Wafer scale burn-in apparatus and process

Claim 2

A vessel for burning-in and testing of a semiconductor integrated circuit wafer having a plurality of dice, each die having a plurality of contact pads, which comprises: an upper plate; a lower plate; a printed circuit board (PCB) releasably attached to an undersurface of said upper plate; a plurality of electrically conductive pillars extending downwardly from an undersurface of said PCB; said pillars positioned to precisely contact said pads when said wafer and PCB are brought together in alignment; means for attaching said wafer to said lower plate; said upper plate sized and positioned to impart a substantially uniform vertical force across said PCB and thereby said pillars; said lower plate sized and positioned to impart a substantially uniform vertical force across said wafer; said upper plate being releasably held in a fixed position with respect to said lower plate; wherein both the upper plate and lower plate are comprised of a thermally conductive material for dissipating heat; a heating element integral with said lower plate; and wherein said vessel further comprises: a channel, bored through said lower plate, sized and dimensioned to accommodate gaseous or liquid coolant being circulated through said channel.

Claim 3

The vessel of claim 1 which further comprises a thermal sensor for monitoring the temperature of said wafer.

Claim 4

The vessel of claim 1, wherein said means for attaching said wafer to said lower plate comprise: an adhesive layer between said wafer and said lower plate.

Claim 5

The vessel of claim 3, wherein said adhesive layer provides an adhesion force on each of said dice which is weak enough to be overcome by vacuum pick-up of each of said dice.

Claim 6

The vessel of claim 4, wherein said adhesive layer provides said adhesion force in temperatures ranging from -55 to 125 degrees centigrade.

Claim 7

The vessel of claim 3, wherein said adhesive layer comprises sticky tape.

Claim 8

The vessel of claim 1, wherein said means for attaching said wafer to said lower plate comprise: a recess set into said lower plate sized and dimensioned to accommodate said wafer and to allow for thermal expansion of the wafer and vessel.

Claim 9

The vessel of claim 1, wherein said means for attaching said wafer to said lower plate comprise: a wafer saw carrier frame having said wafer releasably attached thereon; and said frame being releasably attached to said lower plate.

Claim 10

The vessel of claim 1, wherein each of said pillars is made from a material which comprises a conductive polymer epoxy.

Claim 11

The apparatus of claim 9, wherein said material further comprises a plurality of metal shavings mixed with said conductive polymer epoxy.

Claim 12

The apparatus of claim 10, wherein a subset of said metal shavings extends from a lower surface of each of said pillars to form a wiping surface for removing metal oxides from said pads.

Claim 13

The apparatus of claim 11, wherein said material is resilient enough to maintain electrical contact between each of said pads and said PCB during thermal expansion and contraction of said wafer and PCB.

Claim 14

The vessel of claim 1, which further comprises: electronic means for generating signals and power necessary to test said wafer.

Claim 15

A vessel for burning-in and testing of a semiconductor integrated circuit wafer having a plurality of dice, each die having a plurality of contact pads, said vessel comprises: an upper plate; a lower plate; means for electrically contacting a number of said contact pads; means for attaching said wafer to said lower plate; said upper and lower plates being comprised of a thermally conductive material for dissipating heat; means within said lower plate for heating said wafer; and a channel, bored through said lower plate, sized and dimensioned to accommodate gaseous or liquid coolant being circulated through said channel; wherein said means for electrically contacting comprise: a printed circuit board (PCB) attached to an undersurface of said upper plate; a plurality of electrically conductive pillars extending downwardly from an undersurface of said PCB; and said pillars being positioned to contact said number of said pads when said wafer and PCB are brought closely together in alignment; wherein said vessel further comprises: said upper plate being releasably held in a fixed position with respect to said lower plate; said upper plate being sized and positioned to impart a substantially uniform vertical force across said PCB and thereby said pillars; said lower plate being sized and positioned to impart a substantially uniform vertical force across said wafer; means for preventing lateral movement between the upper and lower plates; means for preventing said plates from coming apart; and means for preventing said plates from coming too close together.

Claim 16

A vessel for burning-in and testing of a semiconductor integrated circuit wafer having a plurality of dice, each die having a plurality of contact pads, said vessel comprises: an upper plate; a lower plate; means for electrically contacting a number of said contact pads; means for attaching said wafer to said lower plate; said upper and lower plates being comprised of a thermally conductive material for dissipating heat; means within said lower plate for heating said wafer; and a channel, bored through said lower plate, sized and dimensioned to accommodate gaseous or liquid coolant being circulated through said channel; wherein said means for electrically contacting comprise: a printed circuit board (PCB) attached to an undersurface of said upper plate; a plurality of electrically conductive pillars extending downwardly from an undersurface of said PCB; and said pillars being positioned to contact said number of said pads when said wafer and PCB are brought closely together in alignment; wherein said vessel further comprises: said upper plate being releasably held in a fixed position with respect to said lower plate; said upper plate being sized and positioned to impart a substantially uniform vertical force across said PCB and thereby said pillars; said lower plate being sized and positioned to impart a substantially uniform vertical force across said wafer; means for preventing lateral movement between the upper and lower plates; means for preventing said plates from coming apart; and means for preventing said plates from coming too close together.

Claim 17

The vessel of claim 14, wherein said means for preventing lateral movement comprise: at least two alignment guides extending from said lower plate, sized and dimensioned to slidingly engage holes in said upper plate.

Claim 18

The vessel of claim 15, wherein said means for preventing said plates from coming apart comprise: a fastener, one for each alignment guide, attachable to said alignment guide; and said fastener having a lower surface in contact with an upper surface of said upper plate, thereby preventing upward movement of said upper plate with respect to the alignment guides.

Claim 19

The vessel of claim 14, wherein said means for preventing the plate from coming too close together comprise: at least one spacer sized and dimensioned to contact a lower surface of said upper plate and an upper surface of said lower plate when the plates are brought together thereby preventing further movement of the upper plate toward the lower plate.