US5557252A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thick film circuit board and method of manufacturing the same
Assignee: Mitsubishi Electric Corp
•
Filing: 1994-05-09
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Granted: 1996-09-17
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Expires: 2014-05-09
Abstract
Abstract A thick film circuit board includes a substrate, a thick film resistor on the substrate and having a trimming region and a protecting element on the substrate for protecting the thick film resistor and having a window through which the trimming region is exposed. The protecting element may be a protective coating disposed on the substrate. Alternatively, the protective element may be a protective frame extending along an external periphery of a region where the thick film resistor is located on the substrate and having a height for protecting the thick film resistor from mechanical damage.
Inventors
- 👤 Shogo Ariyoshi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:53
CPC Classifications
H; H01; H01C; H01C17/00; H01C17/22; H01C17/24; H01C17/245; H01C17/242
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
68 words
A thick film circuit board comprising: a substrate; a thick film resistor disposed on said substrate and having a trimming region; an overcoat covering all of said substrate and said thick film resistor; and a protective coating disposed on said substrate partially covering and protecting said thick film resistor and having a window through which the trimming region of said thick film resistor is exposed through said overcoat.
Claim 2
Dependent Claim
68 words
A thick film circuit board comprising: a substrate; a thick film resistor disposed on said substrate and having a trimming region; an overcoat covering all of said substrate and said thick film resistor; and a protective coating disposed on said substrate partially covering and protecting said thick film resistor and having a window through which the trimming region of said thick film resistor is exposed through said overcoat.
Claim 3
Dependent Claim
17 words
The thick film circuit board according to claim 1 wherein said protective coating comprises an epoxy resin.
Claim 4
Dependent Claim
15 words
The thick film circuit board according to claim 1 wherein said overcoat is a glass.
Claim 5
Independent Claim
63 words
A method of manufacturing a thick film circuit board comprising: providing on a substrate a thick film resistor having a trimming region; depositing an overcoat over all of said substrate and said thick film resistor; forming a protective coating on said overcoat and having a window through which the trimming region is exposed; and trimming said thick film resistor at said trimming region.
Claim 6
Independent Claim
63 words
A method of manufacturing a thick film circuit board comprising: providing on a substrate a thick film resistor having a trimming region; depositing an overcoat over all of said substrate and said thick film resistor; forming a protective coating on said overcoat and having a window through which the trimming region is exposed; and trimming said thick film resistor at said trimming region.
Claim 7
Dependent Claim
21 words
The method of claim 4 including depositing a glass on said overcoat and depositing an epoxy resin as said protective coating.
References Cited (Backward Citations)
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JPS6292331A
Cited
US5087961A
Cited
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Cited
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FR2651923A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-09-17 | 2000-03-18 | 2000-09-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-09-17 | 2004-03-18 | 2004-09-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-09-17 | 2008-03-18 | 2008-09-17 | $7700.00 | Window Closed / Lapsed |