Patent US5548160A successfully refreshed from Google Patents.
US5548160A
Expired / Lapsed
US
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Method and structure for attaching a semiconductor die to a lead frame
Assignee: Micron Technology Inc
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Filing: 1994-11-14
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Granted: 1996-08-20
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Expires: 2014-11-14
Abstract
Abstract A structure for attaching a semiconductor wafer section to a lead frame comprises a carrier having an outside surface and an adhesive coating the carrier. Prior to use, the structure can be placed onto spools for easy shipment and storage.
Inventors
- 👤 Tim J. Corbett
- 👤 Walter L. Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 01:20
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/073; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
52 words
A semiconductor device comprising: a) a semiconductor wafer section; b) a lead frame; c) a carrier having a generally circular cross section and an outside surface; d) an adhesive coating said outside surface of said carrier, wherein said carrier and said adhesive are interposed between said wafer section and said lead frame.
Claim 2
Dependent Claim
52 words
A semiconductor device comprising: a) a semiconductor wafer section; b) a lead frame; c) a carrier having a generally circular cross section and an outside surface; d) an adhesive coating said outside surface of said carrier, wherein said carrier and said adhesive are interposed between said wafer section and said lead frame.
Claim 3
Dependent Claim
22 words
The semiconductor device of claim 1 wherein said adhesive is a material selected from the group consisting of polymer, thermoplastic, and thermoset.
Claim 4
Dependent Claim
23 words
The semiconductor device of claim 1 wherein said carrier is a material selected from the group consisting of plastic, polyimide, polymer, and metal.
Claim 5
Dependent Claim
37 words
The semiconductor device of claim 1 wherein said wafer section comprises a circuit side and a back side, and wherein said circuit side of said wafer section is attached to said lead frame with said adhesive-coated carrier.
Claim 6
Dependent Claim
26 words
The semiconductor device of claim 1 wherein said carrier is a cord having a length and a width, said length being substantially greater than said width.
Claim 7
Dependent Claim
37 words
A structure for attaching a semiconductor wafer section to a lead frame comprising: a) a carrier having a generally circular cross section and an outside surface; and b) an adhesive coating said outside surface of said carrier.
Claim 8
Dependent Claim
37 words
A structure for attaching a semiconductor wafer section to a lead frame comprising: a) a carrier having a generally circular cross section and an outside surface; and b) an adhesive coating said outside surface of said carrier.
Claim 9
Dependent Claim
21 words
The structure of claim 6 wherein said adhesive is a material selected from the group consisting of polymer, thermoplastic, and thermoset.
Claim 10
Dependent Claim
22 words
The structure of claim 6 wherein said carrier is a material selected from the group consisting of plastic, polyimide, polymer, and metal.
Claim 11
Dependent Claim
25 words
The structure of claim 6 wherein said carrier is a cord having a length and a width, said length being substantially greater than said width.
Claim 12
Dependent Claim
20 words
The structure of claim 6 wherein said carrier has a diameter of between about 0.05 mils and about 10 mils.
Claim 13
Dependent Claim
55 words
A semiconductor device comprising: a) a semiconductor wafer section; b) a support for receiving said wafer section; c) a carrier having an outside surface and a generally circular cross section; d) an adhesive coating said outside surface of said carrier, wherein said carrier and said adhesive are interposed between said wafer section and said support.
Claim 14
Dependent Claim
55 words
A semiconductor device comprising: a) a semiconductor wafer section; b) a support for receiving said wafer section; c) a carrier having an outside surface and a generally circular cross section; d) an adhesive coating said outside surface of said carrier, wherein said carrier and said adhesive are interposed between said wafer section and said support.
Claim 15
Dependent Claim
22 words
The semiconductor device of claim 11 wherein a bond line between said wafer section and said support is determined by said carrier.
Claim 16
Dependent Claim
20 words
The semiconductor device of claim 11 wherein said carrier has a diameter of between about 0.05 mils and 10 mils.
Claim 17
Dependent Claim
17 words
The semiconductor device of claim 11 wherein said semiconductor device is a leads over chip (LOC) device.
Claim 18
Dependent Claim
22 words
The semiconductor device of claim 11 wherein said adhesive is a material selected from the group consisting of polymer, thermoplastic, and thermoset.
Claim 19
Dependent Claim
23 words
The semiconductor device of claim 11 wherein said carrier is a material selected from the group consisting of plastic, polyimide, polymer, and metal.
Claim 20
Dependent Claim
20 words
The semiconductor device of claim 11 wherein a plurality of strands of carrier attach said wafer section to said support.
Claim 21
Dependent Claim
22 words
The structure of claim 11 wherein said carrier has a length and a width, said length being substantially greater than said width.
Claim 22
Dependent Claim
36 words
A structure for attaching a semiconductor wafer section to a support comprising: a) a carrier having a generally circular cross section and an outside surface; and b) an adhesive coating said outside surface of said carrier.
Claim 23
Dependent Claim
36 words
A structure for attaching a semiconductor wafer section to a support comprising: a) a carrier having a generally circular cross section and an outside surface; and b) an adhesive coating said outside surface of said carrier.
Claim 24
Dependent Claim
21 words
The structure of claim 19 wherein said adhesive is a material selected from the group consisting of polymer, thermoplastic, and thermoset.
Claim 25
Dependent Claim
22 words
The structure of claim 19 wherein said carrier is a material selected from the group consisting of plastic, polyimide, polymer, and metal.
Claim 26
Dependent Claim
20 words
The structure of claim 19 wherein said carrier has a diameter of between about 0.05 mils and about 10 mils.
Claim 27
Dependent Claim
14 words
The structure of claim 19 wherein said carrier is generally oval in cross section.
Claim 28
Dependent Claim
14 words
The structure of claim 19 wherein said carrier is generally elliptical in cross section.
Claim 29
Dependent Claim
22 words
The structure of claim 19 wherein said carrier has a length and a width, said length being substantially greater than said width.
Claim 30
Dependent Claim
55 words
A semiconductor device comprising: a) a semiconductor wafer section; b) a support for receiving said wafer section; c) a carrier having a generally elliptical cross section and an outside surface; d) an adhesive coating said outside surface of said carrier, wherein said carrier and said adhesive are interposed between said wafer section and said support.
Claim 31
Dependent Claim
55 words
A semiconductor device comprising: a) a semiconductor wafer section; b) a support for receiving said wafer section; c) a carrier having a generally elliptical cross section and an outside surface; d) an adhesive coating said outside surface of said carrier, wherein said carrier and said adhesive are interposed between said wafer section and said support.
Claim 32
Dependent Claim
23 words
The semiconductor device of claim 26 wherein said carrier has a length and a width, said length being substantially greater than said width.
Claim 33
Dependent Claim
14 words
The structure of claim 26 wherein said carrier is generally oval in cross section.
References Cited (Backward Citations)
US5304842A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-08-20 | 2000-02-19 | 2000-08-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-08-20 | 2004-02-19 | 2004-08-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-08-20 | 2008-02-19 | 2008-08-20 | $7700.00 | Window Closed / Lapsed |