US5588202A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing an overmolded sensor
Assignee: Honeywell Inc
•
Filing: 1995-03-17
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Granted: 1996-12-31
•
Expires: 2015-03-17
Abstract
Abstract A method is described for manufacturing a plurality of proximity sensors which are attached to a printed circuit board during the manufacturing steps and subsequently severed from the printed circuit board by shearing. Each of the proximity sensors comprises a core and coil assembly, a plurality of electronic components and an electrical connector. These components of each of the proximity sensors is encapsulated during an overmolding process and the encapsulations are removed from the printed circuit board by a shearing step. Each of the encapsulations can be inserted into a cylindrical housing.
Inventors
- 👤 Wayne L. Ehlers
- 👤 Kenneth L. Eichholz, Jr.
- 👤 Mark F. Johnston
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:31
CPC Classifications
G; G01; G01D; G01D11/00; G01D11/24; G01D11/245; H; H05; H05K; H05K3/00; H05K3/0097; H05K3/22; H05K3/28; H05K3/284; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/4902; Y10T29/49073; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146; Y10T29/49169; Y10T29/49171; Y10T29/49172
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
210 words
A method for manufacturing a proximity sensor, comprising: providing a printed circuit board having a first side and a second side; perforating said printed circuit board to form a plurality of substrate sections connected together by a plurality of ribs, each of said plurality of substrate sections having a first plurality of electrically conductive paths formed thereon; attaching a first plurality of electronic components to said first side of each of said plurality of substrate sections, each of said first plurality of electronic components being connected in electrical communication with at least one of said first plurality of electrically conductive paths of a preselected one of said plurality substrate sections to form a first electrical circuit on each of said plurality of substrate sections; attaching an electrical coil to a first end of each of said plurality of substrate sections; attaching an electrical connector to a second end of each of said plurality of substrate sections; calibrating each of said first electrical circuits; simultaneously forming a plurality of encapsulations, each of said plurality of encapsulations being disposed around one of said plurality of substrate sections and its associated electronic components, coil and connector; and severing said ribs to detach each of said plurality of encapsulations from said printed circuit board.
Claim 2
Independent Claim
210 words
A method for manufacturing a proximity sensor, comprising: providing a printed circuit board having a first side and a second side; perforating said printed circuit board to form a plurality of substrate sections connected together by a plurality of ribs, each of said plurality of substrate sections having a first plurality of electrically conductive paths formed thereon; attaching a first plurality of electronic components to said first side of each of said plurality of substrate sections, each of said first plurality of electronic components being connected in electrical communication with at least one of said first plurality of electrically conductive paths of a preselected one of said plurality substrate sections to form a first electrical circuit on each of said plurality of substrate sections; attaching an electrical coil to a first end of each of said plurality of substrate sections; attaching an electrical connector to a second end of each of said plurality of substrate sections; calibrating each of said first electrical circuits; simultaneously forming a plurality of encapsulations, each of said plurality of encapsulations being disposed around one of said plurality of substrate sections and its associated electronic components, coil and connector; and severing said ribs to detach each of said plurality of encapsulations from said printed circuit board.
Claim 3
Dependent Claim
79 words
The method of claim 1, further comprising: attaching a second plurality of electronic components to said second side of each of said plurality of substrate sections, each of said second plurality of electronic components being connected in electrical communication with at least one of a second plurality of electrically conductive paths on said second side of a preselected one of said plurality of substrate sections to form a second electrical circuit on each of said plurality of substrate sections.
Claim 4
Dependent Claim
27 words
The method of claim 1, further comprising: shearing said first end of each of said plurality of substrate sections to accommodate a preselected size of said coil.
Claim 5
Dependent Claim
17 words
The method of claim 1, wherein: each of said coils is wound around an associated core structure.
Claim 6
Dependent Claim
28 words
The method of claim 1, further comprising: shearing said second end of each of said plurality of substrate sections to select an effective length of said proximity sensor.
Claim 7
Dependent Claim
18 words
The method of claim 1, further comprising: inserting each of said plurality of encapsulations into a tubular housing.
Claim 8
Dependent Claim
13 words
The method of claim 6, wherein: said tubular housing is made of metal.
Claim 9
Dependent Claim
23 words
The method of claim 6, further comprising: placing an O-ring around each of said plurality of encapsulations prior to performing said inserting step.
Claim 10
Dependent Claim
16 words
The method of claim 1, wherein: each of said plurality of encapsulations comprises a thermoset material.
Claim 11
Independent Claim
281 words
A method for manufacturing a proximity sensor, comprising: providing a printed circuit board having a first side and a second side; perforating said printed circuit board to form a plurality of substrate sections connected together by a plurality of ribs, each of said plurality of substrate sections having a first plurality of electrically conductive paths formed thereon; attaching a first plurality of electronic components to said first side of each of said plurality of substrate sections, each of said first plurality of electronic components being connected in electrical communication with at least one of said first plurality of electrically conductive paths of a preselected one of said plurality substrate sections to form a first electrical circuit on each of said plurality of substrate sections; attaching an electrical coil to a first end of each of said plurality of substrate sections; attaching an electrical connector to a second end of each of said plurality of substrate sections; calibrating each of said first electrical circuits; simultaneously forming a plurality of encapsulations, each of said plurality of encapsulations being disposed around one of said plurality of substrate sections and its associated electronic components, coil and connector; severing said ribs to detach each of said plurality of encapsulations from said printed circuit board; and attaching a second plurality of electronic components to said second side of each of said plurality of substrate sections, each of said second plurality of electronic components being connected in electrical communication with at least one of a second plurality of electrically conductive paths on said second side of a preselected one of said plurality substrate sections to form a second electrical circuit on each of said plurality of substrate sections.
Claim 12
Independent Claim
281 words
A method for manufacturing a proximity sensor, comprising: providing a printed circuit board having a first side and a second side; perforating said printed circuit board to form a plurality of substrate sections connected together by a plurality of ribs, each of said plurality of substrate sections having a first plurality of electrically conductive paths formed thereon; attaching a first plurality of electronic components to said first side of each of said plurality of substrate sections, each of said first plurality of electronic components being connected in electrical communication with at least one of said first plurality of electrically conductive paths of a preselected one of said plurality substrate sections to form a first electrical circuit on each of said plurality of substrate sections; attaching an electrical coil to a first end of each of said plurality of substrate sections; attaching an electrical connector to a second end of each of said plurality of substrate sections; calibrating each of said first electrical circuits; simultaneously forming a plurality of encapsulations, each of said plurality of encapsulations being disposed around one of said plurality of substrate sections and its associated electronic components, coil and connector; severing said ribs to detach each of said plurality of encapsulations from said printed circuit board; and attaching a second plurality of electronic components to said second side of each of said plurality of substrate sections, each of said second plurality of electronic components being connected in electrical communication with at least one of a second plurality of electrically conductive paths on said second side of a preselected one of said plurality substrate sections to form a second electrical circuit on each of said plurality of substrate sections.
Claim 13
Dependent Claim
27 words
The method of claim 10, further comprising: shearing said first end of each of said plurality of substrate sections to accommodate a preselected size of said coil.
Claim 14
Dependent Claim
17 words
The method of claim 10, wherein: each of said coils is wound around an associated core structure.
Claim 15
Dependent Claim
28 words
The method of claim 10, further comprising: shearing said second end of each of said plurality of substrate sections to select an effective length of said proximity sensor.
Claim 16
Dependent Claim
35 words
The method of claim 10, further comprising: inserting each of said plurality of encapsulations into a tubular housing; and placing an O-ring around each of said plurality of encapsulations prior to performing said inserting step.
Claim 17
Dependent Claim
13 words
The method of claim 14, wherein: said tubular housing is made of metal.
Claim 18
Dependent Claim
16 words
The method of claim 10, wherein: each of said plurality of encapsulations comprises a thermoset material.
Claim 19
Independent Claim
369 words
A method for manufacturing a proximity sensor, comprising: providing a printed circuit board having a first side and a second side; perforating said printed circuit board to form a plurality of substrate sections connected together by a plurality of ribs, each of said plurality of substrate sections having a plurality of electrically conductive paths formed thereon; attaching a first plurality of electronic components to said first side of each of said plurality of substrate sections, each of said first plurality of electronic components being connected in electrical communication with at least one of said first plurality of electrically conductive paths of a preselected one of said plurality substrate sections to form a first electrical circuit on each of said plurality of substrate sections; attaching an electrical coil to a first end of each of said plurality of substrate sections, each of said coils being wound around an associated core structure; attaching an electrical connector to a second end of each of said plurality of substrate sections; calibrating each of said first electrical circuits; simultaneously forming a plurality of encapsulations, each of said plurality of encapsulations comprising a thermoset material, each of said plurality of encapsulations being disposed around one of said plurality of substrate sections and its associated electronic components, coil and connector; severing said ribs to detach each of said plurality of encapsulations from said printed circuit board; attaching a second plurality of electronic components to said second side of each of said plurality of substrate sections, each of said second plurality of electronic components being connected in electrical communication with at least one of a second plurality of electrically conductive paths on said second side of a preselected one of said plurality substrate sections to form a second electrical circuit on each of said plurality of substrate sections; shearing said first end of each of said plurality of substrate sections to accommodate a preselected size of said coil; shearing said second end of each of said plurality of substrate sections to select an effective length of said proximity sensor; inserting each of said plurality of encapsulations into a tubular housing; and placing an O-ring around each of said plurality of encapsulations prior to performing said inserting step.
Claim 20
Independent Claim
369 words
A method for manufacturing a proximity sensor, comprising: providing a printed circuit board having a first side and a second side; perforating said printed circuit board to form a plurality of substrate sections connected together by a plurality of ribs, each of said plurality of substrate sections having a plurality of electrically conductive paths formed thereon; attaching a first plurality of electronic components to said first side of each of said plurality of substrate sections, each of said first plurality of electronic components being connected in electrical communication with at least one of said first plurality of electrically conductive paths of a preselected one of said plurality substrate sections to form a first electrical circuit on each of said plurality of substrate sections; attaching an electrical coil to a first end of each of said plurality of substrate sections, each of said coils being wound around an associated core structure; attaching an electrical connector to a second end of each of said plurality of substrate sections; calibrating each of said first electrical circuits; simultaneously forming a plurality of encapsulations, each of said plurality of encapsulations comprising a thermoset material, each of said plurality of encapsulations being disposed around one of said plurality of substrate sections and its associated electronic components, coil and connector; severing said ribs to detach each of said plurality of encapsulations from said printed circuit board; attaching a second plurality of electronic components to said second side of each of said plurality of substrate sections, each of said second plurality of electronic components being connected in electrical communication with at least one of a second plurality of electrically conductive paths on said second side of a preselected one of said plurality substrate sections to form a second electrical circuit on each of said plurality of substrate sections; shearing said first end of each of said plurality of substrate sections to accommodate a preselected size of said coil; shearing said second end of each of said plurality of substrate sections to select an effective length of said proximity sensor; inserting each of said plurality of encapsulations into a tubular housing; and placing an O-ring around each of said plurality of encapsulations prior to performing said inserting step.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-31 | 2000-07-01 | 2000-12-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-31 | 2004-07-01 | 2004-12-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-31 | 2008-07-01 | 2008-12-31 | $7700.00 | Window Closed / Lapsed |