Patent US5530281A successfully refreshed from Google Patents.
US5530281A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wirebond lead system with improved wire separation
Assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Filing: 1994-12-21
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Granted: 1996-06-25
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Expires: 2014-12-21
Abstract
Abstract Lead systems of the subject invention include "coplanar leads" and "aplanar leads", which differ in structure at the inner bond finger. Coplanar leads are generally planar along the lead body and the inner bond finger. Aplanar leads are bent or deformed at the inner bond finger, such that the inner bond finger terminus is not in the plane of the lead body but instead is above or below the plane of the lead body. Deforming select inner bond fingers out of the general plane of the lead system provides a spatial separation for the bonding wires which are attached to the inner bond fingers. This spatial separation acts to minimize wire crossing and shorting during fill processes and results in improved semiconductor package yield.
Inventors
- 👤 Richard L. Groover
- 👤 Matthew W. Preston
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:17
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
59 words
A lead system which includes both planar leads having planar inner bond fingers, and upper and lower aplanar leads; individual said upper aplanar leads being including inner bond fingers positioned above the inner bond fingers of said planar leads; and individual said lower aplanar leads having inner bond fingers positioned below the inner bond fingers of said planar leads.
Claim 2
Dependent Claim
59 words
A lead system which includes both planar leads having planar inner bond fingers, and upper and lower aplanar leads; individual said upper aplanar leads being including inner bond fingers positioned above the inner bond fingers of said planar leads; and individual said lower aplanar leads having inner bond fingers positioned below the inner bond fingers of said planar leads.
Claim 3
Dependent Claim
18 words
A lead system of claim 1 wherein said lead system comprises planar leads alternating regularly with aplanar leads.
Claim 4
Dependent Claim
86 words
A semiconductor package containing an integrated circuit die, said package comprising: (a) a pattern of electrically conductive leads which includes a plurality of planar leads, and a plurality of aplanar leads including inner bond fingers positioned above the plane of said planar leads; (b) said integrated circuit die in bond wire connection with a plurality of said planar leads, and with a plurality of said aplanar leads; and (c) a housing enclosing the integrated circuit die and a portion of the pattern of electrically conductive leads.
Claim 5
Dependent Claim
86 words
A semiconductor package containing an integrated circuit die, said package comprising: (a) a pattern of electrically conductive leads which includes a plurality of planar leads, and a plurality of aplanar leads including inner bond fingers positioned above the plane of said planar leads; (b) said integrated circuit die in bond wire connection with a plurality of said planar leads, and with a plurality of said aplanar leads; and (c) a housing enclosing the integrated circuit die and a portion of the pattern of electrically conductive leads.
Claim 6
Dependent Claim
18 words
A semiconductor package of claim 3 wherein said lead pattern comprises planar leads alternating regularly with aplanar leads.
Claim 7
Dependent Claim
21 words
A semiconductor package of claim 3 in which said aplanar leads are joined to a bond wire at an aplanar point.
Claim 8
Dependent Claim
21 words
A semiconductor package of claim 3 in which said aplanar leads are joined to a bond wire at a coplanar point.
Claim 9
Dependent Claim
43 words
A lead system which includes planar leads: first aplanar leads having a first height; and second aplanar leads having a second height; in which inner terminal ends of said first aplanar leads and said second aplanar leads are positioned above said planar leads.
Claim 10
Dependent Claim
43 words
A lead system which includes planar leads: first aplanar leads having a first height; and second aplanar leads having a second height; in which inner terminal ends of said first aplanar leads and said second aplanar leads are positioned above said planar leads.
Claim 11
Dependent Claim
43 words
A lead system which includes planar leads; first aplanar leads having a first height; and second aplanar leads having a second height; in which inner terminal ends of said first aplanar leads and said second aplanar leads are positioned below said planar leads.
Claim 12
Dependent Claim
43 words
A lead system which includes planar leads; first aplanar leads having a first height; and second aplanar leads having a second height; in which inner terminal ends of said first aplanar leads and said second aplanar leads are positioned below said planar leads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-25 | 1999-12-25 | 2000-06-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-25 | 2003-12-25 | 2004-06-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-25 | 2007-12-25 | 2008-06-25 | $7700.00 | Window Closed / Lapsed |