Abstract An EEPROM and method for making the same, having precisely shaped field oxide regions and memory cells, to provide improved electrical operating characteristics and increased memory density. A layer of field oxide is grown over an n-type substrate having a p-well and the layer of field oxide is selectively etched to form rows of field oxide. Rows of tunnel oxide are formed between the rows of field oxide. A first layer of polysilicon, or poly-1, is formed over the wafer and a layer of ONO is formed over the poly-1. Using the same mask, the ONO, poly-1, field oxide, and tunnel oxide are stack etched. Bit lines are formed, followed by oxide spacers. A second layer of polysilicon, or poly-2 is formed and selectively etched to form word lines. The exposed ONO and poly-1 are etched using the same mask to form floating gate regions. Subsequent process steps provide word lines to metal dielectric, contacts, metal and passivation.
Inventors
👤 Manzur Gill
Bibliographic Details
Application Number—
JurisdictionUS
Data Sourcegoogle_patents
Last Synchronized2026-11-08 02:21
CPC Classifications
H; H10; H10B; H10B41/00; H10B41/30
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
264 words
An array of electrically erasable and programmable read-only memory cells formed on a semiconductor substrate, the array comprising: a plurality of parallel bit lines formed in the substrate; a plurality of spaced-apart field oxide regions formed on the substrate in rows and columns so that a column of field oxide regions is formed between each adjacent pair of bit lines, each field oxide region having sidewalls; a plurality of channel regions defined in the substrate between each adjacent pair of bit lines so that a channel region is defined between each adjacent pair of field oxide regions in each column of field oxide regions formed between each adjacent pair of bit lines; a plurality of first dielectric regions formed on the plurality of channel regions so that each first dielectric region is formed over a corresponding channel region; a plurality of floating gate regions formed over the plurality of first dielectric regions so that each floating gate region is formed over a corresponding first dielectric region and a part of each adjacent field oxide region, each floating gate region having a a sidewall substantially vertically aligned with a sidewall of each of the adjacent field oxide regions that are partially covered by said each floating gate region; a plurality of second dielectric regions formed over the plurality of floating gate regions so that each second dielectric region is formed over a corresponding floating gate region; and a plurality of control gate regions formed over the plurality of second dielectric regions so that each control gate region is formed over a corresponding second dielectric region.
Claim 2
Dependent Claim
264 words
An array of electrically erasable and programmable read-only memory cells formed on a semiconductor substrate, the array comprising: a plurality of parallel bit lines formed in the substrate; a plurality of spaced-apart field oxide regions formed on the substrate in rows and columns so that a column of field oxide regions is formed between each adjacent pair of bit lines, each field oxide region having sidewalls; a plurality of channel regions defined in the substrate between each adjacent pair of bit lines so that a channel region is defined between each adjacent pair of field oxide regions in each column of field oxide regions formed between each adjacent pair of bit lines; a plurality of first dielectric regions formed on the plurality of channel regions so that each first dielectric region is formed over a corresponding channel region; a plurality of floating gate regions formed over the plurality of first dielectric regions so that each floating gate region is formed over a corresponding first dielectric region and a part of each adjacent field oxide region, each floating gate region having a a sidewall substantially vertically aligned with a sidewall of each of the adjacent field oxide regions that are partially covered by said each floating gate region; a plurality of second dielectric regions formed over the plurality of floating gate regions so that each second dielectric region is formed over a corresponding floating gate region; and a plurality of control gate regions formed over the plurality of second dielectric regions so that each control gate region is formed over a corresponding second dielectric region.
Claim 3
Dependent Claim
25 words
The array of claim 1 wherein each second dielectric region has a sidewall substantially vertically aligned with the sidewall of the corresponding floating gate region.
Claim 4
Dependent Claim
15 words
The array of claim 1 wherein the bit lines comprise alternating source and drain lines.
Claim 5
Dependent Claim
14 words
The array of claim 1 wherein the first dielectric regions are formed from oxide.
Claim 6
Dependent Claim
14 words
The array of claim 1 wherein the floating gate regions are formed from polysilicon.
Claim 7
Dependent Claim
18 words
The array of claim 1 wherein the second dielectric regions are formed from a composite of oxide-nitride-oxide (ONO).
Claim 8
Dependent Claim
14 words
The array of claim 1 wherein the control gate regions are formed from polysilicon.