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US5583078A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for fabricating a planar dielectric

Assignee: Nokia of America Corp
•
Filing: 1995-06-06
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Granted: 1996-12-10
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Expires: 2015-06-06
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Abstract

Abstract Re-entrant angles in doped dielectrics produced from the decomposition of organo-silicon compounds are reduced or eliminated by the addition of a polar molecule to the dielectric deposition process.

Inventors

  • 👤 John W. Osenbach

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 15:28
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/66; H10P14/662; H10P14/668; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/092; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/6336; H10P14/69; H10P14/692; H10P14/6921; H10P14/69215; H10P14/6922; H10P14/6923

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 105 words
A method of integrated circuit manufacturing comprising the steps of forming features on a surface of a substrate; and, depositing a first layer of silicon dioxide over said features, said depositing comprising the steps of decomposing an organo-silicon precursor gas to yield a silicon containing component, and directing said component together with at least one flow temperature reducing dopant and at least one polar molecule to said features on said surface of said substrate, said polar molecule being selected from the group consisting of NH 3 and N 2 O, the flow rate of said polar molecule being selected to produce an essentially conformal layer.
Claim 2
Independent Claim 105 words
A method of integrated circuit manufacturing comprising the steps of forming features on a surface of a substrate; and, depositing a first layer of silicon dioxide over said features, said depositing comprising the steps of decomposing an organo-silicon precursor gas to yield a silicon containing component, and directing said component together with at least one flow temperature reducing dopant and at least one polar molecule to said features on said surface of said substrate, said polar molecule being selected from the group consisting of NH 3 and N 2 O, the flow rate of said polar molecule being selected to produce an essentially conformal layer.
Claim 3
Dependent Claim 47 words
A method as recited in claim 1 comprising the further step of depositing a second layer of silicon dioxide by decomposing an organo-silicon precursor gas to yield a silicon-containing component, and directing said component together with at least one polar molecule to said features on said substrate.
Claim 4
Dependent Claim 28 words
A method as recited in claim 1 in which said the precursor gas comprises at least one member selected from the group consisting of TEOS, TOMCATS, and DES.
Claim 5
Dependent Claim 26 words
A method as recited in claim 1 in which said dopant is at least one member selected from the group consisting as P, B, and As.
Claim 6
Dependent Claim 26 words
A method as recited in claim 4 in which said deposition is continued until spaces between features have been substantially filled and a planar surface produced.
Claim 7
Independent Claim 84 words
A method of integrated circuit manufacturing comprising the steps of forming features on a surface of a substrate; and, depositing a first layer of silicon dioxide over said features, said depositing comprising the steps of decomposing an organo-silicon precursor gas to yield a silicon containing component, and directing said component together with at least one flow temperature reducing dopant and one polar molecule selected from the group consisting of NH 3 and N 2 O, to said features on said surface of said substrate.
Claim 8
Independent Claim 84 words
A method of integrated circuit manufacturing comprising the steps of forming features on a surface of a substrate; and, depositing a first layer of silicon dioxide over said features, said depositing comprising the steps of decomposing an organo-silicon precursor gas to yield a silicon containing component, and directing said component together with at least one flow temperature reducing dopant and one polar molecule selected from the group consisting of NH 3 and N 2 O, to said features on said surface of said substrate.
Claim 9
Dependent Claim 28 words
A method as recited in claim 6 in which said the precursor gas comprises at least one member selected from the group consisting of TEOS, TOMCATS, and DES.
Claim 10
Dependent Claim 26 words
A method as recited in claim 7 in which said dopant is at least one member selected from the group consisting as P, B, and As.

References Cited (Backward Citations)

US4217375A Cited
US4828629A Cited
EP0232748A1 Cited
JPS6362238A Cited
US4894352A Cited
JPH02218131A Cited
US5013691A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-12-10 2000-06-10 2000-12-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-12-10 2004-06-10 2004-12-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-12-10 2008-06-10 2008-12-10 $7700.00 Window Closed / Lapsed

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