US5517758A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plating method and method for producing a multi-layered printed wiring board using the same
Assignee: Panasonic Holdings Corp
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Filing: 1993-09-28
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Granted: 1996-05-21
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Expires: 2013-09-28
Abstract
Abstract A dry sandblasting treatment for spraying abrasives onto a surface of an insulating resin layer, a chemical etching for chemically etching the surface, and a plating process for plating a conductive layer on the resulting insulating resin layer are successively performed. Since the surface of the insulating resin layer is roughened by the dry sandblasting treatment and the resulting surface is subjected to the chemical etching, a minute anchor structure is formed on the surface. Accordingly, the adhesion between the insulating resin layer and a plating layer (i.e., a circuit conductive layer) is improved. Due to the dry sandblasting treatment, the shape of a via hole formed in the insulating resin layer is improved, and an exposed surface of the circuit conductor layer and an inner wall of a through-hole are cleaned.
Inventors
- 👤 Tsuneshi Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:41
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4661; C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/22; H05K3/38; H05K3/381; H05K1/00; H05K1/16; H05K1/167; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2203/00; H05K2203/02; H05K2203/025; H05K2203/0285; H05K2203/07; H05K2203/0756; H05K2203/0773; H05K3/0094; H05K3/10; H05K3/18; H05K3/181; H05K3/40; H05K3/42; H05K3/425; H05K3/426; H05K3/4602; Y; Y10; Y10S; Y10S29/00; Y10S29/016; Y10S29/036; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
85 words
A method for plating a conductive layer on an insulating resin layer, comprising the steps of: forming the insulating resin layer; dry sandblasting abrasives onto a surface of the insulating resin layer; removing the abrasives from the surface of the insulating resin layer, wherein the removing step comprises an ultrasonic cleaning step; chemically etching the surface of the insulating resin layer subjected to the dry sandblasting treatment; and plating the conductive layer on the surface of the insulating resin layer subjected to the chemical etching.
Claim 2
Independent Claim
85 words
A method for plating a conductive layer on an insulating resin layer, comprising the steps of: forming the insulating resin layer; dry sandblasting abrasives onto a surface of the insulating resin layer; removing the abrasives from the surface of the insulating resin layer, wherein the removing step comprises an ultrasonic cleaning step; chemically etching the surface of the insulating resin layer subjected to the dry sandblasting treatment; and plating the conductive layer on the surface of the insulating resin layer subjected to the chemical etching.
Claim 3
Dependent Claim
31 words
A method according to claim 1, wherein the dry sandblasting treatment comprises a step of spraying aluminum abrasives onto the surface of the insulating resin layer by a dry spraying method.
Claim 4
Dependent Claim
33 words
A method according to claim 1, wherein the dry sandblasting treatment comprises a step of spraying abrasives of silicon carbide onto the surface of the insulating resin layer by the dry spraying method.
Claim 5
Dependent Claim
33 words
A method according to claim 1, wherein a step of making catalyst particles used for the plating step absorb onto the surface of the insulating resin layer is performed after the chemical etching.
Claim 6
Independent Claim
152 words
A method for producing a multi-layered printed wiring board, comprising the steps of: forming a multi-layered board by forming at least one inner circuit conductor layer on each top and bottom surface of a substrate; forming an insulating resin layer to cover the top and bottom surfaces of the multi-layered board; forming via holes in the insulating resin layer at desired positions on the multi-layered board, and forming through holes penetrating the multi-layered board at desired positions on the multilayered board; dry sandblasting abrasives at least onto a surface of the insulating resin layer and inner faces of the through holes; chemically etching the surface of the insulating resin layer; plating a conductive layer on the surface of the insulating resin layer subjected to the chemical etching and on the inner face of the through hole; and patterning the conductive layer into a desired pattern, thereby forming the multi-layered printed wiring board.
Claim 7
Independent Claim
152 words
A method for producing a multi-layered printed wiring board, comprising the steps of: forming a multi-layered board by forming at least one inner circuit conductor layer on each top and bottom surface of a substrate; forming an insulating resin layer to cover the top and bottom surfaces of the multi-layered board; forming via holes in the insulating resin layer at desired positions on the multi-layered board, and forming through holes penetrating the multi-layered board at desired positions on the multilayered board; dry sandblasting abrasives at least onto a surface of the insulating resin layer and inner faces of the through holes; chemically etching the surface of the insulating resin layer; plating a conductive layer on the surface of the insulating resin layer subjected to the chemical etching and on the inner face of the through hole; and patterning the conductive layer into a desired pattern, thereby forming the multi-layered printed wiring board.
Claim 8
Dependent Claim
39 words
A method according to claim 5, wherein the dry sandblasting treatment comprises a step of spraying aluminum abrasives onto the surface of the insulating resin layer and the inner faces of the through holes by a dry spraying method.
Claim 9
Dependent Claim
41 words
A method according to claim 5, wherein the dry sandblasting treatment comprises a step of spraying abrasives of silicon carbide onto the surface of the insulating resin layer and the inner faces of the through holes by a dry spraying method.
Claim 10
Dependent Claim
33 words
A method according to claim 5, wherein a cleaning step of removing the abrasives from the surface of the insulating resin layer is performed between the dry sandblasting treatment and the chemical etching.
Claim 11
Dependent Claim
15 words
A method according to claim 8, wherein the cleaning step comprises an ultrasonic cleaning step.
Claim 12
Dependent Claim
33 words
A method according to claim 5, wherein a step of making catalyst particles used for the plating step absorb on the surface of the insulating resin layer is performed after the chemical etching.
Claim 13
Dependent Claim
43 words
A method according to claim 5, wherein the step of forming the multi-layered wiring board comprises a step of alternately repeating the formation of the inner circuit conductor layer and the formation of an insulating layer so cover the inner circuit conductor layer.
Claim 14
Dependent Claim
37 words
A method according to claim 5, wherein the step of forming the inner conductor layer comprises a step of forming a resistance factor formed of a resistor film to be electrically connected to the circuit conductor layer.
Claim 15
Dependent Claim
34 words
A method according to claim 5, wherein the sandblasting treatment is a step of forming irregularities having roughness in the range of 5 to 12 μm on the surface of the insulating resin layer.
Claim 16
Independent Claim
158 words
A method for producing a multi-layered printed wiring board, comprising the steps of: forming an inner circuit conductor layer on each top and bottom surface of a substrate; forming through-holes penetrating the inner conductor layer and the substrate; electrically connecting the inner circuit conductor layer formed on the top surface of the substrate to the inner circuit conductor layer formed on the bottom surface of the substrate through the through-holes; filling the through-holes with a resin; forming an insulating resin layer to cover the inner circuit conductor layer; forming via holes in the insulating resin layer at desired positions on the multi-layered board; dry sandblasting abrasives at least onto a surface of the insulating resin layer; chemically etching the surface of the insulation resin layer; plating a conductive layer on the surface of the insulating resin layer subjected to the chemical etching; and patterning the conductive layer into a desired pattern, thereby forming the multi-layered printed wiring board.
Claim 17
Independent Claim
158 words
A method for producing a multi-layered printed wiring board, comprising the steps of: forming an inner circuit conductor layer on each top and bottom surface of a substrate; forming through-holes penetrating the inner conductor layer and the substrate; electrically connecting the inner circuit conductor layer formed on the top surface of the substrate to the inner circuit conductor layer formed on the bottom surface of the substrate through the through-holes; filling the through-holes with a resin; forming an insulating resin layer to cover the inner circuit conductor layer; forming via holes in the insulating resin layer at desired positions on the multi-layered board; dry sandblasting abrasives at least onto a surface of the insulating resin layer; chemically etching the surface of the insulation resin layer; plating a conductive layer on the surface of the insulating resin layer subjected to the chemical etching; and patterning the conductive layer into a desired pattern, thereby forming the multi-layered printed wiring board.
Claim 18
Dependent Claim
20 words
A method according to claim 14, wherein the resin used for filling the through-holes is made from an insulating resin.
Claim 19
Dependent Claim
20 words
A method according to claim 14, wherein the resin used for filling the through-holes is made from a conductive resin.
Claim 20
Dependent Claim
31 words
A method according to claim 14, wherein the dry sandblasting treatment comprises a step of spraying aluminum abrasives onto the surface of the insulating resin layer by a dry spraying method.
Claim 21
Dependent Claim
27 words
A method according to claim 14, wherein the sandblasting treatment comprises a step of spraying abrasives of silicon carbide on the surface of the insulating resin layer.
Claim 22
Dependent Claim
33 words
A method according to claim 14, wherein a cleaning step of removing the abrasives from the surface of the insulating resin layer is performed between the dry sandblasting treatment and the chemical etching.
Claim 23
Dependent Claim
15 words
A method according to claim 19, wherein the cleaning step comprises an ultrasonic cleaning step.
Claim 24
Dependent Claim
33 words
A method according to claim 14, wherein a step of making catalyst particles used for the plating step absorb on the surface of the insulating resin layer is performed after the chemical etching.
Claim 25
Independent Claim
142 words
A method for producing a multi-layer printed wiring board, comprising the steps of: forming a multi-layered board by forming at least one inner circuit conductor layer on a top and bottom surface of a substrate; forming an insulating resin layer to cover the top and bottom surfaces of the multi-layered board; forming via holes in the insulating resin layer at desired positions on the multi-layered board; dry sandblasting abrasives at least onto a surface of the insulating resin layer and the inner faces of the via holes, thereby forming tapers at corners of the via holes; chemically etching the surface of the insulating resin layer; plating a conductive layer on the surface of the insulating resin layer and on the inner faces of the via holes; and patterning the conductive layer into a desired pattern, thereby forming the multi-layered printed wiring board.
Claim 26
Independent Claim
142 words
A method for producing a multi-layer printed wiring board, comprising the steps of: forming a multi-layered board by forming at least one inner circuit conductor layer on a top and bottom surface of a substrate; forming an insulating resin layer to cover the top and bottom surfaces of the multi-layered board; forming via holes in the insulating resin layer at desired positions on the multi-layered board; dry sandblasting abrasives at least onto a surface of the insulating resin layer and the inner faces of the via holes, thereby forming tapers at corners of the via holes; chemically etching the surface of the insulating resin layer; plating a conductive layer on the surface of the insulating resin layer and on the inner faces of the via holes; and patterning the conductive layer into a desired pattern, thereby forming the multi-layered printed wiring board.
Claim 27
Dependent Claim
48 words
A method according to claim 22, wherein the inner faces of the via holes include faces of the insulating resin layer and exposed surfaces of the first circuit conductor layer, the exposed surfaces of the first circuit conductor layer being roughened and cleaned by the dry sandblasting treatment.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-21 | 1999-11-20 | 2000-05-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-21 | 2003-11-20 | 2004-05-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-21 | 2007-11-20 | 2008-05-21 | $7700.00 | Window Closed / Lapsed |