Patent US2953235A successfully refreshed from Google Patents.
Patent US5567982A successfully refreshed from Google Patents.
US5567982A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Air-dielectric transmission lines for integrated circuits
Assignee: HP Inc
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Filing: 1994-09-30
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Granted: 1996-10-22
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Expires: 2014-09-30
Abstract
Abstract The present invention provides an interconnect structure which offers good mechanical stability and reduced charge concentration along the metal-insulator boundary corresponding to lower capacitance. The interconnect structure is comprised of a conductive transmission line structure and a transmission line support structure. The support structure has a "railway trestle-like" construction that provides a braced framework to support the transmission line with a greatly reduced effective dielectric constant. The trestle-like construction of the support structure is comprised of a membrane-like structure and supporting base structure separated by column-like support members. Spaces between the column-like support members form air pockets. The surface of the supporting base structure defines a horizontal axis. The long axis of the column-like support members are typically positioned at a 90 degree angle to the horizontal axis, thus defining a vertical axis support.
Inventors
- 👤 Dirk J. Bartelink
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 13:23
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/495; H10W20/01; H10W20/071; H10W20/072; H10W20/45; H10W20/46
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
125 words
An interconnect structure in an integrated circuit device comprising: a first membrane-like structure having first and second opposite surfaces; a supporting base structure having a first surface; a first set of support members positioned between the first surface of the first membrane-like structure and the first surface of the supporting base structure, the first set of support members being generally orthogonal to the first surface of the first membrane-like structure and the first surface of the supporting base structure, the first set of support members being comprised of a dielectric material; and a first conductive structure positioned adjacent to the first membrane-like structure; wherein the sidewalls of the first conductive structure are centered around the sidewalls of a given corresponding first set of support members.
Claim 2
Dependent Claim
125 words
An interconnect structure in an integrated circuit device comprising: a first membrane-like structure having first and second opposite surfaces; a supporting base structure having a first surface; a first set of support members positioned between the first surface of the first membrane-like structure and the first surface of the supporting base structure, the first set of support members being generally orthogonal to the first surface of the first membrane-like structure and the first surface of the supporting base structure, the first set of support members being comprised of a dielectric material; and a first conductive structure positioned adjacent to the first membrane-like structure; wherein the sidewalls of the first conductive structure are centered around the sidewalls of a given corresponding first set of support members.
Claim 3
Dependent Claim
129 words
An interconnect structure in an integrated circuit device comprising: a first membrane-like structure having first and second opposite surfaces; a supporting base structure having a first surface; a first set of support members positioned between the first surface of the first membrane-like structure and the first surface of the supporting base structure, the first set of support members being generally orthogonal to the first surface of the first membrane-like structure and the first surface of the supporting base structure, the first set of support members being comprised of a dielectric material; and a first conductive structure positioned adjacent to the first membrane-like structure; wherein air pockets are formed between the support members, wherein the sidewalls of the first conductive structure are located between the sidewalls of the air pocket.
Claim 4
Dependent Claim
129 words
An interconnect structure in an integrated circuit device comprising: a first membrane-like structure having first and second opposite surfaces; a supporting base structure having a first surface; a first set of support members positioned between the first surface of the first membrane-like structure and the first surface of the supporting base structure, the first set of support members being generally orthogonal to the first surface of the first membrane-like structure and the first surface of the supporting base structure, the first set of support members being comprised of a dielectric material; and a first conductive structure positioned adjacent to the first membrane-like structure; wherein air pockets are formed between the support members, wherein the sidewalls of the first conductive structure are located between the sidewalls of the air pocket.
Claim 5
Dependent Claim
140 words
An interconnect structure in an integrated circuit device comprising: a first membrane-like structure having first and second opposite surfaces; a supporting base structure having a first surface; a first set of support members positioned between the first surface of the first membrane-like structure and the first Surface of the supporting base structure, the first set of support members being generally orthogonal to the first surface of the first membrane-like structure and the first surface of the supporting base structure, the first set of support members being comprised of a dielectric material; and a first conductive structure positioned both adjacent to and below the first membrane-like structure, wherein a first air pocket is formed beneath at least a portion of the first conductive structure: wherein a first surface of the first conductive structure forms a sidewall of a first air pocket.
Claim 6
Dependent Claim
140 words
An interconnect structure in an integrated circuit device comprising: a first membrane-like structure having first and second opposite surfaces; a supporting base structure having a first surface; a first set of support members positioned between the first surface of the first membrane-like structure and the first Surface of the supporting base structure, the first set of support members being generally orthogonal to the first surface of the first membrane-like structure and the first surface of the supporting base structure, the first set of support members being comprised of a dielectric material; and a first conductive structure positioned both adjacent to and below the first membrane-like structure, wherein a first air pocket is formed beneath at least a portion of the first conductive structure: wherein a first surface of the first conductive structure forms a sidewall of a first air pocket.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-22 | 2000-04-22 | 2000-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-22 | 2004-04-22 | 2004-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-22 | 2008-04-22 | 2008-10-22 | $7700.00 | Window Closed / Lapsed |