US5557508A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High-density circuit module and method of producing the same
Assignee: Panasonic Holdings Corp
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Filing: 1993-12-02
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Granted: 1996-09-17
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Expires: 2013-12-02
Abstract
Abstract Single flat metal sheet blank in which thin metallic parts including side frames which are to form side walls, a shield plate and external lead and the like are connected together in a developed state in positional relationships necessary for the assembly of the high-density circuit module. A circuit board is then placed on one side of the shield plate of the flat metal sheet blank. Terminals having pedestals are formed on the shield plate. The terminals are inserted into holes formed in the circuit board and connected to conductors on the circuit board. Then, operations such as severance or bending are effected on selected connecting portions at which the thin metallic parts arranged in developed state are inter-connected, and required processings are executed on the portions to be jointed, whereby the circuit module is completed. According to this production method, a space for receiving circuit components is formed between the circuit board and the shield plate, so that both sides of the circuit board can be used for mounting the circuit components, whereby a high packaging density is attained.
Inventors
- 👤 Teruhiro Sato
- 👤 Tomio Wada
- 👤 Yoshiyuki Hirayama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 14:50
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0007; H05K9/0049; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3405; H05K3/3447; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10371; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/10871; H05K2201/10886; H05K2201/10924; Y; Y10; Y10S; Y10S174/00; Y10S174/34; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49128
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
206 words
A method of producing a high-density circuit module, comprising the steps of: (a) preparing a single flat metal sheet blank having thin metallic parts which are to form side walls, a shield plate having terminals formed thereon and external leads of said circuit module, said thin metallic parts being connected to the shield plate at connecting portions in positional relationships necessary for assembly of said module; (b) placing a circuit board on one side of said shield plate of said flat metal sheet blank; (c) forming holes in said circuit board; (d) inserting said terminals formed on said shield plate into said holes formed in said circuit board; and (e) performing operations including severing or bending selected ones of said connecting portions at which said thin metallic parts are connected to the shield plate, and effecting required processing on portions to be jointed, wherein: at least one of said terminals inserted into said holes in said circuit board and formed on said shield plate is provided with a pedestal which supports said circuit board to provide a clearance between said shield plate and said circuit board to enable a circuit component to be mounted on said circuit board between said circuit board and said shield plate.
Claim 2
Independent Claim
206 words
A method of producing a high-density circuit module, comprising the steps of: (a) preparing a single flat metal sheet blank having thin metallic parts which are to form side walls, a shield plate having terminals formed thereon and external leads of said circuit module, said thin metallic parts being connected to the shield plate at connecting portions in positional relationships necessary for assembly of said module; (b) placing a circuit board on one side of said shield plate of said flat metal sheet blank; (c) forming holes in said circuit board; (d) inserting said terminals formed on said shield plate into said holes formed in said circuit board; and (e) performing operations including severing or bending selected ones of said connecting portions at which said thin metallic parts are connected to the shield plate, and effecting required processing on portions to be jointed, wherein: at least one of said terminals inserted into said holes in said circuit board and formed on said shield plate is provided with a pedestal which supports said circuit board to provide a clearance between said shield plate and said circuit board to enable a circuit component to be mounted on said circuit board between said circuit board and said shield plate.
Claim 3
Dependent Claim
52 words
A method of producing a high-density circuit module according to claim 1, further comprising coupling a shield case to said shield plate and wherein step (b) includes placing said circuit board on one side of said shield plate, whereby said circuit board is shielded by said shield plate and said shield case.
Claim 4
Dependent Claim
76 words
A method of producing a high-density circuit module according to claim 1, wherein at least one of said terminals inserted into said holes in said circuit board and formed on said shield plate is provided with an internal shield which cooperates with said pedestal to provide said clearance between said shield plate and said circuit board to enable a circuit component to be mounted on said circuit board between said circuit board and said shield plate.
Claim 5
Independent Claim
207 words
A method of producing a high-density circuit module, comprising the steps of: (a) preparing a single flat metal sheet blank having thin metallic parts which are to form side walls, a shield plate having terminals formed thereon and external leads of said circuit module, said thin metallic parts being connected to the shield plate at connecting portions in positional relationships necessary for assembly of said module; (b) placing a circuit board on one side of said shield plate of said flat metal sheet blank; (c) forming holes in said circuit board; (d) inserting said terminals formed on said shield plate into said holes formed in said circuit board; and (e) performing operations including severing or bending selected ones of said connecting portions at which said thin metallic parts are connected to the shield plate, and effecting required processing or portions to be jointed, wherein: at least one of said terminals inserted into said holes in said circuit board and formed on said shield plate is provided with an internal shield which supports said circuit board to provide a clearance between said shield plate and said circuit board to enable a circuit component to be mounted on said circuit board between said circuit board and said shield plate.
Claim 6
Independent Claim
207 words
A method of producing a high-density circuit module, comprising the steps of: (a) preparing a single flat metal sheet blank having thin metallic parts which are to form side walls, a shield plate having terminals formed thereon and external leads of said circuit module, said thin metallic parts being connected to the shield plate at connecting portions in positional relationships necessary for assembly of said module; (b) placing a circuit board on one side of said shield plate of said flat metal sheet blank; (c) forming holes in said circuit board; (d) inserting said terminals formed on said shield plate into said holes formed in said circuit board; and (e) performing operations including severing or bending selected ones of said connecting portions at which said thin metallic parts are connected to the shield plate, and effecting required processing or portions to be jointed, wherein: at least one of said terminals inserted into said holes in said circuit board and formed on said shield plate is provided with an internal shield which supports said circuit board to provide a clearance between said shield plate and said circuit board to enable a circuit component to be mounted on said circuit board between said circuit board and said shield plate.
Claim 7
Dependent Claim
52 words
A method of producing a high-density circuit module according to claim 4, further comprising coupling a shield case to said shield plate and wherein step (b) includes placing said circuit board on one side of said shield plate, whereby said circuit board is shielded by said shield plate and said shield case.
Claim 8
Dependent Claim
215 words
A high-density circuit module, comprising: a single flat metal sheet blank having thin metallic parts which are to form side walls, a shield plate having terminals formed thereon and external leads of said circuit module, said thin metallic parts being connected to the shield plate at connecting portions in positional relationships necessary for assembly of said module; and a circuit board placed on one side of said shield plate of said flat metal sheet blank and having holes formed therein; wherein: said terminals of said shield plate are received in said holes formed in said circuit board; said terminals of said shield plate are connected to conductors or said circuit board; at least some of said thin metallic parts are bent relative to said shield plate at said connecting portions and others of said thin metallic parts have portions adapted to be severed from said sheet blank after assembly of said module; and at least one of said terminals inserted into said holes in said circuit board and formed on said shield plate is provided with a pedestal which supports said circuit board to provide a clearance between said shield plate and said circuit board to enable a circuit component to be mounted on said circuit board between said circuit board and said shield plate.
Claim 9
Dependent Claim
215 words
A high-density circuit module, comprising: a single flat metal sheet blank having thin metallic parts which are to form side walls, a shield plate having terminals formed thereon and external leads of said circuit module, said thin metallic parts being connected to the shield plate at connecting portions in positional relationships necessary for assembly of said module; and a circuit board placed on one side of said shield plate of said flat metal sheet blank and having holes formed therein; wherein: said terminals of said shield plate are received in said holes formed in said circuit board; said terminals of said shield plate are connected to conductors or said circuit board; at least some of said thin metallic parts are bent relative to said shield plate at said connecting portions and others of said thin metallic parts have portions adapted to be severed from said sheet blank after assembly of said module; and at least one of said terminals inserted into said holes in said circuit board and formed on said shield plate is provided with a pedestal which supports said circuit board to provide a clearance between said shield plate and said circuit board to enable a circuit component to be mounted on said circuit board between said circuit board and said shield plate.
Claim 10
Dependent Claim
72 words
A high-density circuit module as in claim 6, wherein at least one of said terminals inserted into said holes in said circuit board and formed on said shield plate is provided with an internal shield which cooperates with said pedestal to provide said clearance between said shield plate and said circuit board to enable a circuit component to be mounted on said circuit board between said circuit board and said shield plate.
Claim 11
Dependent Claim
217 words
A high-density circuit module, comprising: a single flat metal sheet blank having thin metallic parts which aide to form side walls, a shield plate having terminals to formed thereon and external leads of said circuit module, said thin metallic parts being connected to the shield plate at connecting portions in positional relationships necessary for assembly of said module; and a circuit board placed on one side of said shield plate of said flat metal sheet blank and having holes formed therein; wherein: said terminals of said shield plate are received in said holes formed in said circuit board; said terminals of said shield plate are connected to conductors on said circuit board; at least some of said thin metallic parts are bent relative to said shield plate at said connecting portions and others of said thin metallic parts have portions adapted to be severed from said sheet blank after assembly of said module; and at least one of said terminals inserted into said holes in said circuit board and formed on said shield plate is provided with an internal shield which supports said circuit board to provide a clearance between said shield plate and said circuit board to enable a circuit component to be mounted on said circuit board between said circuit board and said shield plate.
Claim 12
Dependent Claim
217 words
A high-density circuit module, comprising: a single flat metal sheet blank having thin metallic parts which aide to form side walls, a shield plate having terminals to formed thereon and external leads of said circuit module, said thin metallic parts being connected to the shield plate at connecting portions in positional relationships necessary for assembly of said module; and a circuit board placed on one side of said shield plate of said flat metal sheet blank and having holes formed therein; wherein: said terminals of said shield plate are received in said holes formed in said circuit board; said terminals of said shield plate are connected to conductors on said circuit board; at least some of said thin metallic parts are bent relative to said shield plate at said connecting portions and others of said thin metallic parts have portions adapted to be severed from said sheet blank after assembly of said module; and at least one of said terminals inserted into said holes in said circuit board and formed on said shield plate is provided with an internal shield which supports said circuit board to provide a clearance between said shield plate and said circuit board to enable a circuit component to be mounted on said circuit board between said circuit board and said shield plate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-09-17 | 2000-03-18 | 2000-09-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-09-17 | 2004-03-18 | 2004-09-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-09-17 | 2008-03-18 | 2008-09-17 | $7700.00 | Window Closed / Lapsed |