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US5546890A Expired / Lapsed US ⏱️ 0.0 years remaining

Removing interhalogen compounds from semiconductor manufacturing equipment

Assignee: RPX Corp
•
Filing: 1995-02-21
•
Granted: 1996-08-20
•
Expires: 2015-02-21
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Abstract

Abstract Inert gas is introduced in and then discharged from the inside of a pneumatic device such as a chamber, a pipe or the like which is used for producing semiconductor devices and through which interhalogen compound gas passes. Then, gas having humidity exceeding 1% is introduced into the chamber or the like. Before the gas having humidity exceeding 1% is introduced into the chamber or the like, the interhalogen compound gas in the chamber or the like is lowered in concentration to such an extent that the inner wall of the chamber or the like is not corroded. Thereafter, when the gas having humidity exceeding 1% is introduced, the interhalogen compound (for example, ClF3 gas) is decomposed into a substance such as HF or the like of which toxicity is low and of which adsorptivity to the inner wall of the chamber or the like is also low. Thereafter, the inside of the chamber or the like is opened to atmosphere. Thus, when the method above-mentioned is used for opening, to atmosphere, the inside of a pneumatic device which is used for producing semiconductor devices and in which etching, CVD, cleaning or the like is executed using interhalogen compound gas, this prevents not only the inner wall of the pneumatic device from being corroded, but also the human body from being adversely affected.

Inventors

  • 👤 Tokuhiko Tamaki
  • 👤 Shinichi Imai

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 03:18
CPC Classifications
B; B08; B08B; B08B9/00; B08B9/02; B08B9/027; B08B9/032; H; H10; H10P; H10P50/00; C; C30; C30B; C30B25/00; C30B25/02; C30B25/14; Y; Y10; Y10S; Y10S438/00; Y10S438/905

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 181 words
A method of opening to the atmosphere the inside of a component of a system used for producing semiconductor devices and through which interhalgen compound gas passes in a hermetically sealed manner, said method comprising: a. stopping the flow of gas through the semiconductor device producing system; b. cleaning a component of the semiconductor device producing system containing a residual interhalogen compound gas by passing an inert gas through said component until the concentration of said residual interhalogen compound gas in said component is reduced to about 10 ppm and discharging said inert gas from said component into a processing device; c. then cleaning said component through which said inert gas has been passed and discharged with a gas having a humidity exceeding 1% to decompose the remnants of said residual interhalogen compound gas into a substance and reducing the concentration of said residual interhalogen gas in the component to about 0.1 ppm and discharging said gas having a humidity exceeding 1% into said processing device; and d. opening to the atmosphere said component from which said substance has been discharged.
Claim 2
Independent Claim 181 words
A method of opening to the atmosphere the inside of a component of a system used for producing semiconductor devices and through which interhalgen compound gas passes in a hermetically sealed manner, said method comprising: a. stopping the flow of gas through the semiconductor device producing system; b. cleaning a component of the semiconductor device producing system containing a residual interhalogen compound gas by passing an inert gas through said component until the concentration of said residual interhalogen compound gas in said component is reduced to about 10 ppm and discharging said inert gas from said component into a processing device; c. then cleaning said component through which said inert gas has been passed and discharged with a gas having a humidity exceeding 1% to decompose the remnants of said residual interhalogen compound gas into a substance and reducing the concentration of said residual interhalogen gas in the component to about 0.1 ppm and discharging said gas having a humidity exceeding 1% into said processing device; and d. opening to the atmosphere said component from which said substance has been discharged.
Claim 3
Dependent Claim 38 words
The method of opening, according to claim 1, wherein said interhalogen compound gas is at least one selected from the group consisting of ClF 3 gas, BrF 3 gas, BrF 5 gas, BrCl gas and IF 3 gas.
Claim 4
Dependent Claim 17 words
The method of opening according to claim 1, wherein said gas having humidity exceeding 1% is air.
Claim 5
Dependent Claim 30 words
The method of then opening according to claim 1, wherein said step of cleaning a component with inert gas and discharging said inert gas is repeated a plurality of times.
Claim 6
Dependent Claim 33 words
The method of opening according to claim 1, wherein said step of cleaning a component with a gas having a humidity exceeding 1% and discharging said gas is repeated a plurality of times.
Claim 7
Dependent Claim 71 words
The method of opening according to claim 1, wherein said step of cleaning said component with an inert gas involves increasing the pressure in said component with the inert gas before beginning the discharging of said inert gas, and wherein said step of cleaning said component with a gas having a humidity exceeding 1% involves increasing the pressure in said component with said gas before beginning the discharging of said gas.
Claim 8
Dependent Claim 54 words
The method of opening according to claim 1, wherein said step of cleaning a component with inert gas and discharging said inert gas is repeated a plurality of times, and wherein said step of cleaning a component with a gas having a humidity exceeding 1% and discharging said gas is repeated plurality of times.

References Cited (Backward Citations)

US4464222A Cited
US4369031A Cited
JPH01152274A Cited
US5089441A Cited
JPH04323389A Cited
US5212118A Cited
JPH05243163A Cited
US5348587A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-08-20 2000-02-19 2000-08-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-08-20 2004-02-19 2004-08-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-08-20 2008-02-19 2008-08-20 $7700.00 Window Closed / Lapsed

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