thereby forming a source region and a drain region in the active region.
Claim 2
Independent Claim 208 words
A method for producing a nonvolatile semiconductor memory device comprising the steps of: forming a field insulating film on an isolation region on a semiconductor substrate and forming a tunneling oxide film on an active region; depositing a silicon film on the semiconductor substrate; forming stripe-shaped silicon portions including a plurality of first portions to be used as a plurality of floating gates and a plurality of second portions interposed between two adjacent portions of the plurality of first portions by patterning the silicon film; forming an insulating film so as to cover at least the stripe-shaped silicon portions; forming a conductive film so as to cover the insulating film; forming a control gate so as to cover the plurality of first portions of the stripe-shaped silicon portions by patterning the conductive film; converting the plurality of second portions of the stripe-shaped silicon portions into a silicon oxide film, and forming the plurality of floating gates from the plurality of first portions by thermally oxidizing the plurality of second portions; and implanting impurity ions through the silicon oxide film into the active region on the semiconductor substrate by using the control gate as a mask, thereby forming a source region and a drain region in the active region.
Claim 3
Dependent Claim 38 words
A method for producing a nonvolatile semiconductor memory device according to claim 1, wherein the silicon film is in an amorphous state immediately after the silicon film is deposited, and then crystallized by performing a subsequent annealing process.
Claim 4
Dependent Claim 39 words
A method for producing a nonvolatile semiconductor memory device according to claim 1, wherein a thickness of the silicon film ie set to be in a range of 10 to 20 nm immediately after the silicon film is deposited.
Claim 5
Dependent Claim 21 words
A method for producing a nonvolatile semiconductor memory device according to claim 1, wherein the conductive film has a polycide structure.
Claim 6
Dependent Claim 28 words
A method for producing a nonvolatile semiconductor memory device according to claim 1, wherein the stripe-shaped silicon portions are formed so as to completely cover the active region.
Claim 7
Independent Claim 35 words
A method for producing a nonvolatile semiconductor memory device according to claim i, wherein the insulating film is an ONO film constituted by a first oxide film, a nitride film and a second oxide film.
Claim 8
Dependent Claim 59 words
A method for producing a nonvolatile semiconductor memory device according to claim 6, wherein the step of forming the control gate comprises a step of continuously etching the conductive film and the insulating film, thereby removing at least a portion of the insulating film located over upper surfaces of the plurality of second portions of the stripe-shaped silicon portions.
Claim 9
Independent Claim 243 words
A method for producing a nonvolatile semiconductor memory device comprising the steps of: forming a field insulating film on an isolation region on a semiconductor substrate and forming a tunneling oxide film on active regions, each of the active regions extending in a first direction; depositing a silicon film on the semiconductor substrate; forming stripe-shaped silicon portions including a plurality of first portions to be used as a plurality of floating gates and a plurality of second portions interposed between two adjacent portions of the plurality of first portions by patterning the silicon film, the stripe-shaped silicon portions covering the active regions; forming an insulating film so as to cover at least the stripe-shaped silicon portions; forming a conductive film so as to cover the insulating film; forming a plurality of control gates so as to cover the plurality of first portions of the stripe-shaped silicon portions by patterning the conductive film, the control gates extending in a second direction which is perpendicular with the first direction; converting the plurality of second portions of the stripe-shaped silicon portions into silicon oxides, and forming the plurality of floating gates from the plurality of first portions by thermally oxidizing the plurality of second portions; and implanting impurity ions through the silicon oxides into the active regions on the semiconductor substrate by using each of the control gates as a mask, thereby forming a source region and a drain region in each of the active regions.
Claim 10
Independent Claim 243 words
A method for producing a nonvolatile semiconductor memory device comprising the steps of: forming a field insulating film on an isolation region on a semiconductor substrate and forming a tunneling oxide film on active regions, each of the active regions extending in a first direction; depositing a silicon film on the semiconductor substrate; forming stripe-shaped silicon portions including a plurality of first portions to be used as a plurality of floating gates and a plurality of second portions interposed between two adjacent portions of the plurality of first portions by patterning the silicon film, the stripe-shaped silicon portions covering the active regions; forming an insulating film so as to cover at least the stripe-shaped silicon portions; forming a conductive film so as to cover the insulating film; forming a plurality of control gates so as to cover the plurality of first portions of the stripe-shaped silicon portions by patterning the conductive film, the control gates extending in a second direction which is perpendicular with the first direction; converting the plurality of second portions of the stripe-shaped silicon portions into silicon oxides, and forming the plurality of floating gates from the plurality of first portions by thermally oxidizing the plurality of second portions; and implanting impurity ions through the silicon oxides into the active regions on the semiconductor substrate by using each of the control gates as a mask, thereby forming a source region and a drain region in each of the active regions.
Claim 11
Dependent Claim 50 words
A method for producing a nonvolatile semiconductor memory device according to claim 1, wherein the step of depositing a silicon film includes depositing an amorphous silicon film with a thickness of about 10 to 20 nm and heat treating the deposited amorphous silicon film to produce a crystallized silicon film.

References Cited (Backward Citations)

JPS54137983A Cited
JPS6413771A Cited
JPH01129465A Cited
JPH0231467A Cited
US5029130A Cited
US5045488A Cited
US5067108A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2000-02-04 2000-08-05 2001-02-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2004-02-04 2004-08-05 2005-02-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2008-02-04 2008-08-05 2009-02-04 $7700.00 Window Closed / Lapsed

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