Method for ball bumping a semiconductor device

Claim 1

A method for ball bumping a semiconductor device comprising the steps of: providing a semiconductor die having a bond pad; providing a wire bonding tool having a capillary, wherein the capillary has a feed hole therethrough for receiving a wire, a flat bottom face, and a chamfer surrounding the feed hole at the flat bottom face; forming a ball bond on the bond pad by positioning the capillary in a first position, lowering the capillary toward the bond pad, and applying a force to form a ball bond, without breaking the wire; raising the capillary away from the bond pad, without breaking the wire; horizontally displacing the capillary to a second position; and flattening the ball bond to form a ball bump having a flat top surface, wherein flattening is achieved by lowering the capillary from the second position toward the bond pad and forcibly pressing a portion of the flat bottom face against the ball bump, wherein during lowering the capillary a center of the feed hole is beyond a perimeter of the ball bump formed and wherein during pressing the top surface of the ball bump is entirely in contact with the bottom face of the capillary.

Claim 2

A method for ball bumping a semiconductor device comprising the steps of: providing a semiconductor die having a bond pad; providing a wire bonding tool having a capillary, wherein the capillary has a feed hole therethrough for receiving a wire, a flat bottom face, and a chamfer surrounding the feed hole at the flat bottom face; forming a ball bond on the bond pad by positioning the capillary in a first position, lowering the capillary toward the bond pad, and applying a force to form a ball bond, without breaking the wire; raising the capillary away from the bond pad, without breaking the wire; horizontally displacing the capillary to a second position; and flattening the ball bond to form a ball bump having a flat top surface, wherein flattening is achieved by lowering the capillary from the second position toward the bond pad and forcibly pressing a portion of the flat bottom face against the ball bump, wherein during lowering the capillary a center of the feed hole is beyond a perimeter of the ball bump formed and wherein during pressing the top surface of the ball bump is entirely in contact with the bottom face of the capillary.

Claim 10

A method for ball bumping a semiconductor device comprising the steps of: providing a semiconductor die having a bond pad formed on a surface thereof; providing a wire bonding tool having a capillary, wherein the capillary has a bottom face, an outer diameter, a feed hole extending to the bottom face, and a chamfer between the bottom face and the feed hole; providing a wire through the feed hole of the capillary; first lowering the capillary and the wire therein toward the bond pad such that the chamfer is approximately centered over the bond pad, and making contact between the wire and the bond pad in a first bonding action to form a ball bond; first raising the capillary and the wire therein above the ball bond; horizontally moving the capillary and the wire therein by a distance; and second lowering the capillary and the wire therein toward the semiconductor die and flattening the ball bond with a portion of the bottom face of the capillary in a second bonding action to form a ball bump; wherein the step of horizontally moving comprises horizontally moving the capillary by a distance wherein upon second lowering the capillary, an entirety of the chamfer is at least at a peripheral edge of the ball bump; and wherein the step of second lowering comprises lowering the capillary to form a single flat surface across a top of the ball bump as a result of the bottom face of the capillary being in contact across the top of the ball bump.

Claim 11

A method for ball bumping a semiconductor device comprising the steps of: providing a semiconductor die having a bond pad formed on a surface thereof; providing a wire bonding tool having a capillary, wherein the capillary has a bottom face, an outer diameter, a feed hole extending to the bottom face, and a chamfer between the bottom face and the feed hole; providing a wire through the feed hole of the capillary; first lowering the capillary and the wire therein toward the bond pad such that the chamfer is approximately centered over the bond pad, and making contact between the wire and the bond pad in a first bonding action to form a ball bond; first raising the capillary and the wire therein above the ball bond; horizontally moving the capillary and the wire therein by a distance; and second lowering the capillary and the wire therein toward the semiconductor die and flattening the ball bond with a portion of the bottom face of the capillary in a second bonding action to form a ball bump; wherein the step of horizontally moving comprises horizontally moving the capillary by a distance wherein upon second lowering the capillary, an entirety of the chamfer is at least at a peripheral edge of the ball bump; and wherein the step of second lowering comprises lowering the capillary to form a single flat surface across a top of the ball bump as a result of the bottom face of the capillary being in contact across the top of the ball bump.

Claim 17

A method for ball bumping a semiconductor die comprising the steps of: providing a semiconductor die having a bond pad; providing a wire bonding capillary having a bottom face, a feed hole, and a chamfer at an end of the feed hole near the bottom face, wherein the bottom face has an outer diameter, and has a width measured from an outer edge of the bottom face to the chamfer; providing a wire within the feed hole of the capillary; forming a ball bond on the bond pad by lowering the capillary toward the bond pad and forcibly pressing the wire to the bond pad; raising the capillary away from the bond pad; displacing the capillary by a horizontal distance; and flattening the ball bond to form a ball bump by lowering the capillary and forcibly contacting the bottom face of the capillary against the ball bond, wherein as a result of forcibly contacting, the ball bump formed has a diameter at a top surface of the ball bump which is at most equal to the width of the bottom face of the capillary.

Claim 18

A method for ball bumping a semiconductor die comprising the steps of: providing a semiconductor die having a bond pad; providing a wire bonding capillary having a bottom face, a feed hole, and a chamfer at an end of the feed hole near the bottom face, wherein the bottom face has an outer diameter, and has a width measured from an outer edge of the bottom face to the chamfer; providing a wire within the feed hole of the capillary; forming a ball bond on the bond pad by lowering the capillary toward the bond pad and forcibly pressing the wire to the bond pad; raising the capillary away from the bond pad; displacing the capillary by a horizontal distance; and flattening the ball bond to form a ball bump by lowering the capillary and forcibly contacting the bottom face of the capillary against the ball bond, wherein as a result of forcibly contacting, the ball bump formed has a diameter at a top surface of the ball bump which is at most equal to the width of the bottom face of the capillary.