US5534127A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming solder bumps on electrodes of electronic component
Assignee: Panasonic Holdings Corp
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Filing: 1995-01-11
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Granted: 1996-07-09
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Expires: 2015-01-11
Abstract
Abstract A solder bump 3a is formed on an electrode 2 provided on a printed circuit board 1. First, a core 3 is formed on the electrode 2. Then, solder paste 3' is coated on the core 3 so as to cover an entire surface of the core 3. Subsequently, the solder paste 3' is heated until the solder paste 3' fuses together with the core 3, thereby forming the bump 3a on the electrode 2.
Inventors
- 👤 Tadahiko Sakai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 00:33
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/035; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2201/10954; H05K2201/10992; H05K2203/00; H05K2203/04; H05K2203/043; H05K3/10; H05K3/12; H05K3/1216; H05K3/3473; H10W72/20; H10W72/251; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
141 words
A method of forming a solder bump on an electrode provided on an electronic component, comprising steps of: forming a first solder layer on the electrode of the electronic component; melting said first solder layer by a thermal processing so as to form a molten solder in a spherical shape; cooling down said spherical molten solder to form a hardened spherical core of bump; forming a second solder layer on said spherical core so as to cover a surface of said spherical core, a height of said second solder layer being higher than that of said spherical core; heating said second solder layer until said second solder layer fuses together with said core so as to form an integrated molten solder in a spherical shape; and cooling down said integrated molten solder to form a hardened spherical bump on the electrode.
Claim 2
Independent Claim
141 words
A method of forming a solder bump on an electrode provided on an electronic component, comprising steps of: forming a first solder layer on the electrode of the electronic component; melting said first solder layer by a thermal processing so as to form a molten solder in a spherical shape; cooling down said spherical molten solder to form a hardened spherical core of bump; forming a second solder layer on said spherical core so as to cover a surface of said spherical core, a height of said second solder layer being higher than that of said spherical core; heating said second solder layer until said second solder layer fuses together with said core so as to form an integrated molten solder in a spherical shape; and cooling down said integrated molten solder to form a hardened spherical bump on the electrode.
Claim 3
Dependent Claim
29 words
The solder bump forming method in accordance with claim 1, wherein said first solder layer is coated on said electrode of the electronic component using a screen printing technology.
Claim 4
Dependent Claim
25 words
The solder bump forming method in accordance with claim 1, wherein said second solder layer is coated on said core using a screen printing technology.
Claim 5
Dependent Claim
20 words
The solder bump forming method in accordance with claim 1, wherein said first solder layer is made of solder paste.
Claim 6
Dependent Claim
20 words
The solder bump forming method in accordance with claim 1, wherein said second solder layer is made of solder paste.
Claim 7
Dependent Claim
19 words
The solder bump forming method in accordance with claim 1, wherein said electronic component is a printed circuit board.
Claim 8
Dependent Claim
47 words
The solder bump forming method in accordance with claim 1, wherein a first screen mask is used for forming said first solder layer and a second screen mask is used for forming said second solder layer, said second screen mask being thicker than said first solder layer.
Claim 9
Dependent Claim
25 words
The solder bump forming method in accordance with claim 1, wherein said first solder layer is a solder precoat layer formed by an electrolytic plating.
Claim 10
Independent Claim
108 words
A method of forming a bump on an electrode provided on an electronic component, comprising steps of: forming a fusible core of bump on the electrode of the electronic component; coating a fusible metal on said core so as to cover a surface of said core, said core having a better wettability to said coating fusible metal than to said electrode of the electronic component; heating said coating fusible metal until said coating fusible metal fuses together with said core so as to form an integrated molten metal in a spherical shape; and cooling down said integrated molten metal to form a hardened spherical bump on the electrode.
Claim 11
Independent Claim
108 words
A method of forming a bump on an electrode provided on an electronic component, comprising steps of: forming a fusible core of bump on the electrode of the electronic component; coating a fusible metal on said core so as to cover a surface of said core, said core having a better wettability to said coating fusible metal than to said electrode of the electronic component; heating said coating fusible metal until said coating fusible metal fuses together with said core so as to form an integrated molten metal in a spherical shape; and cooling down said integrated molten metal to form a hardened spherical bump on the electrode.
Claim 12
Dependent Claim
31 words
The solder bump forming method in accordance with claim 9, wherein said forming step comprises the step of: forming said fusible core of bump as a spherical shape on said electrode.
References Cited (Backward Citations)
US4950272A
Cited
US5320272A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-09 | 2000-01-08 | 2000-07-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-09 | 2004-01-08 | 2004-07-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-09 | 2008-01-08 | 2008-07-09 | $7700.00 | Window Closed / Lapsed |