Reusable carrier for burn-in/testing on non packaged die

Claim 1

A re-usable carrier for mounting a non-packaged die for burn-in and testing comprising a molded base having a configuration and outer perimeter conforming to a standard integrated circuit package design, said base including integrally formed terminals positioned on the outer perimeter and having a shape conforming to the terminals of the standard integrated circuit package design, a thin layer electrically conductive material coated on the integrally formed terminals of the base to form outer circuitry for enabling electrical contact of the terminals with test equipment, said thin layer electrically conductive material extending along said base adjacent said formed terminals to form electrical contacts on the base, a thin layer film construct received on the molded plastic base, said film construct including means for receiving and positioning a non-packaged die with bond pads, and including a printed circuit positioned on the film and engaging the electrical contacts on the base for enabling electrical connection between the outer circuitry positioned on the formed terminals and the bond pads of a received non-packaged die, a cover removably mounted on the molded base for holding the non-packaged die to the film construct and imparting sufficient pressure for maintaining connection between the bond pads of the non-packaged die and the printed circuit on the film, and cover holding means for detachably holding the cover to the molded base, wherein said cover, molded base, film construct and cover holding means form a carrier having a shape and dimension substantially conforming to a standard integrated circuit package design so as to allow use with existing test equipment.