Patent US5528456A successfully refreshed from Google Patents.
US5528456A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package with improved heat transfer structure for semiconductor device
Assignee: NEC Electronics Corp
•
Filing: 1994-11-15
•
Granted: 1996-06-18
•
Expires: 2014-11-15
Abstract
Abstract The invention provides a package with an improved semiconductor device heat transfer structure including a semiconductor integrated circuit chip mounted on a substrate, a package for receiving the semiconductor integrated circuit chips mounted on the substrate, a radiator being attached to the package for radiation of a heat to an exterior and for sealing the package and a foil which made of a heat conductive material has corrugations having top portions in contact with the chip and bottom portions in contact with the radiator for transferring the heat from the semiconductor integrated circuit chip to the radiator.
Inventors
- 👤 Nobuaki Takahashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:00
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/70; H10W40/77; H10W90/00; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/877; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
94 words
A high heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a heat radiation means for radiating heat to an exterior; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said heat radiation means for transferring said heat from said at least one semiconductor integrated circuit chip to said radiation means, said foil including grooves extending at said top portions in a crosswise direction of said corrugations.
Claim 2
Dependent Claim
94 words
A high heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a heat radiation means for radiating heat to an exterior; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said heat radiation means for transferring said heat from said at least one semiconductor integrated circuit chip to said radiation means, said foil including grooves extending at said top portions in a crosswise direction of said corrugations.
Claim 3
Dependent Claim
18 words
A high heat transfer structure according to claim 1, wherein said heat transfer foil has a V-shaped structure.
Claim 4
Dependent Claim
18 words
A high heat transfer structure according to claim 1, wherein said heat transfer foil has a curved structure.
Claim 5
Dependent Claim
32 words
A high heat transfer structure according to claim 1, further comprising a resin having a high thermal conductivity and flexibility, said resin being provided on at least one surface of said foil.
Claim 6
Dependent Claim
18 words
A high heat transfer structure according to claim 1, wherein said heat transfer foil is made of aluminum.
Claim 7
Dependent Claim
20 words
A high heat transfer structure according to claim 1, wherein said heat transfer foil is made of an aluminum alloy.
Claim 8
Dependent Claim
18 words
A high heat transfer structure according to claim 1, wherein said heat transfer foil is made of copper.
Claim 9
Dependent Claim
20 words
A high heat transfer structure according to claim 1, wherein said heat transfer foil is made of a copper alloy.
Claim 10
Dependent Claim
18 words
A high heat transfer structure according to claim 1, wherein said heat radiation means is a heat sink.
Claim 11
Dependent Claim
94 words
A high heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a heat radiation means for radiating heat to an exterior; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said heat radiation means for transferring said heat from said at least one semiconductor integrated circuit chip to said radiation means, said foil including grooves extending at said bottom portions in a crosswise direction of said corrugations.
Claim 12
Dependent Claim
94 words
A high heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a heat radiation means for radiating heat to an exterior; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said heat radiation means for transferring said heat from said at least one semiconductor integrated circuit chip to said radiation means, said foil including grooves extending at said bottom portions in a crosswise direction of said corrugations.
Claim 13
Dependent Claim
97 words
A high heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a heat radiation means for radiating heat to an exterior; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said heat radiation means for transferring said heat from said at least one semiconductor integrated circuit chip to said radiation means, said foil including grooves extending at both said top and bottom portions in a crosswise direction of said corrugations.
Claim 14
Dependent Claim
97 words
A high heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a heat radiation means for radiating heat to an exterior; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said heat radiation means for transferring said heat from said at least one semiconductor integrated circuit chip to said radiation means, said foil including grooves extending at both said top and bottom portions in a crosswise direction of said corrugations.
Claim 15
Dependent Claim
114 words
A heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a package for receiving said at least one semiconductor integrated circuit chip mounted on said substrate; heat radiation means attached to said package for radiating heat to an exterior and for sealing said package; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said radiation means for transferring said heat from said semiconductor integrated circuit chip to said heat radiation means, said foil including grooves extending at said top portions in a crosswise direction of said corrugations.
Claim 16
Dependent Claim
114 words
A heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a package for receiving said at least one semiconductor integrated circuit chip mounted on said substrate; heat radiation means attached to said package for radiating heat to an exterior and for sealing said package; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said radiation means for transferring said heat from said semiconductor integrated circuit chip to said heat radiation means, said foil including grooves extending at said top portions in a crosswise direction of said corrugations.
Claim 17
Dependent Claim
17 words
A heat transfer structure according to claim 12, wherein said heat transfer foil has a V-shaped structure.
Claim 18
Dependent Claim
17 words
A heat transfer structure according to claim 12, wherein said heat transfer foil has a curved structure.
Claim 19
Dependent Claim
31 words
A heat transfer structure according to claim 12, further comprising a resin having a high thermal conductivity and flexibility, said resin being provided on at least one surface of said foil.
Claim 20
Dependent Claim
17 words
A heat transfer structure according to claim 12, wherein said heat transfer foil is made of aluminum.
Claim 21
Dependent Claim
19 words
A heat transfer structure according to claim 12, wherein said heat transfer foil is made of an aluminum alloy.
Claim 22
Dependent Claim
17 words
A heat transfer structure according to claim 12, wherein said heat transfer foil is made of copper.
Claim 23
Dependent Claim
19 words
A heat transfer structure according to claim 12, wherein said heat transfer foil is made of a copper alloy.
Claim 24
Dependent Claim
17 words
A heat transfer structure according to claim 12, wherein said heat radiation means is a heat sink.
Claim 25
Dependent Claim
28 words
A heat transfer structure according to claim 12, wherein said heat radiation means comprises a cap for sealing said package and a heat sink for radiating said heat.
Claim 26
Dependent Claim
114 words
A heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a package for receiving said at least one semiconductor integrated circuit chip mounted on said substrate; heat radiation means attached to said package for radiating heat to an exterior and for sealing said package; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said radiation means for transferring said heat from said semiconductor integrated circuit chip to said heat radiation means, said foil including grooves extending at said bottom portions in a crosswise direction of said corrugations.
Claim 27
Dependent Claim
114 words
A heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a package for receiving said at least one semiconductor integrated circuit chip mounted on said substrate; heat radiation means attached to said package for radiating heat to an exterior and for sealing said package; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said radiation means for transferring said heat from said semiconductor integrated circuit chip to said heat radiation means, said foil including grooves extending at said bottom portions in a crosswise direction of said corrugations.
Claim 28
Dependent Claim
117 words
A heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a package for receiving said at least one semiconductor integrated circuit chip mounted on said substrate; heat radiation means attached to said package for radiating heat to an exterior and for sealing said package; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said radiation means for transferring said heat from said semiconductor integrated circuit chip to said heat radiation means, said foil including grooves extending at both said top and bottom portions in a crosswise direction of said corrugations.
Claim 29
Dependent Claim
117 words
A heat transfer structure comprising: at least one semiconductor integrated circuit chip mounted on a substrate; a package for receiving said at least one semiconductor integrated circuit chip mounted on said substrate; heat radiation means attached to said package for radiating heat to an exterior and for sealing said package; and a corrugated foil made of a heat conductive material including corrugations having top portions in contact, through solder, with said chip and bottom portions in contact, through solder, with said radiation means for transferring said heat from said semiconductor integrated circuit chip to said heat radiation means, said foil including grooves extending at both said top and bottom portions in a crosswise direction of said corrugations.
References Cited (Backward Citations)
US2920245A
Cited
US3694699A
Cited
US4270604A
Cited
US4763225A
Cited
SU1432819A1
Cited
US4926935A
Cited
US5268813A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-18 | 1999-12-18 | 2000-06-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-18 | 2003-12-18 | 2004-06-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-18 | 2007-12-18 | 2008-06-18 | $7700.00 | Window Closed / Lapsed |