Tin-bismuth solder connection having improved high temperature properties, and process for forming same

Claim 2

In an electronic package comprising a first faying surface, second faying surface and a solder connection bonding the first faying surface and the second faying surface, the improvement wherein the solder connection is formed of a solder alloy composed predominantly of bismuth and tin and further comprising a metal selected from the group consisting of gold and silver in an amount between about 1.0 and 2.2 weight percent and effective to increase the melting temperature of the interconnection.

Claim 3

An electronic package in accordance with claim 1 wherein the solder alloy comprises between about 30 and 70 weight percent bismuth.

Claim 4

An electronic package in accordance with claim 1 wherein the solder alloy consists essentially of between about 48 and 68 weight percent bismuth, between about 1.0 and 2.2 weight percent gold, and the balance tin.

Claim 5

In an electronic package comprising an electronic component mounted to a printed circuit board by a solder connection, said printed circuit board comprising a bond pad formed of copper metal, said component comprising a contact formed of a solder-wettable metal, said solder connection bonding of the bond pad and the contact to attach the electronic component to the printed circuit board and to electrically connect the bond pad and the contact, the improvement comprising a solder connection formed of a solder alloy substantially composed of between about 30 and 70 weight percent bismuth, between about 1.0 and 2.2 weight percent metal selected from the group consisting of gold and silver, and the balance tin.

Claim 6

In an electronic package comprising an electronic component mounted to a printed circuit board by a solder connection, said printed circuit board comprising a bond pad formed of copper metal, said component comprising a contact formed of a solder-wettable metal, said solder connection bonding of the bond pad and the contact to attach the electronic component to the printed circuit board and to electrically connect the bond pad and the contact, the improvement comprising a solder connection formed of a solder alloy substantially composed of between about 30 and 70 weight percent bismuth, between about 1.0 and 2.2 weight percent metal selected from the group consisting of gold and silver, and the balance tin.

Claim 7

An electronic package in accordance with claim 4 wherein the solder alloy consists essentially of between about 48 and 68 weight percent bismuth, between about 1.0 and 2.2 weight percent gold and the balance tin.

Claim 8

A process for solder bonding a first faying surface and a second faying surface, said process comprising applying to at least one faying surface a film composed of a metal selected from the group consisting of gold and silver, applying a solder paste onto the film to form a particulate deposit formed predominantly of solder particles of an alloy composed substantially of tin and bismuth, assembling the second faying surface in contact with the particulate deposit to form an assembly, heating the assembly to a temperature sufficient to melt and the particulate deposit to form a liquid that wets the faying surfaces, whereupon the metal from the film dissolves into the liquid, and cooling to solidify the liquid to form a solder connection bonded to the faying surfaces.

Claim 9

A process for solder bonding a first faying surface and a second faying surface, said process comprising applying to at least one faying surface a film composed of a metal selected from the group consisting of gold and silver, applying a solder paste onto the film to form a particulate deposit formed predominantly of solder particles of an alloy composed substantially of tin and bismuth, assembling the second faying surface in contact with the particulate deposit to form an assembly, heating the assembly to a temperature sufficient to melt and the particulate deposit to form a liquid that wets the faying surfaces, whereupon the metal from the film dissolves into the liquid, and cooling to solidify the liquid to form a solder connection bonded to the faying surfaces.

Claim 10

A process in accordance with claim 6 wherein the solder particles comprise between about 30 and 70 weight percent bismuth and the balance tin.

Claim 11

A process in accordance with claim 6 wherein the solder particles are composed of between about 48 and 68 weight percent bismuth and tin.

Claim 12

A process in accordance with claim 6 further comprising applying to the first faying surface a plate formed of tin-bismuth alloy and thereafter depositing the film onto the plate.

Claim 13

A process in accordance with claim 6 wherein the solder connection is composed substantially of between about 48 and 68 weight percent bismuth, between about 1.0 and 2.2 weight percent gold and the balance tin.

Claim 14

A process for solder bonding a first faying surface and a second faying surface, said process comprising: applying to the first faying surface a solder layer formed of an alloy composed substantially of tin and bismuth, coating the solder layer with a film composed of a metal selected from the group consisting of gold and silver, applying a solder paste onto the film to form a particulate deposit formed predominantly of solder particles of an alloy composed of substantially of tin and bismuth, assembling the second faying surface in contact with the particulate deposit to form an assembly, heating the assembly to a temperature sufficient to melt the solder layer and the particulate deposit to form a liquid that wets the faying surfaces, whereupon the metal from the film dissolves into the liquid, and cooling to solidify the liquid to form a solder connection bonding to the faying surfaces.

Claim 15

A process for solder bonding a first faying surface and a second faying surface, said process comprising: applying to the first faying surface a solder layer formed of an alloy composed substantially of tin and bismuth, coating the solder layer with a film composed of a metal selected from the group consisting of gold and silver, applying a solder paste onto the film to form a particulate deposit formed predominantly of solder particles of an alloy composed of substantially of tin and bismuth, assembling the second faying surface in contact with the particulate deposit to form an assembly, heating the assembly to a temperature sufficient to melt the solder layer and the particulate deposit to form a liquid that wets the faying surfaces, whereupon the metal from the film dissolves into the liquid, and cooling to solidify the liquid to form a solder connection bonding to the faying surfaces.

Claim 16

A process in accordance with claim 11 wherein the step of applying the solder layer comprises electroplating the alloy onto the first faying surface.

Claim 17

A process in accordance with claim 11 wherein the solder layer and the solder particles are composed of solder alloy comprising between about 30 and 70 weight percent bismuth and the balance substantially tin.

Claim 18

A process in accordance with claim 11 wherein the solder layer is composed of a solder alloy comprising between about 48 and 68 percent bismuth and the balance substantially tin.

Claim 19

A process in accordance with claim 11 wherein the step of coating the solder layer comprises depositing the metal by electroplating.

Claim 20

A process in accordance with claim 11 wherein the assembly is heated to a temperature greater than about 140° C.

Claim 21

A process for mounting a component onto a printed circuit board, said component comprising a contact formed of a solder-wettable metal, said printed circuit board comprising a bond pad formed of a solder-wettable metal, said process comprising: electrodepositing a plate onto the bond pad, said plate being formed of a solder alloy composed of between about 30 and 70 weight percent bismuth and the balance substantially tin, electrodepositing a film onto the plate, said film being composed of a tertiary metal selected from the group consisting of gold and silver, applying a paste onto the film to form a deposit comprising solder particles formed of an alloy composed of between about 30 and 70 weight percent bismuth and the balance substantially tin, assembling the component and the substrate to form an assembly such that the contact of the component is in contact with said deposit, heating the assembly to a temperature sufficient to melt the plate and the deposit and to dissolve the coating to form a liquid that wets the bond pad and the contact and extends continuously therebetween, and cooling to solidify the liquid to form a solder connection bonding the contact and the bond pad and containing between about 1.0 and 2.2 weight percent tertiary metal to enhance high temperature properties.

Claim 22

A process for mounting a component onto a printed circuit board, said component comprising a contact formed of a solder-wettable metal, said printed circuit board comprising a bond pad formed of a solder-wettable metal, said process comprising: electrodepositing a plate onto the bond pad, said plate being formed of a solder alloy composed of between about 30 and 70 weight percent bismuth and the balance substantially tin, electrodepositing a film onto the plate, said film being composed of a tertiary metal selected from the group consisting of gold and silver, applying a paste onto the film to form a deposit comprising solder particles formed of an alloy composed of between about 30 and 70 weight percent bismuth and the balance substantially tin, assembling the component and the substrate to form an assembly such that the contact of the component is in contact with said deposit, heating the assembly to a temperature sufficient to melt the plate and the deposit and to dissolve the coating to form a liquid that wets the bond pad and the contact and extends continuously therebetween, and cooling to solidify the liquid to form a solder connection bonding the contact and the bond pad and containing between about 1.0 and 2.2 weight percent tertiary metal to enhance high temperature properties.