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US5557252A Expired / Lapsed US ⏱️ 0.0 years remaining

Thick film circuit board and method of manufacturing the same

Assignee: Mitsubishi Electric Corp
•
Filing: 1994-05-09
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Granted: 1996-09-17
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Expires: 2014-05-09
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Abstract

Abstract A thick film circuit board includes a substrate, a thick film resistor on the substrate and having a trimming region and a protecting element on the substrate for protecting the thick film resistor and having a window through which the trimming region is exposed. The protecting element may be a protective coating disposed on the substrate. Alternatively, the protective element may be a protective frame extending along an external periphery of a region where the thick film resistor is located on the substrate and having a height for protecting the thick film resistor from mechanical damage.

Inventors

  • 👤 Shogo Ariyoshi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 17:07
CPC Classifications
H; H01; H01C; H01C17/00; H01C17/22; H01C17/24; H01C17/245; H01C17/242

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 68 words
A thick film circuit board comprising: a substrate; a thick film resistor disposed on said substrate and having a trimming region; an overcoat covering all of said substrate and said thick film resistor; and a protective coating disposed on said substrate partially covering and protecting said thick film resistor and having a window through which the trimming region of said thick film resistor is exposed through said overcoat.
Claim 2
Dependent Claim 68 words
A thick film circuit board comprising: a substrate; a thick film resistor disposed on said substrate and having a trimming region; an overcoat covering all of said substrate and said thick film resistor; and a protective coating disposed on said substrate partially covering and protecting said thick film resistor and having a window through which the trimming region of said thick film resistor is exposed through said overcoat.
Claim 3
Dependent Claim 17 words
The thick film circuit board according to claim 1 wherein said protective coating comprises an epoxy resin.
Claim 4
Dependent Claim 15 words
The thick film circuit board according to claim 1 wherein said overcoat is a glass.
Claim 5
Independent Claim 63 words
A method of manufacturing a thick film circuit board comprising: providing on a substrate a thick film resistor having a trimming region; depositing an overcoat over all of said substrate and said thick film resistor; forming a protective coating on said overcoat and having a window through which the trimming region is exposed; and trimming said thick film resistor at said trimming region.
Claim 6
Independent Claim 63 words
A method of manufacturing a thick film circuit board comprising: providing on a substrate a thick film resistor having a trimming region; depositing an overcoat over all of said substrate and said thick film resistor; forming a protective coating on said overcoat and having a window through which the trimming region is exposed; and trimming said thick film resistor at said trimming region.
Claim 7
Dependent Claim 21 words
The method of claim 4 including depositing a glass on said overcoat and depositing an epoxy resin as said protective coating.

References Cited (Backward Citations)

US4439754A Cited
US4580030A Cited
JPS6292331A Cited
US5087961A Cited
JPH01161840A Cited
US5168430A Cited
US5253010A Cited
FR2651923A1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-09-17 2000-03-18 2000-09-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-09-17 2004-03-18 2004-09-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-09-17 2008-03-18 2008-09-17 $7700.00 Window Closed / Lapsed

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