Heat dissipating arrangement in a portable computer

Claim 2

Apparatus, comprising: a first printed circuit board having an opening therein and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being plated with a thermally-conductive material, said layer of etch being in thermally-conductive contact with said thermally-conductive material; a second printed circuit board having an integrated circuit mounted thereon, said second printed circuit board being disposed relative to said first printed circuit board such that said integrated circuit is substantially aligned with said opening in said first printed circuit board; and a thermally-conductive slug disposed in said opening of said first printed circuit board in contact with the plated sides thereof, said slug in said first printed circuit board being in physical contact and in a thermally-conductive relationship with said integrated circuit on said second printed circuit board and in a thermally-conductive relationship with said layer of etch in said first printed circuit board to effect heat transfer therebetween.

Claim 3

Apparatus according to claim 1, wherein said thermally-conductive slug is soldered to the plating of said opening.

Claim 4

Apparatus according to claim 1, wherein said thermally-conductive slug is force-fit into said opening.

Claim 5

Apparatus according to claim 1, wherein said plating material extends to a portion of an outer surface of said first printed circuit board surrounding said opening, and wherein said thermally-conductive slug is generally cylindrical in shape and has an upper flange portion overlapping said surrounding portion of said outer surface and contacting the portion of said plating material thereon.

Claim 6

Apparatus according to claim 1, wherein said second printed circuit board is a daughtercard electrically and mechanically coupled to said first printed circuit board.

Claim 7

Apparatus, comprising: a first printed circuit board having an opening therethrough and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being coated with a thermally-conductive material, said layer of etch being in thermally-conductive relationship with said thermally-conductive material; a second printed circuit board having an integrated circuit mounted thereon, said second printed circuit board being disposed adjacent one side of said first printed circuit board such that said integrated circuit is substantially aligned with said opening in said first printed circuit board; a thermally-conductive slug disposed in said opening of said first printed circuit board in thermally-conductive contact with the coated sides thereof, said thermally-conductive slug being in a thermally-conductive relationship with said integrated circuit; and a thermally-conductive plate, being different in kind from said integrated circuit, disposed on the opposite side of said first printed circuit board from said second printed circuit board and being in a thermally-conductive relationship with said thermally-conductive slug to effect heat transfer between said integrated circuit on said second printed circuit board and said plate.

Claim 8

Apparatus, comprising: a first printed circuit board having an opening therethrough and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being coated with a thermally-conductive material, said layer of etch being in thermally-conductive relationship with said thermally-conductive material; a second printed circuit board having an integrated circuit mounted thereon, said second printed circuit board being disposed adjacent one side of said first printed circuit board such that said integrated circuit is substantially aligned with said opening in said first printed circuit board; a thermally-conductive slug disposed in said opening of said first printed circuit board in thermally-conductive contact with the coated sides thereof, said thermally-conductive slug being in a thermally-conductive relationship with said integrated circuit; and a thermally-conductive plate, being different in kind from said integrated circuit, disposed on the opposite side of said first printed circuit board from said second printed circuit board and being in a thermally-conductive relationship with said thermally-conductive slug to effect heat transfer between said integrated circuit on said second printed circuit board and said plate.

Claim 9

Apparatus according to claim 6, wherein said thermally-conductive plate is a rigid base plate of a keyboard disposed on the opposite side of said first printed circuit board from said integrated circuit.

Claim 10

Apparatus, comprising: a housing; a printed circuit board secured to said housing, said printed circuit board having an opening therethrough and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being coated with a thermally-conductive material, said layer of etch being in a thermally-conductive relationship with said thermally-conductive material; a thermally-conductive slug disposed in said opening of said printed circuit board in thermally-conductive contact with the plated sides thereof, said slug being in a thermally-conductive relationship with said layer of etch; a keyboard attached to said housing closely spaced apart from one side of said printed circuit board, said keyboard having a thermally-conductive baseplate at the underside thereof in a thermally-conductive relationship with said thermally-conductive slug; and an integrated circuit disposed on the other side of said printed circuit board from said baseplate, said integrated circuit being substantially aligned with said opening and in a thermally-conductive relationship with the other end of said thermally-conductive slug to effect heat transfer between said integrated circuit and said baseplate.

Claim 11

Apparatus, comprising: a housing; a printed circuit board secured to said housing, said printed circuit board having an opening therethrough and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being coated with a thermally-conductive material, said layer of etch being in a thermally-conductive relationship with said thermally-conductive material; a thermally-conductive slug disposed in said opening of said printed circuit board in thermally-conductive contact with the plated sides thereof, said slug being in a thermally-conductive relationship with said layer of etch; a keyboard attached to said housing closely spaced apart from one side of said printed circuit board, said keyboard having a thermally-conductive baseplate at the underside thereof in a thermally-conductive relationship with said thermally-conductive slug; and an integrated circuit disposed on the other side of said printed circuit board from said baseplate, said integrated circuit being substantially aligned with said opening and in a thermally-conductive relationship with the other end of said thermally-conductive slug to effect heat transfer between said integrated circuit and said baseplate.

Claim 12

Apparatus according to claim 8, further comprising a daughtercard on which is mounted said integrated circuit, said daughtercard being electrically and mechanically coupled to said printed circuit board, and wherein said housing has an opening larger than and substantially aligned with said daughtercard to enable the removal thereof from the apparatus.

Claim 13

Apparatus according to claim 8, further comprising a daughtercard on which is mounted said integrated circuit, said daughtercard being electrically and mechanically coupled to said printed circuit board, and further comprising a bolt extending through said daughtercard and said printed circuit board and into said baseplate of said keyboard to urgingly secure said baseplate, said slug, and said integrated circuit together.

Claim 14

Apparatus, comprising: a first printed circuit board having an opening therethrough and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being coated with a thermally-conductive material, said layer of etch being in a thermally-conductive relationship with said thermally-conductive material; a thermally-conductive slug disposed in said opening of said first printed circuit board, said slug being in a thermally-conductive relationship with said coated sides of said opening and with said layer of etch; a second printed circuit board having an integrated circuit mounted thereon, said second printed circuit board being disposed relative to said first printed circuit board such that said integrated circuit is substantially aligned with said opening in said first printed circuit board; and a layer of thermal grease being interposed between and in physical contact with said thermally-conductive slug in said opening of said first printed circuit board and said integrated circuit on said second printed circuit board for transferring heat therebetween.

Claim 15

Apparatus, comprising: a first printed circuit board having an opening therethrough and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being coated with a thermally-conductive material, said layer of etch being in a thermally-conductive relationship with said thermally-conductive material; a thermally-conductive slug disposed in said opening of said first printed circuit board, said slug being in a thermally-conductive relationship with said coated sides of said opening and with said layer of etch; a second printed circuit board having an integrated circuit mounted thereon, said second printed circuit board being disposed relative to said first printed circuit board such that said integrated circuit is substantially aligned with said opening in said first printed circuit board; and a layer of thermal grease being interposed between and in physical contact with said thermally-conductive slug in said opening of said first printed circuit board and said integrated circuit on said second printed circuit board for transferring heat therebetween.

Claim 16

Apparatus according to claim 11, wherein said first printed circuit board has a plurality of through-holes extending through said first printed circuit board adjacent said opening, the sides of said through-holes being coated with said thermally-conductive material to form thermal vias that effect heat transfer through said first printed circuit board.

Claim 17

Apparatus according to claim 12, wherein said through-holes are in a thermally-conductive relationship with said layer of etch to effect heat transfer between said layer of etch and said through-holes.

Claim 18

Apparatus according to claim 12, wherein said coating material extends to an outer surface of said first printed circuit board surrounding said opening, and said slug has a upper flange portion that overlaps said through-holes and is in thermally-conductive relationship with said coating material for effecting heat transfer between said slug and said through-holes.

Claim 19

Apparatus according to claim 11, wherein said thermally-conductive slug is soldered to the coating of said opening.

Claim 20

Apparatus according to claim 11, wherein said thermally-conductive slug is force-fit into said opening.

Claim 21

Apparatus according to claim 11, wherein said coating material extends to a portion of an outer surface of said first printed circuit board surrounding said opening, and wherein said thermally-conductive slug is generally cylindrical in shape and has an upper flange portion overlapping said surrounding portion of said outer surface and contacting the portion of said coating material thereon.

Claim 22

Apparatus according to claim 11, wherein said second printed circuit board is a daughtercard electrically and mechanically coupled to said first printed circuit board.

Claim 23

Apparatus according to claim 1, wherein said first printed circuit board has a plurality of through-holes extending through said first printed circuit board adjacent said opening, the sides of said through-holes being coated with said thermally-conductive material to form thermal vias that effect heat transfer through said first printed circuit board.

Claim 24

Apparatus according to claim 19, wherein said through-holes are in thermally-conductive relationship with said layer of etch to effect heat transfer between said layer of etch and said through-holes.

Claim 25

Apparatus according to claim 19, wherein said plating material extends to an outer surface of said first printed circuit board surrounding said opening, and said slug has an upper flange portion that overlaps said through-holes and is in thermally-conductive relationship with said plaing material for effecting heat transfer between said slug and said through-holes.