US5578131A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Reduction of contaminant buildup in semiconductor processing apparatus
Assignee: Individual
•
Filing: 1995-06-02
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Granted: 1996-11-26
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Expires: 2015-06-02
Abstract
Abstract The present invention provides an apparatus for semiconductor processing in which the reactor chamber and the vacuum conduit means connected to the chamber are coated with a film of halogenated polymer material having a low vapor pressure and a low sticking coefficient. Preferred materials include low molecular weight polyfluoroethylene polymers such as polytetrafluoroethylene and polychlorotrifluoro-ethylene. A method is provided to prevent contaminant buildup on coated surfaces of semiconductor processing chambers and vacuum conduit means connected thereto during processing of a workpiece.
Inventors
- 👤 Yan Ye
- 👤 Anand Gupta
- 👤 Shamouil Shamouliam
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 04:02
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0448; C; C23; C23C; C23C14/00; C23C14/22; C23C14/56; C23C14/564; C23C16/00; C23C16/44; C23C16/4401; C23C16/4404; H01; H01J; H01J37/00; H01J37/32; H01J37/32431; H01J37/32458; H01J37/32477; H01J2237/00; H01J2237/02; H01J2237/022
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
151 words
A method of controlling by-product buildup on the interior surfaces of a semiconductor plasma processing apparatus during processing of a workpiece, comprising: a) providing a semiconductor plasma processing apparatus comprised of a reactor chamber and an exhaust system through which reactor chamber gases are removed from said reaction chamber; and b) applying a layer of polyfluoroethylene polymer selected from the group consisting of polytetrafluoroethylene (--CF 2 CF 2 --) n , polychlorotrifluoroethylene (--CF 2 CFCl--) n and copolymers of tetrafluoroethylene and chlorotrifluoroethylene, said polyfluoroethylene polymer being in the form of an oil, grease or wax, to at least a portion of the interior surfaces of said reactor chamber and said exhaust system, wherein said layer of polymeric material exhibits a sticking coefficient of 10 -4 or less and contributes a partial pressure which is 1% or less of the total vapor pressure over the entire operational pressure range for said chamber.
Claim 2
Independent Claim
151 words
A method of controlling by-product buildup on the interior surfaces of a semiconductor plasma processing apparatus during processing of a workpiece, comprising: a) providing a semiconductor plasma processing apparatus comprised of a reactor chamber and an exhaust system through which reactor chamber gases are removed from said reaction chamber; and b) applying a layer of polyfluoroethylene polymer selected from the group consisting of polytetrafluoroethylene (--CF 2 CF 2 --) n , polychlorotrifluoroethylene (--CF 2 CFCl--) n and copolymers of tetrafluoroethylene and chlorotrifluoroethylene, said polyfluoroethylene polymer being in the form of an oil, grease or wax, to at least a portion of the interior surfaces of said reactor chamber and said exhaust system, wherein said layer of polymeric material exhibits a sticking coefficient of 10 -4 or less and contributes a partial pressure which is 1% or less of the total vapor pressure over the entire operational pressure range for said chamber.
Claim 3
Dependent Claim
23 words
The method of claim 1 in which said polyfluoroethylene polymer has a molecular weight in the range of from about 5,000 to 800,000.
Claim 4
Dependent Claim
37 words
The method of claim 1 in which said layer of polymeric material is comprised of a copolymer of polyfluoroethylene with at least one comonomer selected from the group consisting of alpha olefins, fluorinated olefins, and vinyl ethers.
Claim 5
Dependent Claim
19 words
The method of claim 1 in which said layer has a thickness of 300,000 Angstroms (30 μm) or less.
Claim 6
Dependent Claim
11 words
The method of claim 1 in which said polyfluoroethylene is polychlorotrifluoroethylene.
Claim 7
Dependent Claim
38 words
The method of claim 5 in which said polychlorotrifluoroethylene has a molecular weight ranging from about 10,000 to 500,000 and said layer exhibits a thicknesses ranging from about 5 Angstroms (0.0005 μm) to about 20,000 Angstroms (2 μm).
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1999-11-26 | 2000-05-27 | 2000-11-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-11-26 | 2004-05-27 | 2004-11-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-11-26 | 2008-05-27 | 2008-11-26 | $7700.00 | Window Closed / Lapsed |