Vertical grounded coplanar waveguide H-bend interconnection apparatus

Claim 2

A vertical coplanar waveguide (CPW) H-band interconnect apparatus, comprising: a first CPW transmission line, comprising a first dielectric substrate having first and second opposed surfaces, and a first center conductor strip defined on said second surface in a spaced relationship with first and second top conductive ground plane strips; a second CPW transmission line, comprising a second dielectric substrate having third and fourth opposed surfaces, and a second center conductor strip defined on said fourth surface in a spaced relationship with third and fourth top conductive ground plane strips; said second substrate disposed transversely and adjacent to said first substrate such that said first and second center conductor strips, are aligned and in electrical contact, said first and third top ground plane strips are aligned and in electrical contact, and said second and fourth top ground plane strips are aligned and in electrical contact; wherein said first and third top ground plane conductor strips, and said second and fourth top ground plane conductor strips, are respectively electrically connected along a corner interconnect junction between said first and second CPW transmission lines, said first center conductor strip is separated from said first and second ground plane strips by respective first and second gaps, said second center conductor strip is separated from said third and fourth ground plane strips by respective third and fourth gaps, and wherein said first, second, third and fourth gaps have regions of increased gap size adjacent said corner interconnection junction to compensate for capacitive coupling at said junction.

Claim 3

The apparatus of claim 1 wherein said regions of increased gap size are rectilinear in configuration.

Claim 4

The apparatus of claim 1 wherein said regions of increased gap size have a gradual exponential tapered configuration.

Claim 5

The apparatus of claim 1 wherein said regions of increased gap size have a gradual linear tapered configuration.

Claim 6

The apparatus of claim 1 wherein said first and second CPW transmission lines are disposed orthogonally to each other.

Claim 7

A circuit arrangement including at least one printed wiring board (PWB) and at least one microwave integrated circuit (MIC) board arranged orthogonally to the PWB with board-to-board microwave frequency electrical interconnection between the PWB and the MIC board, the PWB including a first dielectric substrate having formed along a first surface center conductor strip and spaced first and second ground plane strips to define a vertical co-planar waveguide (CPW) transmission line, the MIC board including a second dielectric substrate having formed on a third surface a second center conductor strip and spaced third and fourth ground plane strips to define a CPW input/output (I/O) transmission line, an edge of the MIC board in contact with said PWB, and a vertical CPW H-bend interconnection at a junction between said vertical CPW line and said CPW I/O line, said second substrate disposed transversely to said first substrate and in contact with said first substrate such that said first and second center conductor strips are aligned and in electrical contact, said first and third top ground plane strips are aligned and in electrical contact, and said second and fourth top ground plane strips are aligned and in electrical contact, wherein said first and third top ground plane conductor strips, and said second and fourth top ground plane conductor strips, are respectively electrically connected along a corner interconnect junction between said first and second CPW transmission lines, said first center conductor strip is separated from said first and second ground plane strips by respective first and second gaps, said second center conductor strip is separated from said third and fourth ground plane strips by respective third and fourth gaps, and wherein said first, second, third and fourth gaps above regions of increased gap size adjacent said corner interconnection junction to compensate for capacitive coupling at said junction.

Claim 8

A circuit arrangement including at least one printed wiring board (PWB) and at least one microwave integrated circuit (MIC) board arranged orthogonally to the PWB with board-to-board microwave frequency electrical interconnection between the PWB and the MIC board, the PWB including a first dielectric substrate having formed along a first surface center conductor strip and spaced first and second ground plane strips to define a vertical co-planar waveguide (CPW) transmission line, the MIC board including a second dielectric substrate having formed on a third surface a second center conductor strip and spaced third and fourth ground plane strips to define a CPW input/output (I/O) transmission line, an edge of the MIC board in contact with said PWB, and a vertical CPW H-bend interconnection at a junction between said vertical CPW line and said CPW I/O line, said second substrate disposed transversely to said first substrate and in contact with said first substrate such that said first and second center conductor strips are aligned and in electrical contact, said first and third top ground plane strips are aligned and in electrical contact, and said second and fourth top ground plane strips are aligned and in electrical contact, wherein said first and third top ground plane conductor strips, and said second and fourth top ground plane conductor strips, are respectively electrically connected along a corner interconnect junction between said first and second CPW transmission lines, said first center conductor strip is separated from said first and second ground plane strips by respective first and second gaps, said second center conductor strip is separated from said third and fourth ground plane strips by respective third and fourth gaps, and wherein said first, second, third and fourth gaps above regions of increased gap size adjacent said corner interconnection junction to compensate for capacitive coupling at said junction.

Claim 9

The apparatus of claim 6 wherein said regions of increased gap size are rectilinear in configuration.

Claim 10

The apparatus of claim 6 wherein said regions of increased gap size have a gradual exponential tapered configuration.

Claim 11

The apparatus of claim 6 wherein said regions of increased gap size have a gradual linear tapered configuration.

Claim 12

A vertical grounded coplanar waveguide (GCPW) H-band interconnect apparatus, comprising: a first GCPW transmission line, comprising a first dielectric substrate having first and second opposed surfaces, a bottom conductive ground plane defined on said first dielectric surface, and a first center conductor strip defined on said second surface in a spaced relationship with first and second top conductive ground plane strips; a second GCPW transmission line, comprising a second dielectric substrate having third and fourth opposed surfaces, a second bottom conductive ground plane defined on said third dielectric surface, and a second center conductor strip defined on said fourth surface in a spaced relationship with third and fourth top conductive ground plane strips; said second substrate disposed transversely to said first substrate and in contact with said first substrate such that said first and second center conductor strips are aligned and in electrical contact, said first and third top ground plane strips are aligned and in electrical contact, said second and fourth top ground plane strips are aligned and in electrical contact; wherein said first and third top ground plane conductor strips, and said second and fourth top ground plane conductor strips, are respectively electrically connected along a corner interconnect junction between said fist and second GCPW transmission lines, said first center conductor strip is separated from said first and second ground plane strips by respective first and second ground plane strips by respective first and second gaps, said second center conductor strip is separated from said third and fourth ground plane strips by respective third and fourth gaps, and wherein said first, second, third and fourth gaps have regions of increased gap size adjacent said corner interconnection junction to compensate for capacitive coupling at said junction.

Claim 13

A vertical grounded coplanar waveguide (GCPW) H-band interconnect apparatus, comprising: a first GCPW transmission line, comprising a first dielectric substrate having first and second opposed surfaces, a bottom conductive ground plane defined on said first dielectric surface, and a first center conductor strip defined on said second surface in a spaced relationship with first and second top conductive ground plane strips; a second GCPW transmission line, comprising a second dielectric substrate having third and fourth opposed surfaces, a second bottom conductive ground plane defined on said third dielectric surface, and a second center conductor strip defined on said fourth surface in a spaced relationship with third and fourth top conductive ground plane strips; said second substrate disposed transversely to said first substrate and in contact with said first substrate such that said first and second center conductor strips are aligned and in electrical contact, said first and third top ground plane strips are aligned and in electrical contact, said second and fourth top ground plane strips are aligned and in electrical contact; wherein said first and third top ground plane conductor strips, and said second and fourth top ground plane conductor strips, are respectively electrically connected along a corner interconnect junction between said fist and second GCPW transmission lines, said first center conductor strip is separated from said first and second ground plane strips by respective first and second ground plane strips by respective first and second gaps, said second center conductor strip is separated from said third and fourth ground plane strips by respective third and fourth gaps, and wherein said first, second, third and fourth gaps have regions of increased gap size adjacent said corner interconnection junction to compensate for capacitive coupling at said junction.

Claim 14

The apparatus of claim 10 wherein said regions of increased gap size are rectilinear in configuration.

Claim 15

The apparatus of claim 10 wherein said regions of increased gap size have a gradual exponential tapered configuration.

Claim 16

The apparatus of claim 10 wherein said regions of increased gap size have a gradual linear tapered configuration.

Claim 17

The apparatus of claim 12 wherein said first and second GCPW transmission lines are disposed orthogonally to each other.

Claim 18

The apparatus of claim 12 further comprising a plurality of conductive plated through holes formed through said respective first and second dielectric substrates and forming an electrical connection between said bottom ground planes and said top ground plane strips, so that said top ground plane strips of each GCPW are in electrical contact with said corresponding bottom ground plane.

Claim 19

The apparatus of claim 12 wherein said first bottom conductive ground plane is in electrical contact with said second bottom conductive ground plane.

Claim 20

A circuit arrangement including at least one printed wiring board (PWB) and at least one microwave integrated circuit (MIC) board arranged orthogonally to the PWB with board-to-board microwave frequency electrical interconnection between the PWB and the MIC board, the PWB including a first dielectric substrate having formed along a first surface center conductor strip and spaced first and second ground plane strips and on a second dielectric surface a first bottom ground plane to define a vertical grounded coplanar waveguide (GCPW) transmission line, the MIC board including a second dielectric substrate having formed on a third surface a second center conductor strip and spaced third and fourth ground plane strips and on a fourth surface a second bottom ground plane surface to define a GCPW input/output (I/O) transmission line, an edge of the MIC board in contact with aid PWB, and a vertical GCPW H-bend interconnection at a junction between said vertical GCPW line and said CPW I/O line, said second substrate disposed transversely to said first substrate and in contact with said first substrate such that said first and second center conductor strips are aligned and in electrical contact, said first and third top ground plane strips are aligned and in electrical contact, said second and fourth top ground plane strips are aligned and in electrical contact, wherein said first and third top ground plane conductor strips, and said second and fourth top ground plane conductor strips, are respectively electrically connected along a corner interconnect junction between said first and second GCPW transmission lines, said first center conductor strip is separated from said first and second ground plane strips by respective first and second gaps, said second center conductor strip is separated from said third and fourth ground plane strips by respective third and fourth gaps, and wherein said first, second, third and fourth gaps have regions of increased gap size adjacent said corner interconnection junction to compensate for capacitive coupling at said junction.

Claim 21

A circuit arrangement including at least one printed wiring board (PWB) and at least one microwave integrated circuit (MIC) board arranged orthogonally to the PWB with board-to-board microwave frequency electrical interconnection between the PWB and the MIC board, the PWB including a first dielectric substrate having formed along a first surface center conductor strip and spaced first and second ground plane strips and on a second dielectric surface a first bottom ground plane to define a vertical grounded coplanar waveguide (GCPW) transmission line, the MIC board including a second dielectric substrate having formed on a third surface a second center conductor strip and spaced third and fourth ground plane strips and on a fourth surface a second bottom ground plane surface to define a GCPW input/output (I/O) transmission line, an edge of the MIC board in contact with aid PWB, and a vertical GCPW H-bend interconnection at a junction between said vertical GCPW line and said CPW I/O line, said second substrate disposed transversely to said first substrate and in contact with said first substrate such that said first and second center conductor strips are aligned and in electrical contact, said first and third top ground plane strips are aligned and in electrical contact, said second and fourth top ground plane strips are aligned and in electrical contact, wherein said first and third top ground plane conductor strips, and said second and fourth top ground plane conductor strips, are respectively electrically connected along a corner interconnect junction between said first and second GCPW transmission lines, said first center conductor strip is separated from said first and second ground plane strips by respective first and second gaps, said second center conductor strip is separated from said third and fourth ground plane strips by respective third and fourth gaps, and wherein said first, second, third and fourth gaps have regions of increased gap size adjacent said corner interconnection junction to compensate for capacitive coupling at said junction.

Claim 22

The apparatus of claim 17 wherein said regions of increased gap size are rectilinear in configuration.

Claim 23

The apparatus of claim 17 wherein said regions of increased gap size have a gradual exponential tapered configuration.

Claim 24

The apparatus of claim 17 wherein said regions of increased gap size have a gradual linear tapered configuration.

Claim 25

The apparatus of claim 17 further comprising a plurality of conductive plated through holes formed through said respective first and second dielectric substrates and forming an electrical connection between said bottom ground planes and said top ground plane strips, so that said top ground plane strips of each GCPW are in electrical contact with said corresponding bottom ground plane.