Antenna feed and beamforming network

Claim 2

A multibeam phased array which is integrated into a compact package that comprises: a bonded stripline array package that includes a plurality of planar radiating elements that are etched on said array package and are capable of providing either linear or circular polarization; a supplemental array of amplifier modules for respective ones of said radiating elements wherein each of said modules contains a MMIC isolator and a bandpass filter; a multilevel bonded stripline beam-forming network providing multiple beam outputs; and an interface interconnected between said supplemental array of amplifier modules and said beamforming network; wherein said beamforming network comprises a plurality of adjacent circuit boards that have M input ports and N output ports, wherein M and N are integers, in which interconnections take place between said adjacent circuit boards by plated through holes, wherein adjacent pairs of said circuit boards are stacked and bonded, and wherein electrical coupling between adjacent pairs of said circuit boards is by quarter-wavelength overlaps separated by bonding film.

Claim 3

The phased array claimed in claim 1, further including a heat-sink coupled to said array of amplifier modules for removing heat.

Claim 4

A multibeam phased array which is integrated into a compact package that comprises: a bonded stripline array package that includes a plurality of planar radiating elements that are etched on said array package and are capable of providing either linear or circular polarization; a supplemental array of amplifier modules for respective ones of said radiating elements wherein each of said modules contains a MMIC isolator and a bandpass filter; a multilevel bonded stripline beam-forming network providing multiple beam outputs; an interface interconnected between said supplemental array of amplifier modules and said beamforming network; and wherein said beamforming network comprises a plurality of wilkinson power dividers within isolation resistors which can be coupled by quarter-wavelength overlaps to facilitate resistor testing.

Claim 5

A multibeam phased array which is integrated into a compact package that comprises: a bonded stripline array package that includes a plurality of planar radiating elements that are etched on said array package and are capable of providing either linear or circular polarization; a supplemental array of amplifier modules for respective ones of said radiating elements wherein each of said modules contains a MMIC isolator and a bandpass filter; a multilevel bonded stripline beam-forming network providing multiple beam outputs; an interface interconnected between said supplemental array of amplifier modules and said beamforming network; and wherein said beamforming network comprises a plurality of wilkinson power dividers within isolation resistors which can be coupled by quarter-wavelength overlaps to facilitate resistor testing.

Claim 6

An M-beam phased array antenna assembly, comprising: a first multilevel stripline package comprising N annular planar radiating elements, all of which are formed on a surface of said stripline package, and N RF couplers, said N radiating elements providing one of linear and circular polarization; N amplifiers having outputs coupled to said N RF couplers; a second multilevel stripline package comprising N, M-way power dividers each of which has an output coupled to one of said N amplifiers and M inputs, wherein M and N are integers, individual ones of said M inputs being coupled to an output of M, N-way power dividers having N outputs and one input, wherein said second multilevel stripline package is comprised of a plurality of stacked circuit boards in which individual ones of pairs of circuit boards are disposed back-to-back and are electrically coupled together by feedthroughs, and wherein adjacent circuit boards of adjacent pairs of circuit boards are electrically coupled together by tuned RF coupling means.

Claim 7

An M-beam phased array antenna assembly, comprising: a first multilevel stripline package comprising N annular planar radiating elements, all of which are formed on a surface of said stripline package, and N RF couplers, said N radiating elements providing one of linear and circular polarization; N amplifiers having outputs coupled to said N RF couplers; a second multilevel stripline package comprising N, M-way power dividers each of which has an output coupled to one of said N amplifiers and M inputs, wherein M and N are integers, individual ones of said M inputs being coupled to an output of M, N-way power dividers having N outputs and one input, wherein said second multilevel stripline package is comprised of a plurality of stacked circuit boards in which individual ones of pairs of circuit boards are disposed back-to-back and are electrically coupled together by feedthroughs, and wherein adjacent circuit boards of adjacent pairs of circuit boards are electrically coupled together by tuned RF coupling means.

Claim 8

An M-beam phased array antenna assembly as set forth in claim 4, wherein at least a stripline length of said M, N-way power dividers determines a shape and spatial location of said M beams.

Claim 9

An M-beam phased array antenna assembly as set forth in claim 4, wherein M is equal to 16 and N is equal to 91.

Claim 10

An. M-beam phased array antenna assembly as set forth in claim 4, wherein said M-beam phased array antenna assembly is carried aboard a communications satellite.

Claim 11

An M-beam phased array antenna assembly, comprising: a first multilevel stripline package comprising N annular planar radiating elements, all of which are formed on a surface of said stripline package, and N RF couplers, said N radiating elements providing one of linear and circular polarization; N amplifiers having outputs coupled to said N RF couplers; a second multilevel stripline package comprising N, M-way power dividers each of which has an output coupled to one of said N amplifiers and M inputs, wherein M and N are integers, individual ones of said M inputs being coupled to an output of M, N-way power dividers having N outputs and one input, wherein said second multilevel stripline package is comprised of a plurality of stacked circuit boards in which individual ones of pairs of circuit boards are disposed back-to-back and are electrically coupled together by feedthroughs, and wherein adjacent circuit boards of adjacent pairs of circuit boards are electrically coupled together by RF coupling means comprised of quarter-wavelength overlapping lines that are separated one from another by a film.

Claim 12

An M-beam phased array antenna assembly, comprising: a first multilevel stripline package comprising N annular planar radiating elements, all of which are formed on a surface of said stripline package, and N RF couplers, said N radiating elements providing one of linear and circular polarization; N amplifiers having outputs coupled to said N RF couplers; a second multilevel stripline package comprising N, M-way power dividers each of which has an output coupled to one of said N amplifiers and M inputs, wherein M and N are integers, individual ones of said M inputs being coupled to an output of M, N-way power dividers having N outputs and one input, wherein said second multilevel stripline package is comprised of a plurality of stacked circuit boards in which individual ones of pairs of circuit boards are disposed back-to-back and are electrically coupled together by feedthroughs, and wherein adjacent circuit boards of adjacent pairs of circuit boards are electrically coupled together by RF coupling means comprised of quarter-wavelength overlapping lines that are separated one from another by a film.