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US5561406A
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US
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Duplexer package
Assignee: Taiyo Yuden Co Ltd
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Filing: 1995-03-29
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Granted: 1996-10-01
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Expires: 2015-03-29
Abstract
Abstract A multilayer duplexer package is provided, which includes: two surface-acoustic-wave filter chips having different center pass band frequencies; and at least two phase matching circuits for matching the phase of one filter chip to that of the other filter chip, said phase matching circuits respectively comprising strip lines stacked one above another, and said strip lines each having a characteristic impedance higher than the characteristic impedance of an external circuit to be connected to the duplexer package.
Inventors
- 👤 Osamu Ikata
- 👤 Yoshio Satoh
- 👤 Nobuo Hirasawa
- 👤 Hideki Ohmori
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:02
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/70; H03H9/72; H03H9/02; H03H9/05; H03H9/0538; H03H9/0566; H03H9/0576; H03H9/725; H04; H04B; H04B1/00; H04B1/38; H04B1/40; H04B1/50; H04B1/52; H04B1/525
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
74 words
A multilayer duplexer package comprising: two surface-acoustic-wave filter chips having different center pass band frequencies; and at least two phase matching circuits for matching the phase of one filter chip to that of the other filter chip, said phase matching circuits respectively comprising strip lines stacked one above another, and said strip lines each having a characteristic impedance higher than the characteristic impedance of an external circuit to be connected to the duplexer package.
Claim 2
Dependent Claim
74 words
A multilayer duplexer package comprising: two surface-acoustic-wave filter chips having different center pass band frequencies; and at least two phase matching circuits for matching the phase of one filter chip to that of the other filter chip, said phase matching circuits respectively comprising strip lines stacked one above another, and said strip lines each having a characteristic impedance higher than the characteristic impedance of an external circuit to be connected to the duplexer package.
Claim 3
Dependent Claim
32 words
A duplexer package as set forth in claim 1, wherein the characteristic impedance of each of said strip lines is set to a value 1.11 (±7%) times that of said external circuit.
Claim 4
Dependent Claim
21 words
A duplexer package as set forth in claim 1, wherein said strip lines each have different widths at opposite ends thereof.
Claim 5
Dependent Claim
44 words
A duplexer package as set forth in claim 1, wherein the characteristic impedance of each of said strip lines is set to a value 1.11 (±7%) times that of said external circuit, and said strip lines each have different widths at opposite ends thereof.
Claim 6
Dependent Claim
25 words
A duplexer package as set forth in claim 1, 2, 3 or 4, wherein said strip lines and said filter chips are formed in tiers.
Claim 7
Dependent Claim
122 words
A duplexer package as set forth in claim 1, wherein said strip lines each have different widths at opposite ends thereof, further comprising: a common signal terminal for connecting the external circuit thereto, and said strip lines are each connected to the common signal terminal at one end thereof and to the corresponding filter chip at the other end thereof; and said one end of each of said strip lines connected to the common signal terminal has a width narrower than that of said other end thereof connected to the filter chip, so that the width of said each strip line gradually narrows from said other end connected to the filter chip to said one end connected to the common signal terminal.
Claim 8
Dependent Claim
21 words
A duplexer package as set forth in claim 6, wherein said strip lines and said filter chips are formed in tiers.
Claim 9
Dependent Claim
73 words
A duplexer package as set forth in claim 1 or 2, wherein said filter chips each comprise parallel surface-acoustic-wave resonators connected in parallel to a signal line which links the common signal terminal and one of the strip lines, and a serial surface-acoustic-wave resonator connected in series to said signal line, wherein the number of the ground terminals for duplexer package is greater than that of parallel surface-acoustic-wave resonators of the filter chips.
Claim 10
Dependent Claim
21 words
A duplexer package as set forth in claim 8, wherein said parallel surface-acoustic-wave resonators each have at least two ground terminals.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-01 | 2000-04-01 | 2000-10-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-01 | 2004-04-01 | 2004-10-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-01 | 2008-04-01 | 2008-10-01 | $7700.00 | Window Closed / Lapsed |