Lead frame for use in a semiconductor device and method of manufacturing the semiconductor device using the same

Claim 2

A lead frame, comprising: a rectangular semiconductor chip placing portion for receiving a semiconductor chip thereon; a first suspension lead, one end of which is connected to a first corner of said semiconductor chip placing portion; a second suspension lead, one end of which is connected to a second corner of said semiconductor chip placing portion, said second corner being located diagonally across said chip placing portion with respect to said first corner; a frame portion surrounding said semiconductor chip placing portion, wherein an opposite end of said first suspension lead and an opposite end of said second suspension lead are each connected to said frame portion to support said semiconductor chip placing portion via said first suspension lead and said second suspension lead; a plurality of lead members extending from said frame portion toward said semiconductor chip placing portion, wherein inner ends of said lead members define a rectangle and, a diagonal of said rectangle and a diagonal of said semiconductor chip placing portion overlap each other, said lead frame being utilized in a process for manufacturing a plastic package type semiconductor device in which process a semiconductor chip is mounted on said semiconductor chip placing portion, said lead frame being sandwiched by a pair of mold members defining a cavity, a mold resin gate for injecting molten plastic into a cavity formed between said mold members, said gate being located on one of said mold members at a position corresponding to said first suspension lead; and two overhanging portions attached to an outer periphery of said semiconductor chip placing portion at two sides adjacent to said second corner, each of said overhanging portions extending toward said inner ends of said lead members so as to have a constant width along each of said sides.

Claim 3

A lead frame as set forth in claim 1, wherein a distance between an outer periphery of said overhanging portions and said inner ends of said lead members is less than a distance between said sides adjacent to said second corner and said inner ends of said lead members.

Claim 4

A lead frame as set forth in claim 1 further comprising a mark for indicating a boundary between said semiconductor chip placing portion and said overhanging portions.

Claim 5

A lead frame as set forth in claim 1, wherein said semiconductor chip placing portion and said overhanging portions form an island portion, and a center of said island portion is shifted from a center of said rectangle toward said second corner.

Claim 6

A lead frame, comprising: a rectangular semiconductor chip placing portion for receiving a semiconductor chip thereon; a first suspension lead, one end of which is connected to a first corner of said semiconductor chip placing portion; a second suspension lead, one end of which is connected to a second corner of said semiconductor chip placing portion, said first and second corners being diagonally opposite each other across said semiconductor chip placing portion; a frame portion surrounding said semiconductor chip placing portion, wherein an opposite end of said first suspension lead and an opposite end of said second suspension lead are each connected to said frame portion to support said semiconductor chip placing portion via said first suspension lead and said second suspension lead; a plurality of lead members extending from said frame portion toward said semiconductor chip placing portion, wherein inner ends of said lead members define a rectangle and, a diagonal of said rectangle and a diagonal of said semiconductor chip placing portion overlap each other, said lead frame being utilized in a process for manufacturing a plastic package type semiconductor device in which process a semiconductor chip is mounted on said semiconductor chip placing portion, said lead frame being sandwiched by a pair of mold members defining a cavity, a gate for injecting molten resin into said cavity mold members at a position corresponding to said first suspension lead; two first overhanging portions attached to an outer periphery of said semiconductor chip placing portion at two first sides adjacent to said first corner, each of said first overhanging portions extending toward said inner ends of said lead members so that a width along each of said first sides gradually increases in a direction going away from said first corner; and two second overhanging portions attached to an outer periphery of said semiconductor chip placing portion at two second sides adjacent to said second corner, each of said second overhanging portions extending toward said inner ends of said lead members so that a width along each of said second sides gradually decreases in a direction going away from said second corner.

Claim 7

A lead frame, comprising: a rectangular semiconductor chip placing portion for receiving a semiconductor chip thereon; a first suspension lead, one end of which is connected to a first corner of said semiconductor chip placing portion; a second suspension lead, one end of which is connected to a second corner of said semiconductor chip placing portion, said first and second corners being diagonally opposite each other across said semiconductor chip placing portion; a frame portion surrounding said semiconductor chip placing portion, wherein an opposite end of said first suspension lead and an opposite end of said second suspension lead are each connected to said frame portion to support said semiconductor chip placing portion via said first suspension lead and said second suspension lead; a plurality of lead members extending from said frame portion toward said semiconductor chip placing portion, wherein inner ends of said lead members define a rectangle and, a diagonal of said rectangle and a diagonal of said semiconductor chip placing portion overlap each other, said lead frame being utilized in a process for manufacturing a plastic package type semiconductor device in which process a semiconductor chip is mounted on said semiconductor chip placing portion, said lead frame being sandwiched by a pair of mold members defining a cavity, a gate for injecting molten resin into said cavity mold members at a position corresponding to said first suspension lead; two first overhanging portions attached to an outer periphery of said semiconductor chip placing portion at two first sides adjacent to said first corner, each of said first overhanging portions extending toward said inner ends of said lead members so that a width along each of said first sides gradually increases in a direction going away from said first corner; and two second overhanging portions attached to an outer periphery of said semiconductor chip placing portion at two second sides adjacent to said second corner, each of said second overhanging portions extending toward said inner ends of said lead members so that a width along each of said second sides gradually decreases in a direction going away from said second corner.

Claim 8

A lead frame as set forth in claim 5, wherein a distance between an outer periphery of said first and second overhanging portions and said inner ends of said lead members gradually decreases in a direction going along said first and second sides from said first corner to said second corner.

Claim 9

A lead frame as set forth in claim 5 further comprising a mark for indicating a boundary between said semiconductor chip placing portion and said first and second overhanging portions.

Claim 10

A lead frame as set forth in claim 5, wherein said semiconductor chip placing portion and said first and second overhanging portions form an island portion, and a center of said island portion is shifted from a center of said rectangle toward said second corner.

Claim 11

A lead frame, comprising: a rectangular semiconductor chip placing portion for receiving a semiconductor chip thereon; a first suspension lead, one end of which is connected to a first side of said semiconductor chip placing portion; a second suspension lead, one end of which is connected to a second side of said semiconductor chip placing portion, said second side being opposite to said first side; a frame portion surrounding said semiconductor chip placing portion, wherein an opposite end of said first suspension lead and an opposite end of said second suspension lead are each connected to said frame portion to support said semiconductor chip placing portion via said first suspension lead and said second suspension lead; a plurality of lead members extending from said frame portion toward said semiconductor chip placing portion, wherein inner ends of said lead members define a rectangle and, a diagonal of said rectangle and a diagonal of said semiconductor chip placing portion overlap each other, said lead frame being utilized in a process for manufacturing a plastic package type semiconductor device, a semiconductor chip being mounted on said semiconductor chip placing portion, a cavity for receiving said lead frame defined by a pair of mold members, a gate for injecting molten resin into a cavity, said gate being formed between said mold members on one of said mold members at a position corresponding to said first suspension lead; and three overhanging portions attached to an outer periphery of said semiconductor chip placing portion at said second side and two sides adjacent to said second side, each of said overhanging portions extending toward said inner ends of said lead members so as to have a constant width along each of said second side and said two sides.

Claim 12

A lead frame, comprising: a rectangular semiconductor chip placing portion for receiving a semiconductor chip thereon; a first suspension lead, one end of which is connected to a first side of said semiconductor chip placing portion; a second suspension lead, one end of which is connected to a second side of said semiconductor chip placing portion, said second side being opposite to said first side; a frame portion surrounding said semiconductor chip placing portion, wherein an opposite end of said first suspension lead and an opposite end of said second suspension lead are each connected to said frame portion to support said semiconductor chip placing portion via said first suspension lead and said second suspension lead; a plurality of lead members extending from said frame portion toward said semiconductor chip placing portion, wherein inner ends of said lead members define a rectangle and, a diagonal of said rectangle and a diagonal of said semiconductor chip placing portion overlap each other, said lead frame being utilized in a process for manufacturing a plastic package type semiconductor device, a semiconductor chip being mounted on said semiconductor chip placing portion, a cavity for receiving said lead frame defined by a pair of mold members, a gate for injecting molten resin into a cavity, said gate being formed between said mold members on one of said mold members at a position corresponding to said first suspension lead; and three overhanging portions attached to an outer periphery of said semiconductor chip placing portion at said second side and two sides adjacent to said second side, each of said overhanging portions extending toward said inner ends of said lead members so as to have a constant width along each of said second side and said two sides.

Claim 13

A lead frame as set forth in claim 9, wherein a distance between an outer periphery of said overhanging portions and said inner ends of said lead members is less than distance between said first side and said inner ends of said lead members.

Claim 14

A lead frame as set forth in claim 9 further comprising a mark for indicating a boundary between said semiconductor chip placing portion and said overhanging portions.

Claim 15

A lead frame as set forth in claim 9, wherein said semiconductor chip placing portion and said overhanging portions form an island portion, and a center of said island portion is shifted from a center of said rectangle toward said second side.