Abstract It is an object of the present invention to provide a semiconductor device which has a high electrical isolation capability and an enhanced electrical reliability for avoiding short circuit of individual conductive layers, and the present invention also provides a method of manufacturing such a semiconductor device. An n + buried layer and an n - epitaxial growth layer are formed on a p - silicon substrate. An element isolation oxide film having a through hole is formed on the surface of n - epitaxial growth layer. A trench which penetrates through n - epitaxial growth layer and n + buried layer to reach a predetermined depth of p - silicon substrate is formed under through hole. A first insulating layer covers the internal wall of trench. A covering layer covers the sidewall of through hole. A filling layer is formed to fill trench so that the top surface thereof is located within through hole. A second insulating layer is formed on filling layer.
A semiconductor device having an element isolation structure in which a trench isolation and an oxide film isolation are combined, comprising: a silicon substrate having a main surface and a trench formed at the main surface; an element isolation oxide film formed above said trench and having a through hole communicating with said trench; a first insulating layer covering an internal wall of said trench; a covering layer comprising a material different from the element isolation oxide film formed to cover a sidewall of said through hole so as to contact said first insulating layer; a filling layer filling said trench and having a top surface thereof located within said through hole; and a second insulating layer formed on said filling layer to fill said through hole, wherein said covering layer comprises a material different from that of the filling layer.
Claim 2
Dependent Claim
141 words
A semiconductor device having an element isolation structure in which a trench isolation and an oxide film isolation are combined, comprising: a silicon substrate having a main surface and a trench formed at the main surface; an element isolation oxide film formed above said trench and having a through hole communicating with said trench; a first insulating layer covering an internal wall of said trench; a covering layer comprising a material different from the element isolation oxide film formed to cover a sidewall of said through hole so as to contact said first insulating layer; a filling layer filling said trench and having a top surface thereof located within said through hole; and a second insulating layer formed on said filling layer to fill said through hole, wherein said covering layer comprises a material different from that of the filling layer.