US3573670A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High-speed impedance-compensated circuits
Assignee: International Business Machines Corp
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Filing: 1969-03-21
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Granted: 1971-04-06
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Expires: 1989-03-21
Abstract
Abstract Impedance-compensated circuits for high frequency microstrip signal transmission systems comprising a dielectric board of suitable thickness depending upon the dielectric constant of the material of the board and the frequency of the signals to be transmitted within the system. A ground conductor plate is attached to one planar surface of the dielectric board. The other planar surface of the dielectric board is adapted to receive and have affixed thereto any of a plurality of combinations of signal-conducting elements. The signal-conducting elements have predetermined cross-sectional areas depending upon the signals to be transmitted within the system. Due to microminiature construction, the signal-conducting elements may be provided with lead and circuit-connecting areas of increased size to facilitate making electrical connections for devices to be attached with the elements. The impedance changes due to the increased size of areas are compensated for by means of slots or apertures in the ground conductor plate opposite or in the vicinity of the connecting areas.
Inventors
- 👤 John R Skobern
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 17:45
CPC Classifications
H; H01; H01P; H01P3/00; H01P3/02; H01P3/08; H01P3/081; H01P5/00; H01P5/02; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/025; H05K1/0253; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09663; H05K2201/0969; H05K2201/09727; H05K3/00; H05K3/36; H05K3/366
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
124 words
A high-speed impedance-compensated circuits combination, comprising: a. a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board; b. a signal line conductor of predetermined cross-sectional area affixed to one surface of the board; c. a ground conductor plane affixed to the opposite side of the dielectric board; said signal line conductor and the ground conductor plane constituting a transmission line having a predetermined characteristic impedance; and d. an impedance-compensating aperture in the ground conductor plane opposite to and parallel with the signal line conductor, the area of the aperture being predetermined so as to establish and maintain a substantially uniform characteristic impedance and to accommodate the transmission of signals of greater current capacity.
Claim 2
Dependent Claim
124 words
A high-speed impedance-compensated circuits combination, comprising: a. a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board; b. a signal line conductor of predetermined cross-sectional area affixed to one surface of the board; c. a ground conductor plane affixed to the opposite side of the dielectric board; said signal line conductor and the ground conductor plane constituting a transmission line having a predetermined characteristic impedance; and d. an impedance-compensating aperture in the ground conductor plane opposite to and parallel with the signal line conductor, the area of the aperture being predetermined so as to establish and maintain a substantially uniform characteristic impedance and to accommodate the transmission of signals of greater current capacity.
Claim 3
Dependent Claim
24 words
A high-speed impedance-compensated circuits combination as defined in claim 1 wherein the signal line and ground conductor planes are of the printed circuit type.
Claim 4
Dependent Claim
183 words
Impedance compensation for a high-speed circuits arrangement comprising, in combination: a. a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board; b. at least one signal line conductor element of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor element and affixed to one surface of the dielectric board; c. a ground conductor plane affixed to the opposite side of the dielectric board, each of the signal line conductors electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedanced characteristics; d. the signal line conductors being provided with at least one electrical lead-coupling area of increased portions to facilitate lead connections to the signal line; and e. an impedance-compensating aperture in the ground conductor plane opposite each lead-coupling area, the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased due to the increased size of the lead-coupling area.
Claim 5
Dependent Claim
183 words
Impedance compensation for a high-speed circuits arrangement comprising, in combination: a. a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board; b. at least one signal line conductor element of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor element and affixed to one surface of the dielectric board; c. a ground conductor plane affixed to the opposite side of the dielectric board, each of the signal line conductors electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedanced characteristics; d. the signal line conductors being provided with at least one electrical lead-coupling area of increased portions to facilitate lead connections to the signal line; and e. an impedance-compensating aperture in the ground conductor plane opposite each lead-coupling area, the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased due to the increased size of the lead-coupling area.
Claim 6
Dependent Claim
25 words
Impedance compensation for high-speed circuits arrangement as defined in claim 3 wherein the signal line and ground conductor planes are of the printed circuit type.
Claim 7
Dependent Claim
179 words
Impedance compensation for a high-sPeed circuits arrangement comprising, in combination: a. a substrate having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the substrate; b. at least one signal line conductor element of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor element and affixed to one surface of the substrate; c. a ground conductor plane affixed to the opposite side of the substrate, each of the signal line conductors electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedanced characteristics; d. the signal line conductors being provided with at least one electrical lead-coupling area of increased portions to facilitate lead connections to the signal line; and an impedance-compensating aperture in the ground conductor plane opposite each lead-coupling area, the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased due to the increased size of the lead-coupling area.
Claim 8
Dependent Claim
179 words
Impedance compensation for a high-sPeed circuits arrangement comprising, in combination: a. a substrate having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the substrate; b. at least one signal line conductor element of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor element and affixed to one surface of the substrate; c. a ground conductor plane affixed to the opposite side of the substrate, each of the signal line conductors electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedanced characteristics; d. the signal line conductors being provided with at least one electrical lead-coupling area of increased portions to facilitate lead connections to the signal line; and an impedance-compensating aperture in the ground conductor plane opposite each lead-coupling area, the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased due to the increased size of the lead-coupling area.
Claim 9
Dependent Claim
193 words
Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination: a. a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board; b. at least one signal line conductor element of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor elements and affixed to one surface of the dielectric board; c. a ground conductor plane affixed to the opposite side of the dielectric board, each of the signal line conductor elements electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedance characteristics; d. the signal line conductors being provided with corner-coupling pads of increased size terminating the signal lines at the edge of the dielectric board and to facilitate electrical connections with other boards; and e. an impedance-compensating aperture in the ground conductor plane opposite each of the corner-coupling pads, the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased by the increased size of the corner-coupling pads.
Claim 10
Dependent Claim
193 words
Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination: a. a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board; b. at least one signal line conductor element of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor elements and affixed to one surface of the dielectric board; c. a ground conductor plane affixed to the opposite side of the dielectric board, each of the signal line conductor elements electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedance characteristics; d. the signal line conductors being provided with corner-coupling pads of increased size terminating the signal lines at the edge of the dielectric board and to facilitate electrical connections with other boards; and e. an impedance-compensating aperture in the ground conductor plane opposite each of the corner-coupling pads, the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased by the increased size of the corner-coupling pads.
Claim 11
Dependent Claim
27 words
Impedance compensation for a high-speed circuits packaging arrangement as defined in claim 6 wherein the signal lines and ground conductor plane are of the printed circuit type.
Claim 12
Dependent Claim
190 words
Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination: a. a substrate board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the substrate; b. at least one signal line conductor element of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor elements and affixed to one surface of the substrate; c. a ground conductor plane affixed to the opposite side of the substrate, each of the signal line conductor elements electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedance characteristics; d. the signal line conductors being provided with corner-coupling pads of increased size terminating the signal lines at the edge of the substrate and to facilitate electrical connection with other boards; and e. an impedance-compensating aperture in the ground conductor plane opposite each of the corner-coupling pads, the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased by the increased siZe of the corner-coupling pads.
Claim 13
Dependent Claim
190 words
Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination: a. a substrate board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the substrate; b. at least one signal line conductor element of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor elements and affixed to one surface of the substrate; c. a ground conductor plane affixed to the opposite side of the substrate, each of the signal line conductor elements electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedance characteristics; d. the signal line conductors being provided with corner-coupling pads of increased size terminating the signal lines at the edge of the substrate and to facilitate electrical connection with other boards; and e. an impedance-compensating aperture in the ground conductor plane opposite each of the corner-coupling pads, the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased by the increased siZe of the corner-coupling pads.
Claim 14
Dependent Claim
223 words
Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination: a. a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board; b. at least one signal line conductor of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor and affixed to one surface of the dielectric board; c. a ground conductor plane affixed to the opposite side of the dielectric board, each of the signal line conductor elements electrically in combination with the ground conductor planes adapted to functionally operate as a transmission line possessing uniform impedance characteristics; d. the signal line conductor elements being provided with at least one electrical lead-coupling area of increased proportions to facilitate lead connections to the signal line; e. the signal line conductor elements being provided with corner-coupling pads of increased area terminating the signal lines at the edge of the circuit board to facilitate electrical connections with other boards; and f. impedance-compensating apertures in the ground conductor plane opposite each of the lead-coupling areas and the corner-coupling pads, said apertures being of predetermined sizes so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedances would be decreased by the increased size of the lead-coupling area and the corner-coupling pads.
Claim 15
Dependent Claim
223 words
Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination: a. a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board; b. at least one signal line conductor of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor and affixed to one surface of the dielectric board; c. a ground conductor plane affixed to the opposite side of the dielectric board, each of the signal line conductor elements electrically in combination with the ground conductor planes adapted to functionally operate as a transmission line possessing uniform impedance characteristics; d. the signal line conductor elements being provided with at least one electrical lead-coupling area of increased proportions to facilitate lead connections to the signal line; e. the signal line conductor elements being provided with corner-coupling pads of increased area terminating the signal lines at the edge of the circuit board to facilitate electrical connections with other boards; and f. impedance-compensating apertures in the ground conductor plane opposite each of the lead-coupling areas and the corner-coupling pads, said apertures being of predetermined sizes so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedances would be decreased by the increased size of the lead-coupling area and the corner-coupling pads.
Claim 16
Dependent Claim
27 words
Impedance compensation for a high-speed circuits packaging arrangement as defined in claim 9 wherein the signal lines and ground conductor plane are of the printed circuit type.
Claim 17
Dependent Claim
221 words
Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination: a. a substrate having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the substrate; b. at least one signal line conductor of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor and affixed to one surface of the substrate; c. a ground conductor plane affixed to the opposite side of the substrate, each of the signal line conductor elements electrically in combination with the ground conductor planes adapted to functionally operate as a transmission line possessing uniform impedance characteristics; d. the signal line conductor elements being provided with at least one electrical lead-coupling area of increased porportions to facilitate lead connections to the signal line; e. the signal line conductor elements being provided with corner-coupling pads of increased area terminating the signal lines at the edge of the circuit board to facilitate electrical connections with other boards; and f. impedance-compensating apertures in the ground conductor plane opposite each of the lead-coupling areas and the corner coupling pads, said apertures being of predetermined sizes so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedances would be decreased by the increased size of the lead-coupling area and the corner-coupling pads.
Claim 18
Dependent Claim
221 words
Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination: a. a substrate having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the substrate; b. at least one signal line conductor of predetermined cross-sectional area depending upon the signals to be transmitted over said signal line conductor and affixed to one surface of the substrate; c. a ground conductor plane affixed to the opposite side of the substrate, each of the signal line conductor elements electrically in combination with the ground conductor planes adapted to functionally operate as a transmission line possessing uniform impedance characteristics; d. the signal line conductor elements being provided with at least one electrical lead-coupling area of increased porportions to facilitate lead connections to the signal line; e. the signal line conductor elements being provided with corner-coupling pads of increased area terminating the signal lines at the edge of the circuit board to facilitate electrical connections with other boards; and f. impedance-compensating apertures in the ground conductor plane opposite each of the lead-coupling areas and the corner coupling pads, said apertures being of predetermined sizes so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedances would be decreased by the increased size of the lead-coupling area and the corner-coupling pads.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-04-05 | 1974-10-05 | 1975-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-04-05 | 1978-10-05 | 1979-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-04-05 | 1982-10-05 | 1983-04-06 | $7700.00 | Window Closed / Lapsed |