Patent US5572070A successfully refreshed from Google Patents.
US5572070A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit packages with heat dissipation for high current load
Assignee: RJR Polymers Inc
•
Filing: 1995-02-06
•
Granted: 1996-11-05
•
Expires: 2015-02-06
Abstract
Abstract An integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a beta-stageable resin which is preapplied to the lid and which contains a thermally conductive filler material. With the lid in place over the die and substrate board, the package is heated to cause the resin to flow and establish contact with the die. Further heating causes curing of the resin and a permanent thermal bridge between the die and the lid.
Inventors
- 👤 Richard J. Ross
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:34
CPC Classifications
H; H10; H10W; H10W72/00; H10W40/00; H10W40/70; H10W40/20; H10W40/25; H10W40/251; H10W76/00; H10W76/60; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
137 words
A combination of components for assembly into an integrated circuit package, said combination comprising: a substrate bearing a printed circuit which includes an array of electrical contact areas: a die bearing an integrated circuit with conductive leads mounted thereto and arranged to contact said electrical contact areas of said substrate when said die is placed on said substrate: and a concave metal lid sufficiently large to enclose said die when said die and said lid are placed on said substrate; and a thermoplastic heat-curable resin containing a thermally conductive particulate material uniformly dispersed throughout said thermoplastic heat-curable resin and comprising at least about 60% by Weight of said resin, said resin adhering to a concave inner surface of said lid and positioned to contact said die when said die and said lid are placed on said substrate.
Claim 2
Dependent Claim
137 words
A combination of components for assembly into an integrated circuit package, said combination comprising: a substrate bearing a printed circuit which includes an array of electrical contact areas: a die bearing an integrated circuit with conductive leads mounted thereto and arranged to contact said electrical contact areas of said substrate when said die is placed on said substrate: and a concave metal lid sufficiently large to enclose said die when said die and said lid are placed on said substrate; and a thermoplastic heat-curable resin containing a thermally conductive particulate material uniformly dispersed throughout said thermoplastic heat-curable resin and comprising at least about 60% by Weight of said resin, said resin adhering to a concave inner surface of said lid and positioned to contact said die when said die and said lid are placed on said substrate.
Claim 3
Dependent Claim
18 words
A combination in accordance with claim 1 in which said thermoplastic heat-curable resin is a tack-free semi-solid resin.
Claim 4
Dependent Claim
37 words
A combination in accordance with claim 2 in which said tack-tree semi-solid resin is comprised of a member selected from the group consisting of silicones, epoxies, polyurethanes, polyimides, polyolefins, polyesters, phenolic resins, alkyd resins, and acrylic resins.
Claim 5
Dependent Claim
28 words
A combination in accordance with claim 2 in which said thermoplastic heat-curable resin is comprised of a member selected from the group consisting of silicones, epoxies, and polyurethanes.
Claim 6
Dependent Claim
18 words
A combination in accordance with claim 2 in which said thermoplastic heat-curable resin is comprised of an epoxy.
Claim 7
Dependent Claim
35 words
A combination in accordance with claim 1 in which said thermally conductive particulate material is a member selected from the group consisting of alumina, aluminum nitride, silicon nitride, boron nitride, silicon carbide, and combinations thereof.
Claim 8
Dependent Claim
29 words
A combination in accordance with claim 1 in which said thermally conductive particulate material is a member selected from the group consisting of alumina, aluminum nitride, and combinations thereof.
Claim 9
Dependent Claim
28 words
A combination in accordance with claim 1 in which said thermally conductive particulate material comprises from about 60% to about 85% by weight of said thermoplastic heat-curable resin.
Claim 10
Dependent Claim
27 words
A combination in accordance with claim 1 in which said thermally conductive particulate material comprises particles of diameters ranging from about 5 microns to about 20 microns.
Claim 11
Dependent Claim
30 words
A combination in accordance with claim 1 in which said metal lid is formed from a member selected from the group consisting of steel, copper, nickel, zinc, chromium and aluminum.
Claim 12
Dependent Claim
26 words
A combination in accordance with claim 1 in which said metal lid is formed from a member selected from the group consisting of steel and copper.
Claim 13
Dependent Claim
34 words
A combination in accordance with claim 1 further comprising a heat-curable adhesive applied either to said substrate or to a circumferential rim of said lid to bond said lid to said substrate upon curing.
Claim 14
Dependent Claim
54 words
A die cover for an integrated circuit package, comprising: a concavely shaped metal lid; and a thermoplastic heat-curable resin containing a thermally conductive particulate material uniformly dispersed throughout said thermoplastic heat-curable resin and comprising at least about 60% by weight of said resin, said resin adhering to a concave inner surface of said lid.
Claim 15
Dependent Claim
54 words
A die cover for an integrated circuit package, comprising: a concavely shaped metal lid; and a thermoplastic heat-curable resin containing a thermally conductive particulate material uniformly dispersed throughout said thermoplastic heat-curable resin and comprising at least about 60% by weight of said resin, said resin adhering to a concave inner surface of said lid.
Claim 16
Dependent Claim
19 words
A die cover in accordance with claim 13 in which said thermoplastic heat-curable resin is a tack-free semi-solid resin.
Claim 17
Dependent Claim
38 words
A die cover in accordance with claim 14 in which said tack-free semi-solid resin is comprised of a member selected from the group consisting of silicones, epoxies, polyurethanes, polyimides, polyolefins, polyesters, phenolic resins, alkyd resins, and acrylic resins.
Claim 18
Dependent Claim
29 words
A die cover in accordance with claim 14 in which said tack-free semi-solid resin is comprised of a member selected from the group consisting of silicones, epoxies, and polyurethanes.
Claim 19
Dependent Claim
19 words
A die cover in accordance with claim 14 in which said thermoplastic heat-curable resin is comprised of an epoxy.
Claim 20
Dependent Claim
36 words
A die cover in accordance with claim 13 in which said thermally conductive particulate material is a member selected from the group consisting of alumina, aluminum nitride, silicon nitride, boron nitride, silicon carbide, and combinations thereof.
Claim 21
Dependent Claim
30 words
A die cover in accordance with claim 13 in which said thermally conductive particulate material is a member selected from the group consisting of alumina, aluminum nitride, and combinations thereof.
Claim 22
Dependent Claim
29 words
A die cover in accordance with claim 13 in which said thermally conductive particulate material comprises from about 60% to about 85% by weight of said thermoplastic heat-curable resin.
Claim 23
Dependent Claim
28 words
A die cover in accordance with claim 13 in which said thermally conductive particulate material comprises particles of diameters ranging from about 5 microns to about 20 microns.
Claim 24
Dependent Claim
31 words
A die cover in accordance with claim 13 in which said metal lid is formed from a member selected from the group consisting of steel, copper, nickel, zinc, chromium and aluminum.
Claim 25
Dependent Claim
27 words
A die cover in accordance with claim 13 in which said metal lid is formed from a member selected from the group consisting of steel and copper.
References Cited (Backward Citations)
US5455457A
Cited
US5396403A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-11-05 | 2000-05-06 | 2000-11-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-11-05 | 2004-05-06 | 2004-11-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-11-05 | 2008-05-06 | 2008-11-05 | $7700.00 | Window Closed / Lapsed |