Abstract A method for fabricating an integrated circuit having at least one integrated circuit component fabricated in a silicon substrate and a second device that is to be fabricated on a silicon oxide layer that covers the integrated circuit component. The integrated circuit component has a terminal that is to be connected a corresponding terminal on the second device. The second device includes an electrode structure in contact with a dielectric component that includes a layer of ferroelectric material. In the method of the present invention, a boundary layer comprising non-conducting polysilicon is deposited over the silicon oxide layer. The electrode structure is then fabricated by depositing one or more layers over the boundary layer. The ferroelectric layer is then deposited over the electrode structure and etched to provide the dielectric component. The boundary layer is then removed utilizing an etchant that etches silicon oxide much slower than polysilicon.
A method for fabricating an integrated circuit comprising at least one integrated circuit component fabricated in a silicon substrate and a second device to be fabricated on a silicon oxide layer that covers said integrated circuit component, said integrated circuit component having a terminal that is to be connected a corresponding terminal on said second device, said second device comprising an electrode structure in contact with a dielectric component comprising a layer of ceramic material, said method comprising the steps of: depositing a boundary layer comprising non-conducting silicon over said silicon oxide layer; fabricating said electrode structure by depositing one or more layers over said boundary layer; depositing said layer of ceramic material over said electrode structure; etching said ceramic layer to provide said dielectric component utilizing an etchant that etches said ceramic material at least 1.5 times faster than polysilicon; and removing said boundary layer with an etchant that etches said boundary layer at least 2 times faster than silicon oxide.
Claim 2
Independent Claim
162 words
A method for fabricating an integrated circuit comprising at least one integrated circuit component fabricated in a silicon substrate and a second device to be fabricated on a silicon oxide layer that covers said integrated circuit component, said integrated circuit component having a terminal that is to be connected a corresponding terminal on said second device, said second device comprising an electrode structure in contact with a dielectric component comprising a layer of ceramic material, said method comprising the steps of: depositing a boundary layer comprising non-conducting silicon over said silicon oxide layer; fabricating said electrode structure by depositing one or more layers over said boundary layer; depositing said layer of ceramic material over said electrode structure; etching said ceramic layer to provide said dielectric component utilizing an etchant that etches said ceramic material at least 1.5 times faster than polysilicon; and removing said boundary layer with an etchant that etches said boundary layer at least 2 times faster than silicon oxide.
Claim 3
Dependent Claim
42 words
The method of claim 1 wherein said boundary layer comprises a layer of polysilicon in contact with said layer of silicon oxide and a layer of a second material which is inert with respect to the bottom surface of said electrode structure.
Claim 4
Dependent Claim
11 words
The method of claim 2 wherein said second material comprises TiN.
Claim 5
Dependent Claim
12 words
The method of claim 2 wherein said second material comprises titanium oxide.
Claim 6
Dependent Claim
30 words
The method of claim 1 wherein said electrode structure comprises a layer of platinum underlying a layer of LSCO, said layer of platinum being in contact with said boundary layer.