Fabrication of high-frequency device

Abstract

Abstract PURPOSE:To allow easy and highly efficient fabrication by first mounting on a printed board a metallic board wherein each of parts in layout is linked by a press through a linking part, and then separating such linking part. CONSTITUTION:A wiring part 2, an inductance part 3, a capacitance part 4, a shielding part 5, etc.. are formed on a press worked metallic board 6. These parts are linked by linking parts 8. By separating the linking parts 8 after mounting this metallic board 6 on a printed board, it is not necessary to mount the parts one by one, thereby allowing an easy, highly efficient fabrication of high-frequency devices.

Inventors

• 👤 Kameyoshi Ishimoto
• 👤 Nobuyoshi Hizuka
• 👤 Isao Ariyoshi

Bibliographic Details