Semiconductor device and a method of manufacturing same

Claim 2

A semiconductor device comprising: a semiconductor substrate; a first conducting layer formed on the surface of said semiconductor substrate; a first insulating layer formed above said semiconductor substrate, the insulating layer having a contact hole reaching said first conducting layer to expose it; a second conducting layer formed on said first insulating layer, the sidewall of said contact hole, and said first conducting layer; an anti-oxidation layer formed on at least part of the surface of said second conducting layer; and a second insulating layer formed on the entire surface of said anti-oxidation layer so as to fill said contact hole, wherein said second conducting layer is formed using a sputtering method so that a portion of said second conducting layer on said sidewall of said contact hole is thinner than portions thereof on said first insulating layer and on said first conducting layer, and wherein said second insulating layer is flattened through heat treatment in an oxidizing atmosphere.

Claim 3

A semiconductor device according to claim 1, wherein said anti-oxidation layer is formed only on the top surface of said second conducting layer.

Claim 4

A semiconductor device according to claim 1, wherein said anti-oxidation layer is formed only on the top and side surfaces of said second conducting layer.

Claim 5

A semiconductor device according to claim 1, wherein said anti-oxidation layer is a silicon nitride layer.

Claim 6

A semiconductor device according to claim 1, wherein said second conducting layer contains a silicide layer.

Claim 7

A manufacturing method of a semiconductor device, comprising the steps of: forming a first conducting layer on the surface of a semiconductor substrate; forming a first insulating layer on said semiconductor substrate; forming a contact hole in said first insulating layer, the contact hole reaching said first conducting layer; forming a second conducting layer on said first insulating layer, on the sidewall of said contact hole and on said first conducting layer, using a sputtering method; patterning said second conducting layer; forming an anti-oxidation layer over the entire surface; forming a second insulating layer over the entire surface so as to fill said contact hole; and flattening said second insulating layer through heat treatment in an oxidizing atmosphere.

Claim 8

A manufacturing method of a semiconductor device, comprising the steps of: forming a first conducting layer on the surface of a semiconductor substrate; forming a first insulating layer on said semiconductor substrate; forming a contact hole in said first insulating layer, the contact hole reaching said first conducting layer; forming a second conducting layer on said first insulating layer, on the sidewall of said contact hole and on said first conducting layer, using a sputtering method; patterning said second conducting layer; forming an anti-oxidation layer over the entire surface; forming a second insulating layer over the entire surface so as to fill said contact hole; and flattening said second insulating layer through heat treatment in an oxidizing atmosphere.

Claim 9

A manufacturing method of a semiconductor device, comprising the steps of: forming a first conducting layer on the surface of a semiconductor substrate; forming a first insulating layer on said semiconductor substrate; forming a contact hole in said first insulating layer, the contact hole reaching said first conducting layer; forming a second conducting layer over the entire surface of said first insulating layer, using a sputtering method; forming an anti-oxidation layer over the entire surface; patterning said anti-oxidation layer and said second conducting layer; forming a second insulating layer over the entire surface so as to fill said contact hole; and flattening said second insulating layer through heat treatment in an oxidizing atmosphere, wherein said second conducting layer is oxidized on side and bottom surfaces of said second conducting layer during said heat treatment of said second insulating layer.

Claim 10

A manufacturing method of a semiconductor device, comprising the steps of: forming a first conducting layer on the surface of a semiconductor substrate; forming a first insulating layer on said semiconductor substrate; forming a contact hole in said first insulating layer, the contact hole reaching said first conducting layer; forming a second conducting layer over the entire surface of said first insulating layer, using a sputtering method; forming an anti-oxidation layer over the entire surface; patterning said anti-oxidation layer and said second conducting layer; forming a second insulating layer over the entire surface so as to fill said contact hole; and flattening said second insulating layer through heat treatment in an oxidizing atmosphere, wherein said second conducting layer is oxidized on side and bottom surfaces of said second conducting layer during said heat treatment of said second insulating layer.

Claim 11

A manufacturing method of a semiconductor memory device, comprising the steps of: forming element isolating oxide layers on the surface of a semiconductor substrate; forming first, second and third diffused regions on the surface of a semiconductor substrate at predetermined intervals, said first and third diffused regions serving as a source/drain region and said second diffused region serving as a common drain/source region of first and second memory transistors, respectively; forming first and second gate electrodes of said first and second memory transistors; forming a first interlayer insulating layer on said first and second gate electrodes and on said element isolating oxide layers; forming first and second contact holes, said first contact hole reaching said first diffused region and the second contact hole reaching said third diffused region; forming first and second bottom electrodes of first and second capacitors constituting said first and second memory transistors on said first interlayer insulating layer, having contact with said first and second diffused regions, respectively; forming first and second capacitor insulating films of said first and second capacitors on said first and second bottom electrodes; forming first and second top electrodes of first and second capacitors on said first and second capacitor insulating films; forming a second interlayer insulating layer on the entire surface of the resultant structure; forming a third contact hole, the third contact hole reaching said second diffused region; forming a conducting layer on said second interlayer insulating layer and said second diffused layer; patterning said conducting layer; forming an anti-oxidation layer over the entire surface; forming an insulating layer over the entire surface; and flattening said insulating layer through heat treatment in an oxidizing atmosphere.

Claim 12

A manufacturing method of a semiconductor memory device, comprising the steps of: forming element isolating oxide layers on the surface of a semiconductor substrate; forming first, second and third diffused regions on the surface of a semiconductor substrate at predetermined intervals, said first and third diffused regions serving as a source/drain region and said second diffused region serving as a common drain/source region of first and second memory transistors, respectively; forming first and second gate electrodes of said first and second memory transistors; forming a first interlayer insulating layer on said first and second gate electrodes and on said element isolating oxide layers; forming first and second contact holes, said first contact hole reaching said first diffused region and the second contact hole reaching said third diffused region; forming first and second bottom electrodes of first and second capacitors constituting said first and second memory transistors on said first interlayer insulating layer, having contact with said first and second diffused regions, respectively; forming first and second capacitor insulating films of said first and second capacitors on said first and second bottom electrodes; forming first and second top electrodes of first and second capacitors on said first and second capacitor insulating films; forming a second interlayer insulating layer on the entire surface of the resultant structure; forming a third contact hole, the third contact hole reaching said second diffused region; forming a conducting layer on said second interlayer insulating layer and said second diffused layer; patterning said conducting layer; forming an anti-oxidation layer over the entire surface; forming an insulating layer over the entire surface; and flattening said insulating layer through heat treatment in an oxidizing atmosphere.

Claim 13

A manufacturing method of a semiconductor memory device, comprising the steps of: forming element isolating oxide layers on the surface of a semiconductor substrate; forming first, second and third diffused regions on the surface of a semiconductor substrate at predetermined intervals, said first and third diffused regions serving as a source/drain region and said second diffused region serving as a common drain/source region of first and second memory transistors, respectively; forming first and second gate electrodes of said first and second memory transistors; forming a first interlayer insulating layer on said first and second gate electrodes and said element isolating oxide layers; forming first and second contact holes, said first contact hole reaching said first diffused region and the second contact hole reaching said third diffused region; forming first and second bottom electrodes of first and second capacitors constituting said first and second memory transistors on said first interlayer insulating layer, having contact with said first and second diffused region, respectively; forming first and second capacitor insulating films of said first and second capacitors on said first and second bottom electrodes; forming first and second top electrodes of first and second capacitors on said first and second capacitor insulating films; forming a second interlayer insulating layer on the entire surface of the resultant structure; forming a third contact hole, the third contact hole reaching said second diffused region; forming a conducting layer on said second interlayer insulating layer and said second diffused layer; forming an anti-oxidation layer over the entire surface; patterning said conducting layer and said anti-oxidation layer; forming an insulating layer over the entire surface; and flattening said insulating layer through heat treatment in an oxidizing atmosphere.

Claim 14

A manufacturing method of a semiconductor memory device, comprising the steps of: forming element isolating oxide layers on the surface of a semiconductor substrate; forming first, second and third diffused regions on the surface of a semiconductor substrate at predetermined intervals, said first and third diffused regions serving as a source/drain region and said second diffused region serving as a common drain/source region of first and second memory transistors, respectively; forming first and second gate electrodes of said first and second memory transistors; forming a first interlayer insulating layer on said first and second gate electrodes and said element isolating oxide layers; forming first and second contact holes, said first contact hole reaching said first diffused region and the second contact hole reaching said third diffused region; forming first and second bottom electrodes of first and second capacitors constituting said first and second memory transistors on said first interlayer insulating layer, having contact with said first and second diffused region, respectively; forming first and second capacitor insulating films of said first and second capacitors on said first and second bottom electrodes; forming first and second top electrodes of first and second capacitors on said first and second capacitor insulating films; forming a second interlayer insulating layer on the entire surface of the resultant structure; forming a third contact hole, the third contact hole reaching said second diffused region; forming a conducting layer on said second interlayer insulating layer and said second diffused layer; forming an anti-oxidation layer over the entire surface; patterning said conducting layer and said anti-oxidation layer; forming an insulating layer over the entire surface; and flattening said insulating layer through heat treatment in an oxidizing atmosphere.

Claim 15

A memory device, comprising: first and second memory cells including first and second memory transistors and first and second capacitors, which are formed on the surface of a semiconductor substrate; said first memory transistor comprising; first and second diffused regions on the surface of said semiconductor substrate at predetermined intervals, said first diffused regions serving as a source/drain region of said first memory transistor and said second diffused region serving as a common drain/source region between said first and second memory transistors; a first gate electrode; and a first interlayer insulating layer formed on said first gate electrode; said first capacitor comprising; a first contact hole, said first contact hole reaching said first diffused region; a first bottom electrode formed on said first interlayer insulating layer, having contact with said diffused region; a first capacitor insulating film formed on said first bottom electrode; and a first top electrode formed on said first capacitor insulating film; said second memory transistor comprising; third diffused region on the surface of said semiconductor substrate separated from said second diffused region at predetermined intervals, said third diffused region serving as a source/drain region of said second memory transistor; a second gate electrode; and a second interlayer insulating layer formed on said second gate electrode; said second capacitor comprising; a second contact hole, said second contact hole reaching said third diffused region; a second bottom electrode formed on said second interlayer insulating layer, having contact with said third diffused region; a second capacitor insulating films formed on said second bottom electrode; and a second top electrode formed on said second capacitor insulating film; said memory device being characterized by further comprising; a third interlayer insulating layer formed on said first and second memory transistors, said third interlayer insulating layer having a third contact hole which reaches said second diffused region; a conducting layer formed on said third interlayer insulating layer, the side wall of said third contact hole and said second diffused region, said conducting layer serving as a bit line of said memory device; an anti-oxidation layer formed on at least part of the surface of said conducting layer; and a fourth interlayer insulating layer formed on said anti-oxidation layer, flattened through heat treatment in an oxidizing atmosphere.

Claim 16

A memory device, comprising: first and second memory cells including first and second memory transistors and first and second capacitors, which are formed on the surface of a semiconductor substrate; said first memory transistor comprising; first and second diffused regions on the surface of said semiconductor substrate at predetermined intervals, said first diffused regions serving as a source/drain region of said first memory transistor and said second diffused region serving as a common drain/source region between said first and second memory transistors; a first gate electrode; and a first interlayer insulating layer formed on said first gate electrode; said first capacitor comprising; a first contact hole, said first contact hole reaching said first diffused region; a first bottom electrode formed on said first interlayer insulating layer, having contact with said diffused region; a first capacitor insulating film formed on said first bottom electrode; and a first top electrode formed on said first capacitor insulating film; said second memory transistor comprising; third diffused region on the surface of said semiconductor substrate separated from said second diffused region at predetermined intervals, said third diffused region serving as a source/drain region of said second memory transistor; a second gate electrode; and a second interlayer insulating layer formed on said second gate electrode; said second capacitor comprising; a second contact hole, said second contact hole reaching said third diffused region; a second bottom electrode formed on said second interlayer insulating layer, having contact with said third diffused region; a second capacitor insulating films formed on said second bottom electrode; and a second top electrode formed on said second capacitor insulating film; said memory device being characterized by further comprising; a third interlayer insulating layer formed on said first and second memory transistors, said third interlayer insulating layer having a third contact hole which reaches said second diffused region; a conducting layer formed on said third interlayer insulating layer, the side wall of said third contact hole and said second diffused region, said conducting layer serving as a bit line of said memory device; an anti-oxidation layer formed on at least part of the surface of said conducting layer; and a fourth interlayer insulating layer formed on said anti-oxidation layer, flattened through heat treatment in an oxidizing atmosphere.

Claim 17

A memory device according to claim 10, wherein said anti-oxidation layer is formed only on the top surface of said conducting layer.

Claim 18

A memory device according to claim 10, wherein said anti-oxidation layer is formed only on the top and the side surfaces of said conducting layer.

Claim 19

A memory device according to claim 10, wherein said anti-oxidation layer is a silicon nitride layer.

Claim 20

A memory device according to claim 10, wherein said conducting layer contains a silicide layer.