US5584959A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Waste treatment system in a polishing apparatus
Assignee: Ebara Corp
•
Filing: 1994-08-16
•
Granted: 1996-12-17
•
Expires: 2014-08-16
Abstract
Abstract A waste treatment system in a polishing apparatus treats waste gas and waste liquid discharged from the polishing apparatus. The waste treatment system comprises an exhaust duct provided in a partition wall enclosing the polishing apparatus, a scrubber connected to the exhaust duct through an exhauster for scrubbing waste gas discharged from the polishing apparatus, a waste liquid receiver provided below an abrasive cloth of the polishing apparatus for receiving waste liquid generated by a polishing operation and a waste liquid treatment apparatus connected to the waste liquid receiver for treating the waste liquid discharged from the polishing apparatus.
Inventors
- 👤 Norio Kimura
- 👤 Katsuyuki Aoki
- 👤 Kiyotaka Kawashima
- 👤 Seiji Ishikawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:47
CPC Classifications
C; C02; C02F; C02F1/00; C02F1/52; C02F1/5236; B; B01; B01D; B01D53/00; B01D53/14; B01D53/1456; B01D53/34; B01D53/46; B01D53/48; B01D53/50; B01D53/54; B01D53/58; B24; B24B; B24B55/00; B24B55/02; B24B55/03; C02F2103/00; C02F2103/18; Y; Y10; Y10S; Y10S438/00; Y10S438/909
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
128 words
An apparatus comprising a clean room, a polishing apparatus installed in said clean room and including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall installed in said clean room and enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus; a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; and a waste liquid treatment apparatus connected to said waste liquid receiver for treating the waste liquid produced in the polishing operation.
Claim 2
Independent Claim
128 words
An apparatus comprising a clean room, a polishing apparatus installed in said clean room and including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall installed in said clean room and enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus; a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; and a waste liquid treatment apparatus connected to said waste liquid receiver for treating the waste liquid produced in the polishing operation.
Claim 3
Dependent Claim
29 words
An apparatus as recited in claim 1, further comprising a pipe for feeding clearing solvent in a clearing solvent tank of said scrubber to said waste liquid treatment apparatus.
Claim 4
Dependent Claim
30 words
An apparatus as recited in claim 1, further comprising a duct for supplying waste gas generated in a waste liquid chamber of said waste liquid treatment apparatus to said scrubber.
Claim 5
Dependent Claim
24 words
An apparatus as recited in claim 1, further comprising a pipe for supplying liquid cleaned by said waste liquid treatment apparatus to said scrubber.
Claim 6
Dependent Claim
51 words
An apparatus as recited in claim 1, further comprising a damper provided in said exhaust duct, said damper being controlled so as to be closed while the semiconductor wafer is transferred to a next process after finishing of the polishing operation and prior to a polishing operation for another semiconductor wafer.
Claim 7
Dependent Claim
47 words
An apparatus as recited in claim 5, wherein said polishing apparatus further includes a rotatable turntable, and said abrasion cloth is attached to said rotatable turntable; and said damper is controlled so as to be opened or closed in synchronization with rotation or stoppage of said turntable.
Claim 8
Dependent Claim
77 words
An apparatus as recited in claim 5, wherein said polishing apparatus further includes a turntable to which said abrasive cloth is attached, and a top ring which is horizontally and vertically movable relative to said turntable for holding the semiconductor wafer and pressing the semiconductor wafer against said abrasive cloth; and said damper is controlled so as to be opened or closed in synchronization with horizontal or vertical movement of said top ring relative to said turntable.
Claim 9
Dependent Claim
60 words
An apparatus as recited in claim 1, wherein said polishing apparatus further includes a horizontal turntable for supporting one of said abrasive cloth and the semiconductor wafer, a top ring for holding the other of said abrasive cloth and the semiconductor wafer and a swinging mechanism for swinging said top ring relative to said horizontal turntable about a vertical axis.
Claim 10
Dependent Claim
100 words
An apparatus as recited in claim 1, wherein said polishing apparatus further includes a horizontal turntable for supporting one of said abrasive cloth and the semiconductor wafer, a top ring for holding the other of said abrasive cloth and the semiconductor wafer, and a lifting mechanism for vertically moving said top ring between an operating position in which said abrasive cloth can contact the semiconductor wafer and a raised position in which the semiconductor wafer is separated from said abrasive cloth; and said top ring is enclosed within said enclosed space in both said operating position and said raised position.
Claim 11
Independent Claim
88 words
An apparatus comprising a clean room, a polishing apparatus installed in said clean room and including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall installed in said clean room and enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; and a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus.
Claim 12
Independent Claim
88 words
An apparatus comprising a clean room, a polishing apparatus installed in said clean room and including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall installed in said clean room and enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; and a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus.
Claim 13
Dependent Claim
51 words
An apparatus as recited in claim 10, further comprising a damper provided in said exhaust duct, said damper being controlled so as to be closed while the semiconductor wafer is transferred to a next process after finishing of the polishing operation and prior to a polishing operation for another semiconductor wafer.
Claim 14
Dependent Claim
47 words
An apparatus as recited in claim 11, wherein said polishing apparatus further includes a rotatable turntable, and said abrasion cloth is attached to said rotatable turntable; and said damper is controlled so as to be opened or closed in synchronization with rotation or stoppage of said turntable.
Claim 15
Dependent Claim
77 words
An apparatus as recited in claim 11, wherein said polishing apparatus further includes a turntable to which said abrasive cloth is attached, and a top ring which is horizontally and vertically movable relative to said turntable for holding the semiconductor wafer and pressing the semiconductor wafer against said abrasive cloth; and said damper is controlled so as to be opened or closed in synchronization with horizontal or vertical movement of said top ring relative to said turntable.
Claim 16
Dependent Claim
60 words
An apparatus as recited in claim 10, wherein said polishing apparatus further includes a horizontal turntable for supporting one of said abrasive cloth and the semiconductor wafer, a top ring for holding the other of said abrasive cloth and the semiconductor wafer and a swinging mechanism for swinging said top ring relative to said horizontal turntable about a vertical axis.
Claim 17
Dependent Claim
100 words
An apparatus as recited in claim 10, wherein said polishing apparatus further includes a horizontal turntable for supporting one of said abrasive cloth and the semiconductor wafer, a top ring for holding the other of said abrasive cloth and the semiconductor wafer, and a lifting mechanism for vertically moving said top ring between an operating position in which said abrasive cloth can contact the semiconductor wafer and a raised position in which the semiconductor wafer is separated from said abrasive cloth; and said top ring is enclosed within said enclosed space in both said operating position and said raised position.
Claim 18
Independent Claim
137 words
An apparatus comprising a clean room, a polishing apparatus installed in said clean room and including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall installed in said clean room and enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a buffer vessel connected to said waste liquid receiver for collecting the waste liquid; a precipitation chamber connected to said buffer vessel for separating the waste liquid into solid components and liquid components; and a flocculating agent supply device for supplying flocculating agent to said precipitation chamber to quicken precipitation of the solid components in said precipitation chamber.
Claim 19
Independent Claim
137 words
An apparatus comprising a clean room, a polishing apparatus installed in said clean room and including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall installed in said clean room and enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a buffer vessel connected to said waste liquid receiver for collecting the waste liquid; a precipitation chamber connected to said buffer vessel for separating the waste liquid into solid components and liquid components; and a flocculating agent supply device for supplying flocculating agent to said precipitation chamber to quicken precipitation of the solid components in said precipitation chamber.
Claim 20
Dependent Claim
60 words
An apparatus as recited in claim 16, wherein said polishing apparatus further includes a horizontal turntable for supporting one of said abrasive cloth and the semiconductor wafer, a top ring for holding the other of said abrasive cloth and the semiconductor wafer and a swinging mechanism for swinging said top ring relative to said horizontal turntable about a vertical axis.
Claim 21
Dependent Claim
100 words
An apparatus as recited in claim 16, wherein said polishing apparatus further includes a horizontal turntable for supporting one of said abrasive cloth and the semiconductor wafer, a top ring for holding the other of said abrasive cloth and the semiconductor wafer, and a lifting mechanism for vertically moving said top ring between an operating position in which said abrasive cloth can contact the semiconductor wafer and a raised position in which the semiconductor wafer is separated from said abrasive cloth; and said top ring is enclosed within said enclosed space in both said operating position and said raised position.
Claim 22
Independent Claim
199 words
An apparatus comprising a clean room, a polishing apparatus installed in said clean room and including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall installed in said clean room and enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a waste liquid tank connected to said waste liquid receiver for collecting the waste liquid; a filter having a filter element for filtering the waste liquid; a filter aid supply device for supplying filter aid to said filter element and forming a filter aid layer on said filter element; a waste liquid supplying device for supplying the waste liquid to said filter element and allowing the cleaned liquid to pass through said filter aid layer; and a back washing device for removing the filter aid layer on said filter element and solid foreign matter caught by said filter element by supplying fluid to said filter element after a certain amount of solid foreign matter is caught by said filter element.
Claim 23
Independent Claim
199 words
An apparatus comprising a clean room, a polishing apparatus installed in said clean room and including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall installed in said clean room and enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a waste liquid tank connected to said waste liquid receiver for collecting the waste liquid; a filter having a filter element for filtering the waste liquid; a filter aid supply device for supplying filter aid to said filter element and forming a filter aid layer on said filter element; a waste liquid supplying device for supplying the waste liquid to said filter element and allowing the cleaned liquid to pass through said filter aid layer; and a back washing device for removing the filter aid layer on said filter element and solid foreign matter caught by said filter element by supplying fluid to said filter element after a certain amount of solid foreign matter is caught by said filter element.
Claim 24
Dependent Claim
60 words
An apparatus as recited in claim 19, wherein said polishing apparatus further includes a horizontal turntable for supporting one of said abrasive cloth and the semiconductor wafer, a top ring for holding the other of said abrasive cloth and the semiconductor wafer and a swinging mechanism for swinging said top ring relative to said horizontal turntable about a vertical axis.
Claim 25
Dependent Claim
100 words
An apparatus as recited in claim 19, wherein said polishing apparatus further includes a horizontal turntable for supporting one of said abrasive cloth and the semiconductor wafer, a top ring for holding the other of said abrasive cloth and the semiconductor wafer, and a lifting mechanism for vertically moving said top ring between an operating position in which said abrasive cloth can contact the semiconductor wafer and a raised position in which the semiconductor wafer is separated from said abrasive cloth; and said top ring is enclosed within said enclosed space in both said operating position and said raised position.
Claim 26
Dependent Claim
38 words
An apparatus as recited in claim 19, further comprising a dehydrator for dehydrating the filter aid and the solid foreign matter removed by said back washing device to form a cake with a low percentage of water content.
Claim 27
Independent Claim
133 words
An apparatus comprising a polishing apparatus including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus; a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a waste liquid treatment apparatus connected to said waste liquid receiver for treating the waste liquid produced in the polishing operation; and a pipe for feeding clearing solvent in a clearing solvent tank of said scrubber to said waste liquid treatment apparatus.
Claim 28
Independent Claim
133 words
An apparatus comprising a polishing apparatus including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus; a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a waste liquid treatment apparatus connected to said waste liquid receiver for treating the waste liquid produced in the polishing operation; and a pipe for feeding clearing solvent in a clearing solvent tank of said scrubber to said waste liquid treatment apparatus.
Claim 29
Independent Claim
134 words
An apparatus comprising a polishing apparatus including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus; a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a waste liquid treatment apparatus connected to said waste liquid receiver for treating the waste liquid produced in the polishing operation; and a duct for supplying waste gas generated in a waste liquid chamber of said waste liquid treatment apparatus to said scrubber.
Claim 30
Independent Claim
134 words
An apparatus comprising a polishing apparatus including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus; a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a waste liquid treatment apparatus connected to said waste liquid receiver for treating the waste liquid produced in the polishing operation; and a duct for supplying waste gas generated in a waste liquid chamber of said waste liquid treatment apparatus to said scrubber.
Claim 31
Independent Claim
128 words
An apparatus comprising a polishing apparatus including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus; a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a waste liquid treatment apparatus connected to said waste liquid receiver for treating the waste liquid produced in the polishing operation; and a pipe for supplying liquid cleaned by said waste liquid treatment apparatus to said scrubber.
Claim 32
Independent Claim
128 words
An apparatus comprising a polishing apparatus including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus; a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a waste liquid treatment apparatus connected to said waste liquid receiver for treating the waste liquid produced in the polishing operation; and a pipe for supplying liquid cleaned by said waste liquid treatment apparatus to said scrubber.
Claim 33
Independent Claim
155 words
An apparatus comprising a polishing apparatus including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus; a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a waste liquid treatment apparatus connected to said waste liquid receiver for treating the waste liquid produced in the polishing operation; and a damper provided in said exhaust duct, said damper being controlled so as to be closed while the semiconductor wafer is transferred to a next process after finishing of the polishing operation and prior to a polishing operation for another semiconductor wafer.
Claim 34
Independent Claim
155 words
An apparatus comprising a polishing apparatus including an abrasive cloth for polishing a semiconductor wafer in a polishing operation which produces waste gas and waste liquid, a partition wall enclosing said polishing apparatus and defining an enclosed space therewithin, and a waste treatment system comprising: an exhaust duct opening into said enclosed space; a scrubber connected to said exhaust duct through an exhauster for scrubbing waste gas discharged from said polishing apparatus; a waste liquid receiver provided below said abrasive cloth for receiving the waste liquid produced in the polishing operation; a waste liquid treatment apparatus connected to said waste liquid receiver for treating the waste liquid produced in the polishing operation; and a damper provided in said exhaust duct, said damper being controlled so as to be closed while the semiconductor wafer is transferred to a next process after finishing of the polishing operation and prior to a polishing operation for another semiconductor wafer.
Claim 35
Dependent Claim
47 words
An apparatus as recited in claim 26, wherein said polishing apparatus further includes a rotatable turntable, and said abrasive cloth is attached to said rotatable turntable; and said damper is controlled so as to be opened or closed in synchronization with rotation or stoppage of said turntable.
Claim 36
Dependent Claim
77 words
An apparatus as recited in claim 26, wherein said polishing apparatus further includes a turntable to which said abrasive cloth is attached, and a top ring which is horizontally and vertically movable relative to said turntable for holding the semiconductor wafer and pressing the semiconductor wafer against said abrasive cloth; and said damper is controlled so as to be opened or closed in synchronization with horizontal or vertical movement of said top ring relative to said turntable.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-17 | 2000-06-17 | 2000-12-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-17 | 2004-06-17 | 2004-12-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-17 | 2008-06-17 | 2008-12-17 | $7700.00 | Window Closed / Lapsed |