Abstract Disclosed is an improved burn-in and test method of semiconductor wafers each having numerous integrated circuits formed therein. It includes the steps of dividing each semiconductor wafer into blocks each including some integrated circuits; giving each block an address to indicate in which part of the semiconductor wafer the integrated circuits of the block are placed; recording the addresses of all blocks; preparing burn-in boards each having sockets to detachably hold carriers each bearing an identification code; loading each carrier with a block to be tested; fitting each carrier in a selected socket in the burn-in board; and carrying out the burn-in and required tests on the blocks of each burn-in board. Analysis of test results permits the locating of defective integrated circuits, if any in semiconductor wafers in terms of the recorded addresses of the blocks and the identification codes of the carriers.
A burn-in test method of a semiconductor wafer having a plurality of integrated circuits formed therein to be divided as respective bare dies, comprising the steps of: dividing said semiconductor wafer into a plurality of blocks to be tested, each block including at least two bare dies; assigning to each block positional information to indicate in which part of the semiconductor wafer the bare dies of each block are placed and recording the positional information; preparing a burn-in board having a plurality of sockets to detachably hold a carrier and loading each carrier with one of said blocks to be tested; fitting each carrier in a selected socket in the burn-in board and carrying out the burn-in test on the blocks in said burn-in board; and determining the defective part of the semiconductor wafer which includes at least one defective bare die based on the positional information assigned to the block as a result of said burn-in test.
Claim 2
Dependent Claim
158 words
A burn-in test method of a semiconductor wafer having a plurality of integrated circuits formed therein to be divided as respective bare dies, comprising the steps of: dividing said semiconductor wafer into a plurality of blocks to be tested, each block including at least two bare dies; assigning to each block positional information to indicate in which part of the semiconductor wafer the bare dies of each block are placed and recording the positional information; preparing a burn-in board having a plurality of sockets to detachably hold a carrier and loading each carrier with one of said blocks to be tested; fitting each carrier in a selected socket in the burn-in board and carrying out the burn-in test on the blocks in said burn-in board; and determining the defective part of the semiconductor wafer which includes at least one defective bare die based on the positional information assigned to the block as a result of said burn-in test.
Claim 3
Dependent Claim
26 words
A method according to claim 1, wherein the step of recording the positional information further comprises putting a visible indication on each block to be tested.