Patent US4752838A successfully refreshed from Google Patents.
Patent US5534729A successfully refreshed from Google Patents.
US5534729A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit lead frame for coupling to non-neighboring bond pads
Assignee: Texas Instruments Inc
•
Filing: 1995-02-17
•
Granted: 1996-07-09
•
Expires: 2015-02-17
Abstract
Abstract The present invention provides a modular electronic component (10) wherein a sequence: of leads (26) of a lead frame (12) differs from a sequence of bonding pads (16) on an integrated circuit (14). When lead frame (12) is placed adjacent integrated circuit (14), first and second power buses (22) and (24) are disposed on a first side (18) of bonding pads (16). First portion (30) of leads (26) and lead finger (28) are disposed on second side (20) of bonding pads (16). Bonding members (42) couple appropriate bonding pads (16) with corresponding leads (26), first and second power buses (22) and (24), and lead finger (28). In this manner, the pin out of modular electronic component (10) may be altered by incorporating appropriate lead fingers (28) without changing the sequence of bonding pads (16).
Inventors
- 👤 Ernest J. Russell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:45
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/50; H10W72/59; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
140 words
A lead frame for placement adjacent an integrated circuit having a plurality of bonding pads forming a bonding pad row, said lead frame comprising: a plurality of leads having first and second portions, said first portions positioned to be coupled to an external system, and said second portions disposed adjacent a first side of said bonding row, said second portions positioned to be coupled to an associated sequence of bonding pads; and at least one lead finger coupled to a selected second portion of one of said leads, said at least one lead finger extending between said first side of said bonding pad row and at least one neighboring second portion to a position proximate a selected bond pad, said at least one lead finger positioned to permit said selected second portion to be coupled to said selected bond pad.
Claim 2
Dependent Claim
140 words
A lead frame for placement adjacent an integrated circuit having a plurality of bonding pads forming a bonding pad row, said lead frame comprising: a plurality of leads having first and second portions, said first portions positioned to be coupled to an external system, and said second portions disposed adjacent a first side of said bonding row, said second portions positioned to be coupled to an associated sequence of bonding pads; and at least one lead finger coupled to a selected second portion of one of said leads, said at least one lead finger extending between said first side of said bonding pad row and at least one neighboring second portion to a position proximate a selected bond pad, said at least one lead finger positioned to permit said selected second portion to be coupled to said selected bond pad.
Claim 3
Dependent Claim
70 words
The lead frame of claim 1 further comprising first and second power buses, said first power bus being substantially parallel to said second power bus along a portion of said power buses; wherein when said lead frame is placed adjacent the integrated circuit, said portion of said first and said second power buses is disposed adjacent a second side of said bonding pad row, parallel to said bonding pad row.
Claim 4
Dependent Claim
45 words
The lead frame of claim 1, wherein said at least one lead finger is substantially perpendicular to said leads such that when said lead frame is placed adjacent the integrated circuit, said at least one lead finger is substantially parallel to said bonding pad row.
Claim 5
Dependent Claim
20 words
The lead frame of claim 1 further comprising a plurality of pins each coupled to one of said lead frames.
Claim 6
Dependent Claim
22 words
The lead frame of claim 1 further comprising a plurality of bonding members for coupling said lead frame to the integrated circuit.
Claim 7
Dependent Claim
139 words
A modular electronic component comprising; an integrated circuit formed on a semiconductor substrate having a plurality of bonding pads forming a bonding pad row; a plurality of leads having a first and second portions, said first portion extending from said package and positioned to be coupled to an external system, and said second portion disposed adjacent a first side of said bonding pad row, said second portions positioned to be coupled to an associated sequence of bond pads; and at least one lead finger coupled to selected second portion; wherein said at least one lead fingers extends between said first side of said bonding pad row and at least one neighboring second portion to a position proximate a selected bond pad, said at least one lead finger adapted to couple said selected second portion to a non-sequential bond pad.
Claim 8
Dependent Claim
139 words
A modular electronic component comprising; an integrated circuit formed on a semiconductor substrate having a plurality of bonding pads forming a bonding pad row; a plurality of leads having a first and second portions, said first portion extending from said package and positioned to be coupled to an external system, and said second portion disposed adjacent a first side of said bonding pad row, said second portions positioned to be coupled to an associated sequence of bond pads; and at least one lead finger coupled to selected second portion; wherein said at least one lead fingers extends between said first side of said bonding pad row and at least one neighboring second portion to a position proximate a selected bond pad, said at least one lead finger adapted to couple said selected second portion to a non-sequential bond pad.
Claim 9
Dependent Claim
46 words
The component of claim 6 further comprising first and said power buses, said first power bus being substantially parallel to said second power bus along a portion of said power buses adjacent a second side of said bonding pad row, parallel to said bonding pad row.
Claim 10
Dependent Claim
15 words
The component of claim 6 wherein said integrated circuit comprises a dynamic random access memory.
Claim 11
Dependent Claim
19 words
The component of claim 6, wherein said integrated circuit comprises a 16 megabyte by 8 dynamic random access memory.
Claim 12
Dependent Claim
19 words
The component of claim 6, wherein said integrated circuit comprises a 16 megabyte by 9 dynamic random access memory.
Claim 13
Dependent Claim
34 words
The component of claim 6, wherein aid at least one lead finger is substantially perpendicular to said leads such that said at least one lead finger is substantially parallel to said bonding pad row.
Claim 14
Dependent Claim
18 words
The component of claim 6 further comprising a plurality of pins each coupled to one of said leads.
Claim 15
Dependent Claim
27 words
The component of claim 6 further comprising a plurality of bonding members for coupling said leads and said at least one lead finger to said integrated circuit.
Claim 16
Dependent Claim
29 words
The component of claim 6, wherein said component comprises a vertical package having a plurality of pins coupled to said leads and extending from one side of said component.
Claim 17
Dependent Claim
30 words
The component of claim 6, wherein said component comprises a zig-zag in-line package having a plurality of pins coupled to said leads and extending from one side of said component.
Claim 18
Dependent Claim
35 words
The lead frame of claim 1 wherein said at least one lead finger includes a lead finger portion coupled to said lead finger, said lead finger portion adapted to have a bond wire attached thereto.
Claim 19
Dependent Claim
34 words
The component of claim 6 wherein said at least one lead finger includes a lead finger portion coupled to said lead finger, said lead finger portion adapted to have a bond wire attached thereto.
References Cited (Backward Citations)
US4580193A
Cited
JPS62134950A
Cited
US4934820A
Cited
USH1267H
Cited
US5229846A
Cited
US5252853A
Cited
US5229639A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-09 | 2000-01-08 | 2000-07-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-09 | 2004-01-08 | 2004-07-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-09 | 2008-01-08 | 2008-07-09 | $7700.00 | Window Closed / Lapsed |