Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
98 words
A method for patterned metallization of a substrate surface comprising the steps of: applying a layer of primer to entirely cover a substrate surface in an area where a metallized pattern is to be formed; selectively ablating portions of the primer layer from the substrate by exposing said portions to the action of electromagnetic ultraviolet radiation to completely remove the primer from the exposed portions so that a patterned primer layer with primer-free insulating channels formed therein remains on the substrate surface; and thereafter depositing a metal layer on the remaining patterned primer layer to form conducting paths.
Claim 2
Independent Claim
98 words
A method for patterned metallization of a substrate surface comprising the steps of: applying a layer of primer to entirely cover a substrate surface in an area where a metallized pattern is to be formed; selectively ablating portions of the primer layer from the substrate by exposing said portions to the action of electromagnetic ultraviolet radiation to completely remove the primer from the exposed portions so that a patterned primer layer with primer-free insulating channels formed therein remains on the substrate surface; and thereafter depositing a metal layer on the remaining patterned primer layer to form conducting paths.
Claim 3
Dependent Claim
14 words
A method according to claim 1, wherein the substrate surface has a three-dimensional configuration.
Claim 4
Dependent Claim
14 words
A method according to claim 1, wherein the substrate is an electronic circuit board.
Claim 5
Dependent Claim
19 words
A method according to claim 1, wherein the electromagnetic UV radiation is applied by means of an excimer laser.
Claim 6
Dependent Claim
20 words
A method according to claim 4, wherein the laser is a krypton-fluoride excimer laser with a wavelength of 248 nm.
Claim 7
Dependent Claim
57 words
A method according to claim 1, wherein the insulating channels in the primer layer are wider by twice the thickness of the deposited metal layer than is necessary for insulation between the conducting paths, such that deposition of the metal layer on flanks of the patterned primer layer leaves sufficiently wide insulating channels between adjacent conductive paths.
Claim 8
Dependent Claim
24 words
A method according to claim 1, wherein the insulating channels and conductive paths have widths in the range from 5 μm to 200 μm.
Claim 9
Dependent Claim
24 words
A method according to claim 7, wherein the insulating channels and conductive paths have widths in the range from 10 μm to 100 μm.
Claim 10
Dependent Claim
32 words
A method according to claim 1, wherein portions of the primer layer are ablated from the substrate by exposing the primer layer to an ultraviolet radiation image corresponding to the insulating channels.
Claim 11
Dependent Claim
29 words
A method according to claim 9, wherein the primer layer is exposed to radiation from an excimer laser through a mask interposed between the laser and the primer layer.
Claim 12
Dependent Claim
34 words
A method according to claim 1, wherein portions of the primer layer are ablated by exposing the primer layer to a focused excimer laser beam which scans a pattern corresponding to the insulating channels.
Claim 13
Dependent Claim
30 words
A method according to claim 1, wherein the primer layer is applied to the substrate by a method selected from the group consisting of brushing, spraying, printing, dipping or precipitation.
Claim 14
Dependent Claim
20 words
A method according to claim 1, wherein the primer is a non-conductive paste comprising a catalytic activator for non-electrical metallization.
Claim 15
Dependent Claim
30 words
A method according to claim 1, wherein the metal layer is deposited on the remaining patterned primer layer to form conducting paths by non-electrical deposition from a non-electrical metallization bath.
Claim 16
Dependent Claim
29 words
A method according to claim 1, further comprising the additional step of galvanically applying additional metal onto the deposited metal layer to increase the thickness of the conducting paths.