US5576362A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Insulating material and a circuit substrate in use thereof
Assignee: Denka Co Ltd
•
Filing: 1993-04-20
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Granted: 1996-11-19
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Expires: 2013-04-20
Abstract
Abstract An insulating material characterized by that said insulating material is made by curing a mixture composed of a bisphenol A type epoxy resin having purity which is equal to or more than 90% and an organic filler, the thermal conductivity thereof is in a range of 5.0×10 -3 to 18.0×10 -3 (cal/°C.·cm·sec) and the glass transition temperature thereof is in a range of 164° to 240° C.
Inventors
- 👤 Chiharu Watanabe
- 👤 Tatsuo Nakano
- 👤 Kazuo Kato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:11
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/056; C; C08; C08K; C08K3/00; C08K3/18; C08K3/20; C08K3/22; C08K3/28; H01; H01B; H01B3/00; H01B3/002; H01B3/006; H01B3/18; H01B3/30; H01B3/40; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511; Y10T428/31515; Y10T428/31522
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
107 words
A circuit substrate comprising a metal plate laminated with a conductive foil interposing an insulating material wherein said insulating material is made by curing a mixture comprising from 10 to 40 vol % of a bisphenol A epoxy resin purified by molecular distillation having a purity which is equal to or more than 98%, free of organic chlorine and α-glycol impurities and dimer, trimer and oligomers, and from 90 to 60 vol % of an inorganic filler, the thermal conductivity thereof is in the range of 5.0×10 -3 to 18.0×10 -3 cal/°C.·cm·sec and the glass transition temperature thereof is in the range of 164° to 240° C.
Claim 2
Dependent Claim
107 words
A circuit substrate comprising a metal plate laminated with a conductive foil interposing an insulating material wherein said insulating material is made by curing a mixture comprising from 10 to 40 vol % of a bisphenol A epoxy resin purified by molecular distillation having a purity which is equal to or more than 98%, free of organic chlorine and α-glycol impurities and dimer, trimer and oligomers, and from 90 to 60 vol % of an inorganic filler, the thermal conductivity thereof is in the range of 5.0×10 -3 to 18.0×10 -3 cal/°C.·cm·sec and the glass transition temperature thereof is in the range of 164° to 240° C.
Claim 3
Dependent Claim
28 words
The circuit substrate according to claim 1, wherein the inorganic filler comprises at least one element selected from the group consisting of alumina, aluminum nitride and boron nitride.
Claim 4
Dependent Claim
55 words
The circuit substrate according to claim 1, wherein the inorganic filler comprises 60 to 80 vol % of first particles having a mean particle size of 0.5 to 50 μm and 40 to 20 vol % of second particles having a mean particle size of 0.2 to 1.5 μm, the total being 100 vol %.
Claim 5
Dependent Claim
23 words
The circuit substrate according to claim 1, wherein the amount of the inorganic filler is from 60 vol % to 78 vol %.
Claim 6
Dependent Claim
18 words
The circuit substrate according to claim 1, wherein the purity of the epoxy resin is 98.5% or higher.
Claim 7
Dependent Claim
23 words
The circuit substrate according to claim 1, wherein the thermal conductivity thereof is in the range of 5.0×10 -3 to 12.0×10 -3 cal/°C.·cm·sec.
Claim 8
Dependent Claim
21 words
The circuit substrate according to claim 1, wherein the glass transition temperature is in the range of 170° to 240° C.
Claim 9
Dependent Claim
20 words
The circuit substrate according to claim 1, wherein the glass transition temperature is in the range of 190° to 240°.
Claim 10
Dependent Claim
32 words
The circuit substrate according to claim 1, wherein the mixture includes at least one element selected from the group consisting of a silane species coupling agent and a titanate species coupling agent.
Claim 11
Dependent Claim
18 words
The circuit substrate according to claim 1, wherein the mixture includes at least an amine species curing agent.
Claim 12
Dependent Claim
15 words
The circuit substrate according to claim 10, wherein the amine species curing agent is diaminodiphenylmethane.
Claim 13
Dependent Claim
10 words
A module employing the circuit substrate according to claim 1.
Claim 14
Dependent Claim
20 words
A transistor module or a diode module or a solid state relay employing the circuit substrate according to claim 1.
Claim 15
Dependent Claim
15 words
A power module for an automobile engine employing the circuit substrate according to claim 1.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-11-19 | 2000-05-20 | 2000-11-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-11-19 | 2004-05-20 | 2004-11-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-11-19 | 2008-05-20 | 2008-11-19 | $7700.00 | Window Closed / Lapsed |