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US5522965A
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US
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Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface
Assignee: Texas Instruments Inc
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Filing: 1994-12-12
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Granted: 1996-06-04
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Expires: 2014-12-12
Abstract
Abstract A compact system and method for chemical-mechanical polishing. A polishing pad (114) is attached to a non-rotating platen (112) and used to polish a wafer (116). Rotating arm (118) positions the wafer (116) over the pad (114) and applies pressure. Energy (e.g. ultrasonic) is coupled from device (122) to the platen (112). Energy is thus applied to the pad/wafer interface to aid in the removal of surface material from wafer (116) and for pad conditioning. New slurry is added to wash the particles off the edges of the pad (114).
Inventors
- 👤 Michael F. Chisholm
- 👤 Andrew T. Appel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 23:19
CPC Classifications
B; B24; B24B; B24B53/00; B24B53/017; B24B1/00; B24B1/04; B24B37/00; B24B37/04; B24B37/042
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
77 words
A method for chemical-mechanical polishing comprising the steps of: a. applying a slurry over a surface of a non-rotating polishing pad; b. pressing a wafer against the surface of the polishing pad; c. rotating said wafer during said pressing step to remove material from a surface of the wafer; and d. coupling energy to an interface between said wafer and said polishing pad to aid in the removal of said material from the surface of the wafer.
Claim 2
Independent Claim
77 words
A method for chemical-mechanical polishing comprising the steps of: a. applying a slurry over a surface of a non-rotating polishing pad; b. pressing a wafer against the surface of the polishing pad; c. rotating said wafer during said pressing step to remove material from a surface of the wafer; and d. coupling energy to an interface between said wafer and said polishing pad to aid in the removal of said material from the surface of the wafer.
Claim 3
Dependent Claim
16 words
The method of claim 1, wherein said coupling energy step causes said polishing pad to vibrate.
Claim 4
Dependent Claim
24 words
The method of claim 1, wherein said coupling energy step couples energy from an energy source to a platen that supports said polishing pad.
Claim 5
Dependent Claim
26 words
The method of claim 3, wherein said coupling energy step provides an energy gradient from the center of said platen to the edge of said platen.
Claim 6
Dependent Claim
19 words
The method of claim 1, wherein said coupling energy step couples energy from an energy source to said wafer.
Claim 7
Dependent Claim
20 words
The method of claim 1, wherein said coupling energy step inhibits said material from becoming embedded in said polishing pad.
Claim 8
Dependent Claim
23 words
The method of claim 1, wherein said coupling energy step couples ultrasonic energy to the interface between said wafer and said polishing pad.
Claim 9
Dependent Claim
24 words
The method of claim 1, wherein said coupling energy step couples mixed frequency energy to the interface between said wafer and said polishing pad.
Claim 10
Independent Claim
18 words
The method of claim I wherein said energy is tuned to a vibrational harmonic of the silicon-oxide bond.
Claim 11
Dependent Claim
48 words
A chemical-mechanical polishing system, comprising: a. a polishing pad; b. a non-rotating platen for supporting said polishing pad; c. a wafer carrier for rotating a wafer against said polishing pad; and d. an energy device for supplying energy to an interface between said polishing pad and the wafer.
Claim 12
Dependent Claim
48 words
A chemical-mechanical polishing system, comprising: a. a polishing pad; b. a non-rotating platen for supporting said polishing pad; c. a wafer carrier for rotating a wafer against said polishing pad; and d. an energy device for supplying energy to an interface between said polishing pad and the wafer.
Claim 13
Dependent Claim
16 words
The chemical-mechanical polishing system of claim 10, wherein said energy device is coupled to said platen.
Claim 14
Dependent Claim
16 words
The chemical-mechanical polishing system of claim 10, wherein said energy device is coupled to the wafer.
Claim 15
Dependent Claim
15 words
The chemical-mechanical polishing system of claim 10, wherein said energy device is an ultrasonic transducer.
Claim 16
Dependent Claim
17 words
The chemical-mechanical polishing system of claim 10, wherein said energy device is a mixed frequency energy device.
Claim 17
Dependent Claim
13 words
A chemical-mechanical polishing system having energy coupled to at least one polishing platen.
Claim 18
Dependent Claim
13 words
A chemical-mechanical polishing system having energy coupled to at least one polishing platen.
Claim 19
Dependent Claim
53 words
The chemical-mechanical polishing system of claim 15, further comprising: e. a polishing pad supported by said at least one non-rotating polishing platen; f. a wafer carrier for rotating a wafer against said polishing pad; and g. an energy device for supplying said energy to an interface between said polishing pad and the wafer.
Claim 20
Dependent Claim
15 words
The chemical-mechanical polishing system of claim 15, wherein said energy device is an ultrasonic transducer.
Claim 21
Dependent Claim
17 words
The chemical-mechanical polishing system of claim 15, wherein said energy device is a mixed frequency energy device.
Claim 22
Dependent Claim
97 words
The chemical-mechanical polishing system of claim 15, further comprising: a. a plurality of chemical-mechanical polishing heads, each of said chemical mechanical polishing heads comprising: i. one of said at least one polishing platens; ii. a polishing pad supported by said one of said at least one polishing platens; and iii. a wafer carrier for rotating a wafer against said polishing pad; and b. a robot handler for transferring a wafer from a wafer receive region to one of said chemical-mechanical polishing heads for polishing and from one of said chemical-mechanical polishing heads to a wafer send region.
Claim 23
Dependent Claim
24 words
The chemical-mechanical polishing system of claim 19, further comprising an energy device for coupling energy to each of said at least one polishing platens.
Claim 24
Dependent Claim
33 words
The chemical-mechanical polishing system of claim 19, wherein each of said chemical-mechanical polishing heads further comprises an energy device for coupling said energy to said one of said at least one polishing platens.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-04 | 1999-12-04 | 2000-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-04 | 2003-12-04 | 2004-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-04 | 2007-12-04 | 2008-06-04 | $7700.00 | Window Closed / Lapsed |