Abstract The present disclosure sets forth an improved integrated circuit in which circuit elements, adjacent to a fuse, are protected by barriers positioned adjacent the fuse. In the improved integrated circuit the barriers are non-frangible, high melting point structures buried in the passivating layer, covering a wiring layer containing a fuse, and are between the fuse and adjacent circuit elements in the wiring layer structures. Also taught is a method of protecting circuit elements adjacent a fuse comprising the steps of depositing an insulating layer on the surface of a semiconductor device having active regions therein, forming a plurality of fuses and circuit elements in said layer, coating said fuses and elements with a second insulating layer, patterning said second insulating layer to form grooves between each of said fuses and any adjacent fuse or circuit element, and depositing a high melting point and non-frangible material in said grooves.
Inventors
👤 Richard A. Gilmour
👤 Thomas J. Hartswick
👤 David C. Thomas
👤 Ronald R. Uttecht
👤 Erick G. Walton
Bibliographic Details
Application Number—
JurisdictionUS
Data Sourcegoogle_patents
Last Synchronized2026-11-04 21:15
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/80
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
96 words
A method of protecting elements formed on the surface of an substrate adjacent a fusible link comprising the steps of: selecting a substrate: depositing an insulating layer on the surface of said substrate; depositing a metallic layer on said insulating layer; forming a plurality of elements, including a fuse, in said metallic layer; coating said fuse and said elements with a passivating layer; treating said passivating layer to form grooves between said fuse and any adjacent element; and depositing a metal having a melting point higher than the melting point of the fuse in said grooves.
Claim 2
Independent Claim
96 words
A method of protecting elements formed on the surface of an substrate adjacent a fusible link comprising the steps of: selecting a substrate: depositing an insulating layer on the surface of said substrate; depositing a metallic layer on said insulating layer; forming a plurality of elements, including a fuse, in said metallic layer; coating said fuse and said elements with a passivating layer; treating said passivating layer to form grooves between said fuse and any adjacent element; and depositing a metal having a melting point higher than the melting point of the fuse in said grooves.
Claim 3
Independent Claim
131 words
A method of protecting circuit elements in a wiring layer formed on the surface of an integrated circuit adjacent a fuse comprising the steps of: selecting a semiconductor body: forming a plurality of active regions therein; depositing an insulating layer on the surface of said semiconductor body having the active regions therein; depositing a metallic wiring layer on said insulating layer; forming a plurality of circuit elements, including a fuse, in said wiring layer; forming connectors, through said insulating layer, between said wiring layer and said active regions; coating said fuse and said elements with a passivating layer; treating said passivating layer to form grooves between said fuse and any adjacent element; and depositing a metal having a melting point higher than the melting point of the fuse in said grooves.
Claim 4
Independent Claim
131 words
A method of protecting circuit elements in a wiring layer formed on the surface of an integrated circuit adjacent a fuse comprising the steps of: selecting a semiconductor body: forming a plurality of active regions therein; depositing an insulating layer on the surface of said semiconductor body having the active regions therein; depositing a metallic wiring layer on said insulating layer; forming a plurality of circuit elements, including a fuse, in said wiring layer; forming connectors, through said insulating layer, between said wiring layer and said active regions; coating said fuse and said elements with a passivating layer; treating said passivating layer to form grooves between said fuse and any adjacent element; and depositing a metal having a melting point higher than the melting point of the fuse in said grooves.