US5522933A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Particle-free microchip processing
Assignee: Individual
•
Filing: 1994-05-19
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Granted: 1996-06-04
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Expires: 2014-05-19
Abstract
Abstract Method and apparatus for reducing particulate contamination in microchip processing are disclosed. The method and apparatus comprise means to reduce particle velocity toward the wafer before the particles can be deposited on the wafer surface. A reactor using electric fields to reduce particle velocity and prevent particulate contamination is disclosed. A reactor using a porous showerhead to reduce particle velocities and prevent particulate contamination is disclosed.
Inventors
- 👤 Anthony S. Geller
- 👤 Daniel J. Rader
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 21:08
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/4401
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
156 words
An apparatus for processing a microchip wafer comprising: a) means for distributing a processing gas flow on the wafer, said gas flow containing charged contaminant particles, and said means comprising; showerhead that allows passage of the processing gas therethrough, susceptor means for holding the wafer, means for holding said showerhead in relation to said susceptor means so that the processing gas flows over the wafer and an input means for providing processing gas to the showerhead; and b) deceleration means for reducing the contaminant particle velocity component toward the wafer relative to its other velocity components, thereby inhibiting the deposition on the wafer surface of said contaminant particles, said deceleration means comprising means for providing a first electric field between said showerhead and the wafer; wherein said deceleration means further comprises means for generating a second electric field between said input means and said showerhead, said second electric field repelling charged contaminant particles from said showerhead.
Claim 2
Independent Claim
156 words
An apparatus for processing a microchip wafer comprising: a) means for distributing a processing gas flow on the wafer, said gas flow containing charged contaminant particles, and said means comprising; showerhead that allows passage of the processing gas therethrough, susceptor means for holding the wafer, means for holding said showerhead in relation to said susceptor means so that the processing gas flows over the wafer and an input means for providing processing gas to the showerhead; and b) deceleration means for reducing the contaminant particle velocity component toward the wafer relative to its other velocity components, thereby inhibiting the deposition on the wafer surface of said contaminant particles, said deceleration means comprising means for providing a first electric field between said showerhead and the wafer; wherein said deceleration means further comprises means for generating a second electric field between said input means and said showerhead, said second electric field repelling charged contaminant particles from said showerhead.
Claim 3
Dependent Claim
33 words
The apparatus of claim 1 wherein the first electric field is selected to repel contaminant particles of one polarity and the second electric field is selected to repel contaminant particles of opposite polarity.
Claim 4
Dependent Claim
23 words
The apparatus of claim 2 wherein the magnitude of the first electric field is greater than the magnitude of the second electric field.
Claim 5
Dependent Claim
25 words
The apparatus of claim 1 wherein said deceleration means comprises a showerhead with a plurality of tortuous paths allowing the flow of processing gas therethrough.
Claim 6
Dependent Claim
12 words
The apparatus of claim 4 wherein said showerhead is made of metal.
Claim 7
Dependent Claim
15 words
The apparatus of claim 1 wherein said showerhead has a plurality of tortuous paths therethrough.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-04 | 1999-12-04 | 2000-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-04 | 2003-12-04 | 2004-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-04 | 2007-12-04 | 2008-06-04 | $7700.00 | Window Closed / Lapsed |