Patent US5525181A successfully refreshed from Google Patents.
US5525181A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board
Assignee: AIK Electronics Austria GmbH
•
Filing: 1994-09-22
•
Granted: 1996-06-11
•
Expires: 2014-09-22
Abstract
Abstract Two-layer or multilayer printed circuit board, method of manufacturing such a printed circuit board, and laminate for the manufacture of such a printed circuit board by such a method. A two-layer or multilayer printed circuit board (1) comprises a support plate (2) which consists of a basic material and which carries a first conductor pattern (3) and a second conductor pattern (17) connected to the support plate (2) via an adhesive layer (11)consisting of an electrically insulating adhesive material. At least one opening (12, 13) is provided in the adhesive layer (1 1), which opening leads to a connecting section (4, 5) of the first conductor pattern (3) and to which a connecting section (18, 19) of the second conductor pattern (17) extends, and by means of which the connecting sections (4, 5, 18, 19) of the two conductor patterns (3, 17) can be electrically interconnected by means of an electrically conducting material connection (28, 29). The adhesive layer (11) consists of an adhesive material which in a certain temperature range has a higher hardness than the region (2a) of the support plate (2) adjoining the first conductor pattern (3 ), and the first conductor pattern (3) is pressed into the support plate (2) by the adhesive layer (11) exclusively in its region covered by the adhesive layer (11) as a result of a pressing process for joining together the adhesive layer (11) and the support plate (2), while the region of each connecting section (4, 5) of the first conductor pattern (3) surrounded by an opening (12, 13) is given a curved shape in the direction of a connecting section (18, 19) of the second conductor pattern (17).
Inventors
- 👤 Helmut Bruckner
- 👤 Siegfried Kopnick
- 👤 Werner Uggowitzer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4084; H05K3/46; H05K3/4644; H05K3/4652; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/09; H05K2201/09009; H05K2201/091; H05K2203/00; H05K2203/06; H05K2203/063; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H05K3/3452; H05K3/4007; H05K3/4673; H05K3/4676; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/109; Y10T156/1092; Y10T156/1093; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
277 words
A method of manufacturing a printed circuit board which comprises: providing a support plate connected at one side thereof to a first conductor pattern comprising connecting sections, providing a laminate comprising (i) a conductor layer for the manufacture of a second conductor pattern with connecting sections and (ii) an electrically insulating adhesive layer having at least one opening through the conductor layer and the adhesive layer, which at least one opening corresponds to a connecting section of the first conductor pattern, connecting the laminate provided with the at least one opening to the support plate at the side thereof comprising the first conductor pattern by means of the adhesive layer of the laminate in a pressing process with heating, during which each opening corresponds to a connecting section of the first conductor pattern, and manufacturing the second conductor pattern with its connecting sections from the conductor layer of the laminate, such that each individual connecting section of the second conductor pattern extends to an opening in the adhesive layer, wherein: (1) an adhesive material is used for the adhesive layer which has a greater hardness in a certain temperature range than a region of the support plate adjoining the first conductor pattern, (2) during the pressing process in said temperature range the first conductor pattern is substantially fully pressed into the support plate by the adhesive layer exclusively in a region covered by the adhesive layer, and (3) during the pressing process each connecting section of the first conductor pattern in a region surrounded by an opening is given a curved shape at least partly through the opening towards the connecting section of the second conductor pattern.
Claim 2
Independent Claim
277 words
A method of manufacturing a printed circuit board which comprises: providing a support plate connected at one side thereof to a first conductor pattern comprising connecting sections, providing a laminate comprising (i) a conductor layer for the manufacture of a second conductor pattern with connecting sections and (ii) an electrically insulating adhesive layer having at least one opening through the conductor layer and the adhesive layer, which at least one opening corresponds to a connecting section of the first conductor pattern, connecting the laminate provided with the at least one opening to the support plate at the side thereof comprising the first conductor pattern by means of the adhesive layer of the laminate in a pressing process with heating, during which each opening corresponds to a connecting section of the first conductor pattern, and manufacturing the second conductor pattern with its connecting sections from the conductor layer of the laminate, such that each individual connecting section of the second conductor pattern extends to an opening in the adhesive layer, wherein: (1) an adhesive material is used for the adhesive layer which has a greater hardness in a certain temperature range than a region of the support plate adjoining the first conductor pattern, (2) during the pressing process in said temperature range the first conductor pattern is substantially fully pressed into the support plate by the adhesive layer exclusively in a region covered by the adhesive layer, and (3) during the pressing process each connecting section of the first conductor pattern in a region surrounded by an opening is given a curved shape at least partly through the opening towards the connecting section of the second conductor pattern.
Claim 3
Dependent Claim
63 words
A method as claimed in claim 1, wherein the pressing process is carried out in a press comprising a press platen and a press ram which are movable relative to one another perpendicularly to the support plate, and a maximum pressure of between 50 and 150 bar, and a maximum temperature of between 110° and 180° C., are generated during the pressing process.
Claim 4
Dependent Claim
40 words
A method as claimed in claim 2, wherein the pressing process has a total duration of between 20 and 40 minutes, and a heating process and a cooling-down process are carried out over approximately equal proportions of the total duration.
Claim 5
Dependent Claim
63 words
A laminate for the manufacture of a printed circuit board by a method as claimed in claim 1, which comprises a conductor layer and an adhesive layer consisting of an adhesive material and provided on the conductor layer, wherein the adhesive material of the adhesive layer has a glass transition temperature which lies in a temperature range of between 50° and 70° C.
Claim 6
Dependent Claim
15 words
A laminate as claimed in claim 4, wherein the adhesive material is an acrylate adhesive.
Claim 7
Dependent Claim
33 words
A method as claimed in claim 1, wherein the pressing process is carried out in a press at a maximum pressure of approximately 100 bar, and a maximum temperature of about 150° C.
Claim 8
Dependent Claim
19 words
A method as claimed in claim 2, wherein the pressing process has a total duration of about 30 minutes.
Claim 9
Dependent Claim
39 words
A method as claimed in claim 6 wherein the first conductor pattern in a region covered by the adhesive layer lies flush with the support plate and is insulated electrically from the second conductor pattern by the adhesive layer.
Claim 10
Dependent Claim
20 words
A laminate as claimed in claim 4, wherein the adhesive material has a glass transition temperature of about 60° C.
Claim 11
Dependent Claim
64 words
A laminate for the manufacture of a printed circuit board by a method as claimed in claim 10 which comprises a conductor layer and an adhesive layer consisting of an adhesive material provided on the conductor layer, wherein the adhesive material of the adhesive layer has a glass transition temperature which lies in a temperature range of between about 50° C. and 70° C.
Claim 12
Independent Claim
311 words
A method of manufacturing a printed circuit board which comprises: providing a support plate formed by a laminate having a first adhesive layer at one side connected to a first conductor pattern comprising connecting sections, providing a laminate comprising (i) a conductor layer for the manufacture of a second conductor pattern with connecting sections and (ii) an electrically insulating second adhesive layer having at least one opening through the conductor layer and the second adhesive layer, which at least one opening corresponds to a connecting section of the first conductor pattern, connecting the laminate provided with the at least one opening to the support plate at the side thereof comprising the first conductor pattern by means of the second adhesive layer of the laminate in a pressing process with heating, during which each opening corresponds to a connecting section of the first conductor pattern, and manufacturing the second conductor pattern with its connecting sections from the conductor layer of the laminate, such that each individual connecting section of the second conductor pattern extends to an opening in the second adhesive layer, wherein: (1) an adhesive material is used for the second adhesive layer which has a hardness at a certain temperature range that is greater than the hardness of a region of the support plate adjoining the first conductor pattern comprising the first adhesive layer at the same temperature range, (2) during the pressing process in said temperature range the first conductor pattern is substantially fully pressed into the support plate by the second adhesive layer substantially exclusively in a region covered by the second adhesive layer, and (3) during the pressing process each connecting section of the first conductor pattern at least partly in a region surrounded by an opening is given a curved shape at least partly through the opening towards the connecting section of the second conductor pattern.
Claim 13
Independent Claim
311 words
A method of manufacturing a printed circuit board which comprises: providing a support plate formed by a laminate having a first adhesive layer at one side connected to a first conductor pattern comprising connecting sections, providing a laminate comprising (i) a conductor layer for the manufacture of a second conductor pattern with connecting sections and (ii) an electrically insulating second adhesive layer having at least one opening through the conductor layer and the second adhesive layer, which at least one opening corresponds to a connecting section of the first conductor pattern, connecting the laminate provided with the at least one opening to the support plate at the side thereof comprising the first conductor pattern by means of the second adhesive layer of the laminate in a pressing process with heating, during which each opening corresponds to a connecting section of the first conductor pattern, and manufacturing the second conductor pattern with its connecting sections from the conductor layer of the laminate, such that each individual connecting section of the second conductor pattern extends to an opening in the second adhesive layer, wherein: (1) an adhesive material is used for the second adhesive layer which has a hardness at a certain temperature range that is greater than the hardness of a region of the support plate adjoining the first conductor pattern comprising the first adhesive layer at the same temperature range, (2) during the pressing process in said temperature range the first conductor pattern is substantially fully pressed into the support plate by the second adhesive layer substantially exclusively in a region covered by the second adhesive layer, and (3) during the pressing process each connecting section of the first conductor pattern at least partly in a region surrounded by an opening is given a curved shape at least partly through the opening towards the connecting section of the second conductor pattern.
Claim 14
Dependent Claim
64 words
A laminate for the manufacture of a printed circuit board by a method as claimed in claim 11 which comprises a conductor layer and an adhesive layer consisting of an adhesive material provided on the conductor layer, wherein the adhesive material of the adhesive layer has a glass transition temperature which lies in a temperature range of between about 50° C. and 70° C.
Claim 15
Independent Claim
364 words
A method of manufacturing a printed circuit board which comprises: providing a support plate formed by a laminate of resin-impregnated paper layers having a first acrylate adhesive layer at one side connected to a first copper pattern comprising connecting sections, the adhesive material of said acrylate adhesive layer having a glass transition temperature of about 40° C.; providing a laminate comprising (i) a copper layer for the manufacture of a second copper pattern with connecting sections and (ii) an electrically insulating second acrylate adhesive layer having at least one opening through the copper layer and the second acrylate adhesive layer, which at least one opening corresponds to a connecting section of the first copper pattern, the adhesive material of the adhesive layer having a glass transition temperature of about 60° C.; connecting the laminate provided with the at least one opening to the support plate at the side thereof comprising the first copper pattern by means of the second acrylate adhesive layer of the laminate in a pressing process with heating, during which each opening corresponds to a connecting section of the first copper pattern, and manufacturing the second copper pattern with its connecting sections from the copper layer of the laminate, such that each individual connecting section of the second copper pattern extends to an opening in the second acrylate adhesive layer, wherein: (1) an acrylate adhesive material is used for the second adhesive layer which has a hardness at a temperature between about 40° and 50° C. that is greater than the hardness of a region of the support plate adjoining the first conductor pattern comprising the first acrylate adhesive layer at a temperature between about 40° and 50° C., (2) during the pressing process in said temperature range the first copper pattern is substantially fully pressed into the support plate by the second acrylate adhesive layer exclusively in a region covered by the second acrylate adhesive layer, and (3) during the pressing process each connecting section of the first copper pattern at least partly in a region surrounded by an opening is given a curved shape at least partly through the opening towards the connecting section of the second copper pattern.
Claim 16
Independent Claim
364 words
A method of manufacturing a printed circuit board which comprises: providing a support plate formed by a laminate of resin-impregnated paper layers having a first acrylate adhesive layer at one side connected to a first copper pattern comprising connecting sections, the adhesive material of said acrylate adhesive layer having a glass transition temperature of about 40° C.; providing a laminate comprising (i) a copper layer for the manufacture of a second copper pattern with connecting sections and (ii) an electrically insulating second acrylate adhesive layer having at least one opening through the copper layer and the second acrylate adhesive layer, which at least one opening corresponds to a connecting section of the first copper pattern, the adhesive material of the adhesive layer having a glass transition temperature of about 60° C.; connecting the laminate provided with the at least one opening to the support plate at the side thereof comprising the first copper pattern by means of the second acrylate adhesive layer of the laminate in a pressing process with heating, during which each opening corresponds to a connecting section of the first copper pattern, and manufacturing the second copper pattern with its connecting sections from the copper layer of the laminate, such that each individual connecting section of the second copper pattern extends to an opening in the second acrylate adhesive layer, wherein: (1) an acrylate adhesive material is used for the second adhesive layer which has a hardness at a temperature between about 40° and 50° C. that is greater than the hardness of a region of the support plate adjoining the first conductor pattern comprising the first acrylate adhesive layer at a temperature between about 40° and 50° C., (2) during the pressing process in said temperature range the first copper pattern is substantially fully pressed into the support plate by the second acrylate adhesive layer exclusively in a region covered by the second acrylate adhesive layer, and (3) during the pressing process each connecting section of the first copper pattern at least partly in a region surrounded by an opening is given a curved shape at least partly through the opening towards the connecting section of the second copper pattern.
References Cited (Backward Citations)
US2958120A
Cited
US4528064A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-11 | 1999-12-11 | 2000-06-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-11 | 2003-12-11 | 2004-06-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-11 | 2007-12-11 | 2008-06-11 | $7700.00 | Window Closed / Lapsed |