US5594280A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming a thin film and apparatus of forming a metal thin film utilizing temperature controlling means
Assignee: Canon Anelva Corp
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Filing: 1993-01-27
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Granted: 1997-01-14
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Expires: 2013-01-27
Abstract
Abstract In an electronic device, an interconnect utilizes a flat substrate and a layer bonded to the substrate. The layer may have a through hole formed therein or be formed from parallel spaced layers. An aluminum or aluminum alloy film having single crystallinity is deposited within the through hole or void step created between parallel spaced layers.
Inventors
- 👤 Atsushi Sekiguchi
- 👤 Tsukasa Kobayashi
- 👤 Shinji Takagi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:26
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/455; C23C16/45563; C23C16/4557; C23C16/06; C23C16/18; C23C16/20; C23C16/448; C23C16/452; C23C16/45565; H; H10; H10P; H10P14/00; H10P14/40; H10P14/42; H10P14/43; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
78 words
In an electronic device, an interconnecting material comprising: a flat substrate; an insulative layer bonded on a first surface thereof to the substrate, the insulative layer including step-down voids formed therein, exposing the substrate; an aluminum film, having a single crystal layer and bonded to a second surface of the insulative layer; the aluminum film deposited in the voids and integrally extending above the voids; wherein mixture of carbon into the film is less than about 20 ppm.
Claim 2
Dependent Claim
78 words
In an electronic device, an interconnecting material comprising: a flat substrate; an insulative layer bonded on a first surface thereof to the substrate, the insulative layer including step-down voids formed therein, exposing the substrate; an aluminum film, having a single crystal layer and bonded to a second surface of the insulative layer; the aluminum film deposited in the voids and integrally extending above the voids; wherein mixture of carbon into the film is less than about 20 ppm.
Claim 3
Dependent Claim
77 words
In an electronic device, an interconnecting material comprising: a flat substrate; an insulative layer bonded on a first surface thereof to the substrate, the insulative layer including step-down voids formed therein, exposing the substrate; an aluminum film, having a single crystal layer and bonded to a second surface of the insulative layer; the aluminum film deposited in the voids and integrally extending above the voids; wherein the surface reflectivity of the aluminum film is more than 95%.
Claim 4
Dependent Claim
77 words
In an electronic device, an interconnecting material comprising: a flat substrate; an insulative layer bonded on a first surface thereof to the substrate, the insulative layer including step-down voids formed therein, exposing the substrate; an aluminum film, having a single crystal layer and bonded to a second surface of the insulative layer; the aluminum film deposited in the voids and integrally extending above the voids; wherein the surface reflectivity of the aluminum film is more than 95%.
Claim 5
Dependent Claim
80 words
In an electronic device, an interconnecting material comprising: a flat substrate; an insulative layer bonded on a first surface thereof to the substrate, the insulative layer including step-down voids formed therein, exposing the substrate; an aluminum alloy film, having a single crystal layer and bonded to a second surface of the insulative layer; the aluminum alloy film deposited in the voids and integrally extending above the voids; wherein mixture of carbon into the film is less than about 20 ppm.
Claim 6
Dependent Claim
80 words
In an electronic device, an interconnecting material comprising: a flat substrate; an insulative layer bonded on a first surface thereof to the substrate, the insulative layer including step-down voids formed therein, exposing the substrate; an aluminum alloy film, having a single crystal layer and bonded to a second surface of the insulative layer; the aluminum alloy film deposited in the voids and integrally extending above the voids; wherein mixture of carbon into the film is less than about 20 ppm.
Claim 7
Dependent Claim
80 words
In an electronic device, an interconnecting material comprising: a flat substrate; an insulative layer bonded on a first surface thereof to the substrate, the insulative layer including step-down voids formed therein, exposing the substrate; an aluminum alloy film, having a single crystal layer and bonded to a second surface of the insulative layer; the aluminum alloy film deposited in the voids and integrally extending above the voids; wherein the surface reflectivity of the aluminum alloy film is more than 95%.
Claim 8
Dependent Claim
80 words
In an electronic device, an interconnecting material comprising: a flat substrate; an insulative layer bonded on a first surface thereof to the substrate, the insulative layer including step-down voids formed therein, exposing the substrate; an aluminum alloy film, having a single crystal layer and bonded to a second surface of the insulative layer; the aluminum alloy film deposited in the voids and integrally extending above the voids; wherein the surface reflectivity of the aluminum alloy film is more than 95%.
Claim 9
Dependent Claim
23 words
An electronic device set forth in claim 2 and further wherein the reflectivity is measured by light wavelength within 200 to 800 nm.
Claim 10
Dependent Claim
22 words
The device set forth in claim 4 and further wherein the reflectivity is measured by light wavelength within 200 to 800 nm.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-01-14 | 2000-07-15 | 2001-01-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-01-14 | 2004-07-15 | 2005-01-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-01-14 | 2008-07-15 | 2009-01-14 | $7700.00 | Window Closed / Lapsed |