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US5546340A Expired / Lapsed US ⏱️ 0.0 years remaining

Non-volatile memory array with over-erase correction

Assignee: Cypress Semiconductor Corp
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Filing: 1995-06-13
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Granted: 1996-08-13
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Expires: 2015-06-13
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Abstract

Abstract A non-volatile memory device is provided having various electrical couplings for maximizing over-erased correction of that device. Over-erased devices within an array can be corrected in bulk, simultaneous with all other devices within the array. Bulk correction of an array of over-erased device is carried forth in a convergence technique which utilizes higher floating gate injection currents. Negatively biased substrate causes an enhancement in the injection current and resulting correction capability of the convergence operation. Moreover, convergence can be carried out with a lesser positive voltage upon the drain region, which implies a reduction in the source-to-drain currents as well as substrate currents during the convergence operation. Accordingly, only over-erased transistors receive sufficient turn-on during convergence, while all other transistors remain off. An array of over-erased and normal transistors undergoing the present convergence operation can be simultaneously corrected with a lessened concern with power consumption.

Inventors

  • 👤 Chung-You Hu
  • 👤 Robert B. Richart
  • 👤 Shyam G. Garg
  • 👤 Sanjay K. Banerjee

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 18:23
CPC Classifications
G; G11; G11C; G11C16/00; G11C16/02; G11C16/06; G11C16/34; G11C16/3404; G11C16/3409

Claims Analysis

Total Claims: 26
Claim 1
Independent Claim 81 words
A method for correcting an over-erase condition within a non-volatile memory array, comprising: providing a non-volatile memory array having a plurality of single transistor memory cells, each memory cell comprising a stacked pair of control and floating gates spaced above a channel region interposed between a source and drain region; and applying a non-negative voltage to the control gate, a ground voltage to the source region, a negative voltage to the channel region, and a positive voltage to the drain region.
Claim 2
Independent Claim 81 words
A method for correcting an over-erase condition within a non-volatile memory array, comprising: providing a non-volatile memory array having a plurality of single transistor memory cells, each memory cell comprising a stacked pair of control and floating gates spaced above a channel region interposed between a source and drain region; and applying a non-negative voltage to the control gate, a ground voltage to the source region, a negative voltage to the channel region, and a positive voltage to the drain region.
Claim 3
Dependent Claim 34 words
The method as recited in claim 1, wherein said providing step comprises patterning the stacked pair of control and floating gates from a stacked pair of polysilicon layers having a dielectric layer interposed therebetween.
Claim 4
Dependent Claim 32 words
The method as recited in claim 1, wherein said providing step comprises implanting dopant ions into said source and drain regions after said stacked pair of control and floating gates are formed.
Claim 5
Dependent Claim 18 words
The method as recited in claim 1, wherein said dopant ions are twice implanted into said source region.
Claim 6
Dependent Claim 30 words
The method as recited in claim 1, wherein said channel region comprises a portion of a single crystalline substrate material, wherein said portion is adapted to receive a negative voltage.
Claim 7
Dependent Claim 21 words
The method as recited in claim 1, wherein said negative voltage is a voltage having an absolute magnitude greater than 0.5.
Claim 8
Dependent Claim 21 words
The method as recited in claim 1, wherein said negative voltage is a voltage having an absolute magnitude greater than 1.0.
Claim 9
Dependent Claim 21 words
The method as recited in claim 1, wherein said positive voltage is a voltage having an absolute magnitude less than 5.0.
Claim 10
Dependent Claim 21 words
The method as recited in claim 1, wherein said positive voltage is a voltage having an absolute magnitude less than 4.5.
Claim 11
Dependent Claim 18 words
The method as recited in claim 1, wherein said non-negative voltage is between 0.0 volts and 3.0 volts.
Claim 12
Dependent Claim 25 words
The method as recited in claim 1, as a result of said applying step, inducing electrons onto said floating gate for neutralizing positive charge thereon.
Claim 13
Independent Claim 95 words
A method for neutralizing positive charge upon a plurality of floating gates connected within a memory array, comprising: providing an array of transistors having a respective plurality of floating gates spaced from a single silicon substrate, said transistors are coupled between a common power supply and a plurality of bit lines; and connecting a positive voltage simultaneously to each of said plurality of bit lines, connecting a ground voltage to said common power supply, and connecting a negative voltage to said silicon substrate to cause neutralization of positive charge upon said plurality of floating gates.
Claim 14
Independent Claim 95 words
A method for neutralizing positive charge upon a plurality of floating gates connected within a memory array, comprising: providing an array of transistors having a respective plurality of floating gates spaced from a single silicon substrate, said transistors are coupled between a common power supply and a plurality of bit lines; and connecting a positive voltage simultaneously to each of said plurality of bit lines, connecting a ground voltage to said common power supply, and connecting a negative voltage to said silicon substrate to cause neutralization of positive charge upon said plurality of floating gates.
Claim 15
Dependent Claim 29 words
The method as recited in claim 12, further comprising a control gate dielectrically spaced from said floating gate, wherein said control gate is electrically coupled to a non-negative voltage.
Claim 16
Dependent Claim 36 words
The method as recited in claim 12, wherein said connecting step comprises forming a current exceeding 1×10 -13 amperes through said floating gate at a floating gate voltage less than threshold turn-on voltage of the transistors.
Claim 17
Dependent Claim 27 words
The method as recited in claim 14, wherein said current is sufficient to move negative charge upon said floating gate to substantially neutralize the positive charge thereon.
Claim 18
Dependent Claim 36 words
The method as recited in claim 12, wherein said connecting step comprises forming a current exceeding 5×10 -13 amperes into said floating gate at a floating gate voltage less than threshold turn-on voltage of the transistors.
Claim 19
Dependent Claim 27 words
The method as recited in claim 16, wherein said current is sufficient to move negative charge upon said floating gate to substantially neutralize the positive charge thereon.
Claim 20
Dependent Claim 16 words
The method as recited in claim 12, wherein said positive voltage is less than 5.0 volts.
Claim 21
Dependent Claim 32 words
The method as recited in claim 12, wherein said neutralization of positive charge occurs at a variable rate simultaneously across all of said plurality of floating gates within said array of transistors.
Claim 22
Dependent Claim 18 words
The method as recited in claim 12, wherein said non-negative voltage is between 0.0 volts and 3.0 volts.
Claim 23
Dependent Claim 108 words
A single transistor memory cell, comprising: a floating gate conductor dielectrically spaced above a silicon substrate into which a drain and source region are formed; a control gate dielectrically spaced above said floating gate; an electric field extending in a curved path from said source to said floating gate upon application of positive voltage to said drain, negative voltage to said substrate, ground voltage to said source, and non-negative voltage to said control gate; and hot electrons carried along said field for injection into said floating gate, an amount of said hot electrons being injected is in proportion to an amount of positive charge upon said floating gate.
Claim 24
Dependent Claim 108 words
A single transistor memory cell, comprising: a floating gate conductor dielectrically spaced above a silicon substrate into which a drain and source region are formed; a control gate dielectrically spaced above said floating gate; an electric field extending in a curved path from said source to said floating gate upon application of positive voltage to said drain, negative voltage to said substrate, ground voltage to said source, and non-negative voltage to said control gate; and hot electrons carried along said field for injection into said floating gate, an amount of said hot electrons being injected is in proportion to an amount of positive charge upon said floating gate.
Claim 25
Dependent Claim 49 words
The memory cell as recited in claim 21, wherein movement of said hot electrons along said field incurs the formation of a floating gate injection current exceeding 1×10 -13 amperes at a floating gate voltage less than the floating gate threshold turn-on voltage of the single transistor memory cell.
Claim 26
Dependent Claim 49 words
The memory cell as recited in claim 21, wherein movement of said hot electrons along said field incurs the formation of a floating gate injection current exceeding 5×10 -13 amperes at a floating gate voltage less than the floating gate threshold turn-on voltage of the single transistor memory cell.

References Cited (Backward Citations)

US4958321A Cited
US5077691A Cited
US5272669A Cited
US5241507A Cited
US5237535A Cited
US5295107A Cited
US5335198A Cited
US5424993A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-08-13 2000-02-12 2000-08-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-08-13 2004-02-12 2004-08-13 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-08-13 2008-02-12 2008-08-13 $7700.00 Window Closed / Lapsed

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