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US5593739A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of patterned metallization of substrate surfaces

Assignee: LPKF Laser and Electronics AG
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Filing: 1996-02-14
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Granted: 1997-01-14
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Expires: 2016-02-14
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Abstract

Abstract A method for patterned metallization of substrate surfaces, especially circuit boards, even three-dimensional ones, by using electromagnetic UV radiation, particularly from an excimer laser. In the method a primer layer is applied to the full substrate surface in the area of a metal layer that is subsequently applied; insulating channels then are made in the primer layer by complete removal of the primer in certain areas by the action of electromagnetic radiation in the UV range; and afterward the remaining patterned primer layer is provided with the metal layer to form conductor strips. The method makes it possible to create insulating channels with extremely sharp contours in the primer layer on the surface of even three-dimensional, electronic circuit media.

Inventors

  • 👤 Joerg Kickelhain

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 17:48
CPC Classifications
B; B05; B05D; B05D3/00; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/185; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1653; C23C18/18; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2053; C23C18/2066; C23C18/28; C23C18/30

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 98 words
A method for patterned metallization of a substrate surface comprising the steps of: applying a layer of primer to entirely cover a substrate surface in an area where a metallized pattern is to be formed; selectively ablating portions of the primer layer from the substrate by exposing said portions to the action of electromagnetic ultraviolet radiation to completely remove the primer from the exposed portions so that a patterned primer layer with primer-free insulating channels formed therein remains on the substrate surface; and thereafter depositing a metal layer on the remaining patterned primer layer to form conducting paths.
Claim 2
Independent Claim 98 words
A method for patterned metallization of a substrate surface comprising the steps of: applying a layer of primer to entirely cover a substrate surface in an area where a metallized pattern is to be formed; selectively ablating portions of the primer layer from the substrate by exposing said portions to the action of electromagnetic ultraviolet radiation to completely remove the primer from the exposed portions so that a patterned primer layer with primer-free insulating channels formed therein remains on the substrate surface; and thereafter depositing a metal layer on the remaining patterned primer layer to form conducting paths.
Claim 3
Dependent Claim 14 words
A method according to claim 1, wherein the substrate surface has a three-dimensional configuration.
Claim 4
Dependent Claim 14 words
A method according to claim 1, wherein the substrate is an electronic circuit board.
Claim 5
Dependent Claim 19 words
A method according to claim 1, wherein the electromagnetic UV radiation is applied by means of an excimer laser.
Claim 6
Dependent Claim 20 words
A method according to claim 4, wherein the laser is a krypton-fluoride excimer laser with a wavelength of 248 nm.
Claim 7
Dependent Claim 57 words
A method according to claim 1, wherein the insulating channels in the primer layer are wider by twice the thickness of the deposited metal layer than is necessary for insulation between the conducting paths, such that deposition of the metal layer on flanks of the patterned primer layer leaves sufficiently wide insulating channels between adjacent conductive paths.
Claim 8
Dependent Claim 24 words
A method according to claim 1, wherein the insulating channels and conductive paths have widths in the range from 5 μm to 200 μm.
Claim 9
Dependent Claim 24 words
A method according to claim 7, wherein the insulating channels and conductive paths have widths in the range from 10 μm to 100 μm.
Claim 10
Dependent Claim 32 words
A method according to claim 1, wherein portions of the primer layer are ablated from the substrate by exposing the primer layer to an ultraviolet radiation image corresponding to the insulating channels.
Claim 11
Dependent Claim 29 words
A method according to claim 9, wherein the primer layer is exposed to radiation from an excimer laser through a mask interposed between the laser and the primer layer.
Claim 12
Dependent Claim 34 words
A method according to claim 1, wherein portions of the primer layer are ablated by exposing the primer layer to a focused excimer laser beam which scans a pattern corresponding to the insulating channels.
Claim 13
Dependent Claim 30 words
A method according to claim 1, wherein the primer layer is applied to the substrate by a method selected from the group consisting of brushing, spraying, printing, dipping or precipitation.
Claim 14
Dependent Claim 20 words
A method according to claim 1, wherein the primer is a non-conductive paste comprising a catalytic activator for non-electrical metallization.
Claim 15
Dependent Claim 30 words
A method according to claim 1, wherein the metal layer is deposited on the remaining patterned primer layer to form conducting paths by non-electrical deposition from a non-electrical metallization bath.
Claim 16
Dependent Claim 29 words
A method according to claim 1, further comprising the additional step of galvanically applying additional metal onto the deposited metal layer to increase the thickness of the conducting paths.

References Cited (Backward Citations)

US4910045A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2000-01-14 2000-07-15 2001-01-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2004-01-14 2004-07-15 2005-01-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2008-01-14 2008-07-15 2009-01-14 $7700.00 Window Closed / Lapsed

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